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1. 发明授权

US06908863B2 Sacrificial dielectric planarization layer 失效
标题翻译：牺牲电介质平坦化层
公开(公告)号：US06908863B2
公开(公告)日：2005-06-21
申请号：US10674579
申请日：2003-09-29
申请人： Chris E. Barns , Kevin P. O'Brien , Anne E. Miller
发明人： Chris E. Barns , Kevin P. O'Brien , Anne E. Miller
IPC分类号： H01L21/3105 , H01L21/311 , H01L21/321 , H01L21/4763 , H01L21/768 , H01L21/8238
CPC分类号： H01L21/7684 , H01L21/31053 , H01L21/31144 , H01L21/3212
摘要： A method of forming a microelectronic structure and its associated structures is described. In one embodiment, a substrate is provided with a sacrificial layer disposed on a hard mask layer, and a metal layer disposed in a trench of the substrate and on the sacrificial layer. The metal layer is then removed at a first removal rate wherein a dishing is induced on a top surface of the metal layer until the sacrificial layer is exposed, and simultaneously removing the metal layer and the sacrificial layer at a second removal rate without substantially removing the hard mask.
摘要翻译：描述了形成微电子结构及其相关结构的方法。在一个实施例中，衬底设置有设置在硬掩模层上的牺牲层，以及设置在衬底的沟槽中和牺牲层上的金属层。然后以第一去除速率去除金属层，其中在金属层的顶表面上诱导凹陷，直到牺牲层被暴露，同时以第二移除速率去除金属层和牺牲层，而基本上不去除硬面膜

2. 发明授权

US07109557B2 Sacrificial dielectric planarization layer 失效
标题翻译：牺牲电介质平坦化层
公开(公告)号：US07109557B2
公开(公告)日：2006-09-19
申请号：US10963839
申请日：2004-10-12
申请人： Chris E. Barns , Kevin P. O'Brien , Anne E. Miller
发明人： Chris E. Barns , Kevin P. O'Brien , Anne E. Miller
IPC分类号： H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L21/7684 , H01L21/31053 , H01L21/31144 , H01L21/3212
摘要： A method of forming a microelectronic structure and its associated structures is described. In one embodiment, a substrate is provided with a sacrificial layer disposed on a hard mask layer, and a metal layer disposed in a trench of the substrate and on the sacrificial layer. The metal layer is then removed at a first removal rate wherein a dishing is induced on a top surface of the metal layer until the sacrificial layer is exposed, and simultaneously removing the metal layer and the sacrificial layer at a second removal rate without substantially removing the hard mask.
摘要翻译：描述了形成微电子结构及其相关结构的方法。在一个实施例中，衬底设置有设置在硬掩模层上的牺牲层，以及设置在衬底的沟槽中和牺牲层上的金属层。然后以第一去除速率去除金属层，其中在金属层的顶表面上诱导凹陷，直到牺牲层被暴露，同时以第二移除速率去除金属层和牺牲层，而基本上不去除硬面膜

3. 发明申请

US20170053977A1 VERTICAL MEANDER INDUCTOR FOR SMALL CORE VOLTAGE REGULATORS 审中-公开
标题翻译：用于小型电压稳压器的垂直式电感电感器
公开(公告)号：US20170053977A1
公开(公告)日：2017-02-23
申请号：US15342872
申请日：2016-11-03
申请人： Christopher J. Jezewski , Kevin P. O'Brien
发明人： Christopher J. Jezewski , Kevin P. O'Brien
IPC分类号： H01L49/02 , H01L23/48 , H01L23/522
CPC分类号： H01L28/10 , H01L21/4814 , H01L21/76898 , H01L23/481 , H01L23/5227 , H01L23/645 , H01L2924/0002 , H01L2924/00
摘要： Vertical meander inductors for small core voltage regulators and approaches to fabricating vertical meander inductors for small core voltage regulators are described. For example, a semiconductor die includes a substrate. An integrated circuit is disposed on an active surface of the substrate. An inductor is coupled to the integrated circuit. The inductor is disposed conformal with an insulating layer disposed on an essentially planar surface of the substrate. The insulating layer has an undulating topography.
摘要翻译：描述了用于小型电压调节器的垂直偏转电感器和用于制造小型电压调节器的垂直偏转电感器的方法。例如，半导体管芯包括衬底。集成电路设置在基板的有源表面上。电感器耦合到集成电路。电感器设置成与设置在基板的基本上平坦的表面上的绝缘层共形。绝缘层具有起伏的形貌。

