专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060158833A1 Communicating with an electronic module that is slidably mounted in a system 有权
标题翻译：与可滑动地安装在系统中的电子模块通信
公开(公告)号：US20060158833A1
公开(公告)日：2006-07-20
申请号：US11039042
申请日：2005-01-20
申请人： Christian Belady , Eric Peterson
发明人： Christian Belady , Eric Peterson
IPC分类号： H05K5/00
CPC分类号： H05K7/1492 , H05K7/1498
摘要： A system comprises an electronic module slidably mounted in the system, a first assembly including at least one wireless transceiver mounted in the system, and a second assembly including at least one wireless transceiver to communicate wirelessly with the wireless transceiver of the first assembly. The second assembly is attached to the electronic module, and the wireless transceivers of the first and second assemblies continue communicating as the electronic module is slidably moved in the system.
摘要翻译：系统包括可滑动地安装在系统中的电子模块，包括安装在系统中的至少一个无线收发器的第一组件和包括至少一个无线收发器的第二组件，以与第一组件的无线收发器进行无线通信。第二组件附接到电子模块，并且随着电子模块在系统中可滑动地移动，第一组件和第二组件的无线收发器继续通信。

2. 发明申请

US20060025065A1 Enclosures with redundant fans in doors with interlocks 有权
标题翻译：带有冗余风扇的外壳带有联锁门
公开(公告)号：US20060025065A1
公开(公告)日：2006-02-02
申请号：US10900862
申请日：2004-07-27
申请人： Christian Belady , Eric Peterson
发明人： Christian Belady , Eric Peterson
IPC分类号： H05K5/00
CPC分类号： H05K5/0208
摘要： An equipment rack including front and back doors is configured with fans for air cooling enclosed electronic devices in both doors. The fans in each door are sufficient, by themselves, to provide sufficient airflow to cool the electronic devices. The two doors include switches and magnetic interlocks configured such that when one door is opened, the magnetic interlock on the other door is activated preventing both door from being opened at the same time. This ensures that at least one door is always closed while the system is powered up, and since the fans in each door provide sufficient cooling for the equipment rack, the rack is always sufficiently cooled to prevent electronic device failure from overheating.
摘要翻译：包括前门和后门的设备机架配置有用于两个门的空气冷却封闭电子设备的风扇。每个门中的风扇本身足以提供足够的气流来冷却电子设备。这两个门包括开关和磁互锁，其构造使得当一个门打开时，另一个门上的磁互锁被启动，防止两个门同时打开。这确保了在系统通电时至少有一个门总是关闭，并且由于每个门中的风扇为设备机架提供足够的冷却，所以机架总是被充分冷却以防止电子设备故障过热。

3. 发明申请

US20060238984A1 Thermal dissipation device with thermal compound recesses 审中-公开
标题翻译：具有热复合凹槽的散热装置
公开(公告)号：US20060238984A1
公开(公告)日：2006-10-26
申请号：US11110404
申请日：2005-04-20
申请人： Christian Belady , Eric Peterson
发明人： Christian Belady , Eric Peterson
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/367 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems providing a thermal dissipation device with thermal compound recesses. In one embodiment, the thermal dissipation device includes a body with plural recesses formed in a planar surface of the body. The recesses are adapted to receive a thermal compound that conducts heat from an electronic heat generating component to the thermal dissipation device.
摘要翻译：实施例包括提供具有热复合凹槽的散热装置的装置，方法和系统。在一个实施例中，散热装置包括具有形成在主体的平面表面中的多个凹部的主体。凹部适于接收将热从电子发热部件传导到散热装置的热化合物。

4. 发明申请

US20060133042A1 ELECTRONIC MODULE FOR SYSTEM BOARD WITH PASS-THRU HOLES 有权
标题翻译：用于具有通孔的系统板的电子模块
公开(公告)号：US20060133042A1
公开(公告)日：2006-06-22
申请号：US11021527
申请日：2004-12-21
申请人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson , Stuart Haden
发明人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson , Stuart Haden
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , G06F1/189 , G06F1/20 , H01L23/3677 , H01L2924/0002 , H05K1/0204 , H05K1/0263 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.
摘要翻译：实施例包括用于具有至少一个通过孔的系统板的电子模块的装置，方法和系统。可连接到具有通孔的系统板的示例性电子模块包括耦合到系统板的一侧的第一部分。第一部分具有多个处理器的印刷电路板（PCB）。电子模块的第二部分耦合到系统板的第二相对侧。第二部分具有电耦合到第一部分的电力系统板。第二部分还包括延伸穿过系统板的通孔的散热装置。

5. 发明申请

US20060109626A1 Multi-chip module with stacked redundant power 失效
公开(公告)号：US20060109626A1
公开(公告)日：2006-05-25
申请号：US10996478
申请日：2004-11-24
申请人： Shaun Harris , Steven Belson , Eric Peterson , Gary Williams , Christian Belady
发明人： Shaun Harris , Steven Belson , Eric Peterson , Gary Williams , Christian Belady
IPC分类号： H05K7/20
CPC分类号： H05K7/1092 , Y10T307/505
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.

