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    • 3. 发明申请
    • MICROELECTRONIC DEVICE WITH DISCONNECTED SEMICONDUCTOR PORTIONS AND METHODS OF MAKING SUCH A DEVICE
    • 具有断开的半导体器件的微电子器件及其制造方法
    • US20130056834A1
    • 2013-03-07
    • US13695903
    • 2011-05-03
    • Romain GwozieckiRomain Coppard
    • Romain GwozieckiRomain Coppard
    • H01L27/088H01L21/84
    • H01L51/0508H01L27/28H01L51/0004H01L51/0018H01L51/0541H01L51/0545H01L51/0558
    • A microelectronic device includes a plurality of disconnected similar semiconducting portions, electrically isolated from each other and forming a semiconductor layer, at a spacing by a constant distance and with a shape parallel to the other portions. The microelectronic device also includes two electrodes arranged in contact with the semiconductor layer such that a maximum distance separating the two electrodes is less than the largest dimension of one of the semiconductor portions. The shape and dimensions of the semiconductor portions, the spacing between the semiconductor portions, the shape and dimensions of the electrodes and the layout of the electrodes relative to the semiconductor portions are such that at least one of the semiconductor portions electrically connects the two electrodes to each other. The largest dimensions of the semiconductor portions are perpendicular to the largest dimension of the electrodes, the electrodes being similar.
    • 微电子器件包括多个不连续的类似的半导体部分,它们彼此电隔离并形成半导体层,间隔一定距离并且具有与其它部分平行的形状。 微电子器件还包括与半导体层接触布置的两个电极,使得分离两个电极的最大距离小于半导体部分之一的最大尺寸。 半导体部分的形状和尺寸,半导体部分之间的间隔,电极的形状和尺寸以及电极相对于半导体部分的布局使得至少一个半导体部分将两个电极电连接到 彼此。 半导体部分的最大尺寸垂直于电极的最大尺寸,电极类似。
    • 4. 发明授权
    • Microelectronic device with disconnected semiconductor portions and methods of making such a device
    • 具有半导体部分断开的微电子器件和制造这种器件的方法
    • US08604482B2
    • 2013-12-10
    • US13695903
    • 2011-05-03
    • Romain GwozieckiRomain Coppard
    • Romain GwozieckiRomain Coppard
    • H01L29/04H01L31/036H01L31/0376H01L31/20
    • H01L51/0508H01L27/28H01L51/0004H01L51/0018H01L51/0541H01L51/0545H01L51/0558
    • A microelectronic device includes a plurality of disconnected similar semiconducting portions, electrically isolated from each other and forming a semiconductor layer, at a spacing by a constant distance and with a shape parallel to the other portions. The microelectronic device also includes two electrodes arranged in contact with the semiconductor layer such that a maximum distance separating the two electrodes is less than the largest dimension of one of the semiconductor portions. The shape and dimensions of the semiconductor portions, the spacing between the semiconductor portions, the shape and dimensions of the electrodes and the layout of the electrodes relative to the semiconductor portions are such that at least one of the semiconductor portions electrically connects the two electrodes to each other. The largest dimensions of the semiconductor portions are perpendicular to the largest dimension of the electrodes, the electrodes being similar.
    • 微电子器件包括多个不连续的类似的半导体部分,它们彼此电隔离并形成半导体层,间隔一定距离并且具有与其它部分平行的形状。 微电子器件还包括与半导体层接触布置的两个电极,使得分离两个电极的最大距离小于半导体部分之一的最大尺寸。 半导体部分的形状和尺寸,半导体部分之间的间隔,电极的形状和尺寸以及电极相对于半导体部分的布局使得至少一个半导体部分将两个电极电连接到 彼此。 半导体部分的最大尺寸垂直于电极的最大尺寸,电极类似。