4. 发明申请

US20140084414A1 VERTICAL MEANDER INDUCTOR FOR SMALL CORE VOLTAGE REGULATORS 有权
标题翻译：用于小型电压稳压器的垂直式电感电感器
公开(公告)号：US20140084414A1
公开(公告)日：2014-03-27
申请号：US13629168
申请日：2012-09-27
申请人： Christopher J. Jezewski , Kevin P. O'Brien
发明人： Christopher J. Jezewski , Kevin P. O'Brien
IPC分类号： H01L21/02 , H01L29/66
CPC分类号： H01L28/10 , H01L21/4814 , H01L21/76898 , H01L23/481 , H01L23/5227 , H01L23/645 , H01L2924/0002 , H01L2924/00
摘要： Vertical meander inductors for small core voltage regulators and approaches to fabricating vertical meander inductors for small core voltage regulators are described. For example, a semiconductor die includes a substrate. An integrated circuit is disposed on an active surface of the substrate. An inductor is coupled to the integrated circuit. The inductor is disposed conformal with an insulating layer disposed on an essentially planar surface of the substrate. The insulating layer has an undulating topography.
摘要翻译：描述了用于小型电压调节器的垂直偏转电感器和用于制造小型电压调节器的垂直偏转电感器的方法。例如，半导体管芯包括衬底。集成电路设置在基板的有源表面上。电感器耦合到集成电路。电感器设置成与设置在基板的基本上平坦的表面上的绝缘层共形。绝缘层具有起伏的形貌。

5. 发明申请

US20110260319A1 THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS 有权
标题翻译：三维堆叠基板安装
公开(公告)号：US20110260319A1
公开(公告)日：2011-10-27
申请号：US13103267
申请日：2011-05-09
申请人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
发明人： Shriram Ramanathan , Patrick Morrow , Scott List , Michael Y. Chan , Mauro J. Kobrinsky , Sarah E. Kim , Kevin P. O'Brien , Michael C. Harmes , Thomas Marieb
IPC分类号： H01L23/498
CPC分类号： H01L24/16 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/13099 , H01L2224/13147 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/81894 , H01L2224/81895 , H01L2224/9202 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19041
摘要： Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
摘要翻译：具有可靠接合和衬底保护的三维堆叠衬底布置。

6. 发明授权

US07238604B2 Forming thin hard mask over air gap or porous dielectric 有权
标题翻译：在气隙或多孔电介质上形成薄的硬掩模
公开(公告)号：US07238604B2
公开(公告)日：2007-07-03
申请号：US10422432
申请日：2003-04-24
申请人： Grant M. Kloster , Kevin P. O'Brien , David H. Gracias , Hyun-Mog Park , Vijayakumar S. Ramachandrarao
发明人： Grant M. Kloster , Kevin P. O'Brien , David H. Gracias , Hyun-Mog Park , Vijayakumar S. Ramachandrarao
IPC分类号： H01L21/4763
CPC分类号： H01L21/7682 , H01L21/3105 , H01L21/31058 , H01L21/31144 , H01L21/76801 , H01L21/76808 , H01L21/76825 , H01L21/76826 , H01L21/76831 , H01L21/76835 , H01L21/76885
摘要： A thin hard mask is formed over a semiconductor substrate. The thin hard mask allows diffusion of a sacrificial material or pore-forming agent therethrough to form an underlying air gap or porous dielectric region. The thin hard mask may be a polymer or an initially porous material that may be later densified. The thin hard mask may be used to prevent etch steps used in forming an unlanded via from reaching layers below the hard mask.
摘要翻译：在半导体衬底上形成薄的硬掩模。薄的硬掩模允许牺牲材料或成孔剂通过其扩散以形成下面的气隙或多孔介电区域。薄的硬掩模可以是聚合物或可以稍后致密化的最初多孔材料。可以使用薄的硬掩模来防止用于形成未上空通孔的蚀刻步骤到达硬掩模下方的层。

7. 发明授权

US07119019B2 Capping of copper structures in hydrophobic ILD using aqueous electro-less bath 失效
标题翻译：在疏水性ILD中使用无水电镀浴封闭铜结构
公开(公告)号：US07119019B2
公开(公告)日：2006-10-10
申请号：US10814592
申请日：2004-03-31
申请人： Kevin P. O'Brien , Justin K. Brask
发明人： Kevin P. O'Brien , Justin K. Brask
IPC分类号： H01L21/44 , H01L21/31 , H01L21/469
CPC分类号： H01L21/76849 , C23C18/161 , C23C18/1619 , C23C18/1632 , C23C18/1666 , C23C18/31 , H01L21/288
摘要： Capping of copper structures in hydrophobic interlayer dielectric layer, using aqueous electro-less bath is described herein.
摘要翻译：本文描述了使用水性无电极浴来疏水层间介电层中铜结构的封盖。