6. 发明申请

US20060086481A1 Heat sink 失效
公开(公告)号：US20060086481A1
公开(公告)日：2006-04-27
申请号：US10976033
申请日：2004-10-27
申请人： Robert Curtis , Brent Boudreaux , Christian Belady , Eric Peterson , Shaun Harris
发明人： Robert Curtis , Brent Boudreaux , Christian Belady , Eric Peterson , Shaun Harris
IPC分类号： H05K7/20
CPC分类号： H05K7/20418
摘要： A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.

7. 发明申请

US20080101025A1 Multi-chip Module with Power System 有权
标题翻译：带电源系统的多芯片模块
公开(公告)号：US20080101025A1
公开(公告)日：2008-05-01
申请号：US11968520
申请日：2008-01-02
申请人： Shaun Harris , Steven Belson , Eric Peterson , Gary Williams , Christian Belady
发明人： Shaun Harris , Steven Belson , Eric Peterson , Gary Williams , Christian Belady
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译：实施例包括具有电力系统的多芯片模块的装置，方法和系统。示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。电力系统耦合到并垂直放置在PCB上方。散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。

8. 发明申请

US20070288813A1 Cell board interconnection architecture with serviceable switch board 审中-公开
标题翻译：电池板互连架构与可维修的开关板
公开(公告)号：US20070288813A1
公开(公告)日：2007-12-13
申请号：US11414852
申请日：2006-05-01
申请人： Christian Belady , Eric Peterson
发明人： Christian Belady , Eric Peterson
IPC分类号： G01R31/28
CPC分类号： G06F1/20
摘要： In certain embodiments, there is provided a computer system and a method for providing a computer system. Specifically, there is provided a computer system that may include a porous main board that is configured to couple to a plurality of switch boards. The porous main board may be configured to conduct air flowing from the front to the back of the computer system and to permit the switch boards to be serviced from the front or back of the computer system. Moreover, in certain embodiments, the switch boards may be hot-swappable.
摘要翻译：在某些实施例中，提供了一种用于提供计算机系统的计算机系统和方法。具体地，提供了一种计算机系统，其可以包括被配置为耦合到多个开关板的多孔主板。多孔主板可以被配置为传导从计算机系统的前部到后部流动的空气，并允许从计算机系统的前部或后部对开关板进行维修。此外，在某些实施例中，开关板可以是热插拔的。

9. 发明申请

US20060133041A1 Processor module for system board 有权
标题翻译：系统板处理器模块
公开(公告)号：US20060133041A1
公开(公告)日：2006-06-22
申请号：US11021504
申请日：2004-12-21
申请人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson
发明人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要翻译：实施例包括用于系统板的处理器模块的装置，方法和系统。在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。散热装置通过热交换从处理器散热。第二部分设置在第一部分和系统板之间产生的空间中。第二部分具有用于向处理器提供电力的电力系统板。电源系统板相邻并平行于PCB的第二侧延伸。

10. 发明申请

US20060133040A1 Multi-chip module with power system and pass-thru holes 有权
标题翻译：带电源系统和通孔的多芯片模块
公开(公告)号：US20060133040A1
公开(公告)日：2006-06-22
申请号：US11021500
申请日：2004-12-21
申请人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson , Stuart Haden
发明人： Christian Belady , Gary Williams , Shaun Harris , Steven Belson , Eric Peterson , Stuart Haden
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K1/0204 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
摘要翻译：实施例包括具有电源系统和通孔的多芯片模块的装置，方法和系统。示例性电子模块包括具有带存储器的第一印刷电路板（PCB）和多个处理器的第一部分。第二部分具有动力系统和散热装置。散热装置具有多个延伸部，电力系统具有多个通过孔。当多个延伸部延伸穿过电力系统的多个通孔并且通过布置在第一和第二部分之间的第二PCB的多个通过孔时，第一部分电耦合到第二部分以形成电子模块。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式