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    • 4. 发明申请
    • METAL CATALYTIC COMPOSITION WITH SILVER-OXIME COMPLEX
    • 金属催化组合物与银 - 氧复合物
    • US20160167021A1
    • 2016-06-16
    • US14571419
    • 2014-12-16
    • Deepak Shukla
    • Deepak Shukla
    • B01J23/50B01J21/18C09D135/02
    • B01J23/50B01J21/18B01J21/185B01J31/0235B01J37/0219B01J37/345C09D135/02C23C18/1879
    • A non-aqueous metal catalytic composition includes (a) a complex of silver and an oxime comprising reducible silver ions in an amount of at least 2 weight %, (b) a silver ion photoreducing composition in an amount of at least 1 weight %, and (c) a photocurable component, a non-curable polymer, or a combination of a photocurable component and a non-curable polymer. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.
    • 非水性金属催化剂组合物包括(a)含有至少2重量%量的可还原银离子的银和肟的配合物,(b)至少1重量%的银离子光还原组合物, 和(c)可光固化组分,不可固化聚合物,或光固化性组分和不可固化聚合物的组合。 该非水金属催化剂组合物可用于在合适的还原条件下原位形成银金属颗粒。 银金属可以以合适的层或图案提供在基底上,然后可随后对其进行化学镀以形成用于各种制品的导电层或图案或用作电子设备中的触摸屏显示器。
    • 5. 发明申请
    • FORMING SILVER CATALYTIC SITES FROM SILVER PHOSPHITE CARBOXYLATES
    • 从银磷酸酯形成银催化场
    • US20160167019A1
    • 2016-06-16
    • US14571375
    • 2014-12-16
    • Deepak ShuklaKevin M. Donovan
    • Deepak ShuklaKevin M. Donovan
    • B01J23/50C09D5/24B01J35/02B01J37/02B01J37/34
    • B01J23/50B01J31/24B01J37/0219B01J37/345C23C18/1879
    • A non-aqueous metal catalytic composition includes (a) a silver carboxylate-trialkyl(triaryl)phosphite complex comprising reducible silver ions in an amount of at least 2 weight %, (b) a silver ion photoreducing composition in an amount of at least 1 weight %, and (c) a photocurable component or a non-curable polymer or a combination of a photocurable component and a non-curable polymer. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.
    • 非水性金属催化剂组合物包括(a)含有至少2重量%量的可还原银离子的羧酸银 - 三烷基(三芳基)亚磷酸酯络合物,(b)银离子光还原组合物的量至少为1 重量%,(c)可光固化成分或非固化性聚合物,或光固化性成分与不可固化聚合物的组合。 该非水金属催化剂组合物可用于在合适的还原条件下原位形成银金属颗粒。 银金属可以以合适的层或图案提供在基底上,然后可随后对其进行化学镀以形成用于各种制品的导电层或图案或用作电子设备中的触摸屏显示器。
    • 8. 发明申请
    • PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS
    • 用于电镀法的光聚合组合物
    • US20150227041A1
    • 2015-08-13
    • US14174879
    • 2014-02-07
    • Deepak ShuklaMark R. Mis
    • Deepak ShuklaMark R. Mis
    • G03F7/038
    • G03F7/038G03F7/0045G03F7/0047G03F7/028
    • A photopolymerizable composition has seven essential components: (a) a photopolymerizable epoxy material, (b) a photoacid generator such as an onium salt, (c) electron acceptor photosensitizer, (d) an electron donor co-initiator having an oxidation potential of 0.1 V to 3 V vs. SCE, (e) metal particles, and in some embodiments, (f) one or more free radically polymerizable compounds, and (g) one or more free radical photoinitiators. This photopolymerizable composition can be applied or printed onto one or both sides of various substrates to form articles that can be used to form electrically conductive materials. Methods for using the photopolymerizable compositions include electroless plating methods that can be carried out in roll-to-roll printing and plating systems once various photocured patterns are formed from the photopolymerizable compositions.
    • 可光聚合组合物具有七个基本组分:(a)光聚合环氧材料,(b)光酸产生剂如鎓盐,(c)电子受体光敏剂,(d)电子给体共引发剂,其氧化电位为0.1 V至3V对SCE,(e)金属颗粒,在一些实施方案中,(f)一种或多种可自由基自由基化合物,和(g)一种或多种自由基光引发剂。 该可光聚合组合物可以施加或印刷在各种基材的一面或两面上,以形成可用于形成导电材料的制品。 使用可光聚合组合物的方法包括一旦从光聚合组合物形成各种光固化图案,可以在辊对印刷和电镀系统中进行的化学镀方法。