8. 发明授权

US07029723B2 Forming chemical vapor depositable low dielectric constant layers 失效
标题翻译：形成化学气相沉积低介电常数层
公开(公告)号：US07029723B2
公开(公告)日：2006-04-18
申请号：US10337524
申请日：2003-01-07
申请人： Tian-An Chen , Robert Meagley , Kevin P. O'Brien , Michael D. Goodner , James Powers
发明人： Tian-An Chen , Robert Meagley , Kevin P. O'Brien , Michael D. Goodner , James Powers
IPC分类号： C23C16/38 , C23C16/28
CPC分类号： H01L21/02126 , C23C16/30 , H01L21/02203 , H01L21/02205 , H01L21/02211 , H01L21/02274 , H01L21/312 , H01L23/5329 , H01L2924/0002 , Y10T428/30 , H01L2924/00
摘要： Carborane may be used as a precursor to form low dielectric constant dielectrics. The carborane material may be modified to enable it to be deposited by chemical vapor deposition.
摘要翻译：碳硼烷可用作前体以形成低介电常数电介质。可以修饰碳硼烷材料以使其能够通过化学气相沉积沉积。

9. 发明授权

US06737365B1 Forming a porous dielectric layer 有权
公开(公告)号：US06737365B1
公开(公告)日：2004-05-18
申请号：US10395447
申请日：2003-03-24
申请人： Grant M. Kloster , Kevin P. O'Brien , Justin K. Brask , Michael D. Goodner , Donald Bruner
发明人： Grant M. Kloster , Kevin P. O'Brien , Justin K. Brask , Michael D. Goodner , Donald Bruner
IPC分类号： H01L2131
CPC分类号： H01L21/02126 , H01L21/02203 , H01L21/02304 , H01L21/02351 , H01L21/31695 , H01L21/7682
摘要： A dielectric layer is made porous by treating the dielectric material after metal interconnects are formed in or through that layer. The porosity lowers the dielectric constant of the dielectric material. The dielectric material may be subjected to an electron beam or a sonication bath to create the pores. The structure has smooth sidewalls for metal interconnects extending through the dielectric layer.

10. 发明授权

US4081182A Ridable recreation device 失效
标题翻译：可玩的娱乐设备
公开(公告)号：US4081182A
公开(公告)日：1978-03-28
申请号：US715393
申请日：1976-08-18
申请人： Kevin P. O'Brien
发明人： Kevin P. O'Brien
IPC分类号： A63B5/16 , A63B5/00
CPC分类号： A63B25/10 , A63B5/166
摘要： A resilient object adapted to be ridden by a person sitting or standing thereon and exerting repeated jumping motions thereagainst. In one embodiment, the device comprises a resilient body member having an upper seat portion and a lower bottom portion, a handle member attached proximate its seat portion, and foot supports extending from either side of its lower portion. The device is ridden by a rider sitting on the seat portion with his legs astraddle the body member, grasping the handle member and exerting repeating jumping motions against the foot supports to bounce the device across the ground. In a second embodiment, the device comprises a horizontally oriented resilient body member having an overall width dimension substantially greater than its heighth dimension, and including a pair of foot supports attached to its upper surface for engaging the feet of a rider standing thereon. This latter device is ridden by a rider standing on the upper surface of the body member, with his feet engaged by the foot supports, and jumping up and down to bounce the device across the ground. In either embodiment, the body member may be filled with a resilient material or be substantially hollow and inflatable. A reinforcing layer of resilient material is provided over the lower surface of the body member to protect it from damage caused by repeated contact with the ground as the device is ridden.
摘要翻译：适合于坐在或站立在其上的人骑行的弹性物体，并在其上施加重复的跳跃运动。在一个实施例中，该装置包括具有上座部分和下底部的弹性本体构件，靠近其座部分附接的把手构件和从其下部的任一侧延伸的脚支撑件。该装置由坐在座椅部分上的骑手骑行，其腿部位于主体构件上，抓握把手构件并且对脚部支撑件施加重复的跳动运动以使装置横穿地面。在第二实施例中，该装置包括具有基本上大于其高度尺寸的总宽度尺寸的水平定向的弹性体构件，并且包括附接到其上表面的一对脚踏支架，用于接合站在其上的骑手的脚。后一种装置由站立在身体构件的上表面上的骑手骑着，其脚与脚部支撑件接合，并且上下跳跃以将装置弹过地面。在任一实施例中，主体构件可以填充有弹性材料或者基本上是中空的和可充气的。弹性材料的增强层设置在主体构件的下表面上，以防止在装置被骑行时与地面反复接触造成的损坏。

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