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    • 5. 发明授权
    • Method for designing and making photolithographic reticle, reticle, and photolithographic process
    • 光刻掩模版,光罩和光刻工艺的设计和制造方法
    • US06238824B1
    • 2001-05-29
    • US09386314
    • 1999-08-31
    • John R. FutrellChristophe PierratWilliam Stanton
    • John R. FutrellChristophe PierratWilliam Stanton
    • G03F900
    • G03F9/7003G03F1/36G03F7/70441
    • There are provided methods for making a reticle for use in a photolithography process, comprising generating an first reticle layout having at least one printable reticle feature, generating a modified reticle layout having the first reticle layout and at least one correction area, generating an alignment budget-containing reticle layout having at least one different printable reticle feature and at least one alignment budget border area, and removing from the modified reticle layout any area of overlap between the at least one correction area and the at least one alignment budget border area. There are also provided reticles formed according to such methods. In addition, there are provided computer-implemented methods for designing such a reticle, as well as computer readable storage media, and computer systems for use in making such reticles. In addition, there are provided photolithographic processes using such a reticle.
    • 提供了用于制造用于光刻工艺的掩模版的方法,包括产生具有至少一个可打印掩模版特征的第一掩模布局,产生具有第一掩模版布局的修改的掩模版布局和至少一个校正区域,产生对准预算 具有至少一个不同的可打印标线特征和至少一个对准预算边界区域的标线布局,以及从所述修改的标线布局移除所述至少一个校正区域和所述至少一个对准预算边界区域之间的任何重叠区域。 还提供根据这种方法形成的掩模版。 此外,提供了用于设计这种掩模版的计算机实现的方法以及计算机可读存储介质以及用于制作这种掩模版的计算机系统。 此外,提供了使用这种掩模版的光刻工艺。
    • 10. 发明申请
    • Pattern mask with features to minimize the effect of aberrations
    • 具有特征的图案掩模,以最小化像差的影响
    • US20050003281A1
    • 2005-01-06
    • US10896985
    • 2004-07-23
    • Pary BaluswamyWilliam StantonWilliam Baggenstoss
    • Pary BaluswamyWilliam StantonWilliam Baggenstoss
    • G03F1/00G03F1/26G03F1/36G03F7/20G03C5/00G03F9/00
    • G03F1/36G03F1/26G03F7/70433
    • A semiconductor pattern mask that might otherwise exhibit three-fold symmetry, which could give rise to distorted semiconductor features in the presence of three-leaf aberration in the optical system used to expose a semiconductor wafer through the mask, is altered to break up the three-fold symmetry without altering the semiconductor features that are formed. This accomplished by adding features to the mask that break up the symmetry. One way of achieving that result is to make the added features of “sub-resolution” size that do not produce features on the exposed wafer. Another way of achieving that result is to change existing features that do form structures in such a way (e.g., with optical elements) that changes the relative phase, amplitude or other characteristic of light transmitted through those features.
    • 另外可能会出现三重对称性的半导体图形掩模,其可能在用于通过掩模暴露半导体晶片的光学系统中存在三叶像差的情况下引起失真的半导体特征,以分解三 而不改变所形成的半导体特征。 这通过在面具中添加特征来分解对称性来实现。 实现该结果的一种方式是使得“分辨率”尺寸的附加特征在曝光的晶片上不产生特征。 实现该结果的另一种方式是改变以这样一种方式形成结构的现有特征(例如,利用光学元件),其改变透过这些特征的光的相对相位,幅度或其它特性。