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1. 发明申请

US20110248398A1 WAFER-LEVEL CHIP-SCALE PACKAGE DEVICE HAVING BUMP ASSEMBLIES CONFIGURED TO MITIGATE FAILURES DUE TO STRESS 有权
标题翻译：具有配置以缓解压力失败的BUG组件的水平尺寸包装设备
公开(公告)号：US20110248398A1
公开(公告)日：2011-10-13
申请号：US12755929
申请日：2010-04-07
申请人： PIROOZ PARVARANDEH , Reynante Alvarado , Chiung C. Lo , Arkadii V. Samoilov
发明人： PIROOZ PARVARANDEH , Reynante Alvarado , Chiung C. Lo , Arkadii V. Samoilov
IPC分类号： H01L23/498 , H01L21/78 , H01L21/60 , H05K1/11
CPC分类号： H01L24/14 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L2224/0345 , H01L2224/0346 , H01L2224/03828 , H01L2224/0401 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/0603 , H01L2224/0613 , H01L2224/11001 , H01L2224/11312 , H01L2224/1132 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/1403 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17517 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/1432 , H01L2924/1436 , H01L2924/3512 , H01L2224/05552
摘要： Wafer-level chip-scale package semiconductor devices are described that have bump assemblies configured to mitigate solder bump failures due to stresses, particularly stresses caused by CTE mismatch during thermal cycling tests, dynamic deformation during drop tests or cyclic bending tests, and so on. In an implementation, the wafer-level chip-scale package devices include an integrated circuit chip having two or more arrays of bump assemblies for mounting the device to a printed circuit board. At least one of the arrays includes bump assemblies that are configured to withstand higher levels of stress than the bump assemblies of the remaining arrays.
摘要翻译：描述了具有凸块组件的晶片级芯片级封装半导体器件，所述凸块组件被配置为减轻由于应力导致的焊料凸块故障，特别是在热循环测试期间由CTE失配引起的应力，跌落测试期间的动态变形或循环弯曲测试等。在一个实现中，晶片级芯片级封装器件包括具有两个或更多个凸块组件阵列的集成电路芯片，用于将器件安装到印刷电路板上。所述阵列中的至少一个包括凸块组件，其被配置为承受比剩余阵列的凸块组件更高的应力水平。

2. 发明授权

US08686560B2 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress 有权
标题翻译：具有凸块组件的晶片级芯片级封装器件被配置为减轻由于应力引起的故障
公开(公告)号：US08686560B2
公开(公告)日：2014-04-01
申请号：US12755929
申请日：2010-04-07
申请人： Pirooz Parvarandeh , Reynante Alvarado , Chiung C. Lo , Arkadii V. Samoilov
发明人： Pirooz Parvarandeh , Reynante Alvarado , Chiung C. Lo , Arkadii V. Samoilov
IPC分类号： H01L23/488
CPC分类号： H01L24/14 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L2224/0345 , H01L2224/0346 , H01L2224/03828 , H01L2224/0401 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/0603 , H01L2224/0613 , H01L2224/11001 , H01L2224/11312 , H01L2224/1132 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/1403 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17517 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/1432 , H01L2924/1436 , H01L2924/3512 , H01L2224/05552
摘要： Wafer-level chip-scale package semiconductor devices are described that have bump assemblies configured to mitigate solder bump failures due to stresses, particularly stresses caused by CTE mismatch during thermal cycling tests, dynamic deformation during drop tests or cyclic bending tests, and so on. In an implementation, the wafer-level chip-scale package devices include an integrated circuit chip having two or more arrays of bump assemblies for mounting the device to a printed circuit board. At least one of the arrays includes bump assemblies that are configured to withstand higher levels of stress than the bump assemblies of the remaining arrays.
摘要翻译：描述了具有凸块组件的晶片级芯片级封装半导体器件，所述凸块组件被配置为减轻由于应力导致的焊料凸块故障，特别是在热循环测试期间由CTE失配引起的应力，跌落测试期间的动态变形或循环弯曲测试等。在一个实现中，晶片级芯片级封装器件包括具有两个或更多个凸块组件阵列的集成电路芯片，用于将器件安装到印刷电路板上。所述阵列中的至少一个包括凸块组件，其被配置为承受比剩余阵列的凸块组件更高的应力水平。

3. 发明授权

US08278748B2 Wafer-level packaged device having self-assembled resilient leads 有权
标题翻译：具有自组装弹性引线的晶圆级封装器件
公开(公告)号：US08278748B2
公开(公告)日：2012-10-02
申请号：US12707239
申请日：2010-02-17
申请人： Chiung C. Lo , Arkadii V. Samoilov , Reynante Alvarado
发明人： Chiung C. Lo , Arkadii V. Samoilov , Reynante Alvarado
IPC分类号： H01L23/52
CPC分类号： H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/64 , H01L24/66 , H01L24/69 , H01L24/81 , H01L24/89 , H01L2224/0401 , H01L2224/06102 , H01L2224/11914 , H01L2224/13099 , H01L2224/131 , H01L2224/1403 , H01L2224/81136 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83194 , H01L2224/83907 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3025
摘要： A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient leads when the resilient leads are in the first position. One or more attachment bumps may also be furnished to facilitate attachment of the device to the printed circuit board.
摘要翻译：描述了晶片级封装半导体器件。在一个实现中，该装置包括设置在集成电路芯片上的一个或多个自组装的弹性引线。每个弹性引线构造成从第一位置移动，其中弹性引线邻近芯片保持，第二位置，其中弹性引线远离芯片延伸以将芯片与印刷电路板互连。当弹性引线处于第一位置时，提供防护件以保护弹性引线。还可以设置一个或多个附接凸块以便于将装置附接到印刷电路板。

4. 发明申请

US20110198745A1 WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS 有权
标题翻译：具有自组装弹性导轨的水平包装装置
公开(公告)号：US20110198745A1
公开(公告)日：2011-08-18
申请号：US12707239
申请日：2010-02-17
申请人： Chiung C. Lo , Arkadii V. Samoilov , Reynante T. Alvarado
发明人： Chiung C. Lo , Arkadii V. Samoilov , Reynante T. Alvarado
IPC分类号： H01L23/498 , H01L21/78
CPC分类号： H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/64 , H01L24/66 , H01L24/69 , H01L24/81 , H01L24/89 , H01L2224/0401 , H01L2224/06102 , H01L2224/11914 , H01L2224/13099 , H01L2224/131 , H01L2224/1403 , H01L2224/81136 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83194 , H01L2224/83907 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3025
摘要： A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient leads when the resilient leads are in the first position. One or more attachment bumps may also be furnished to facilitate attachment of the device to the printed circuit board.
摘要翻译：描述了晶片级封装半导体器件。在一个实现中，该装置包括设置在集成电路芯片上的一个或多个自组装的弹性引线。每个弹性引线构造成从第一位置移动，其中弹性引线邻近芯片保持，第二位置，其中弹性引线远离芯片延伸以将芯片与印刷电路板互连。当弹性引线处于第一位置时，提供防护件以保护弹性引线。还可以设置一个或多个附接凸块以便于将装置附接到印刷电路板。

5. 发明授权

US08947081B2 Micromachined resonant magnetic field sensors 有权
标题翻译：微机械谐振磁场传感器
公开(公告)号：US08947081B2
公开(公告)日：2015-02-03
申请号：US13004383
申请日：2011-01-11
申请人： Joseph Seeger , Chiung C. Lo , Baris Cagdaser , Derek Shaeffer
发明人： Joseph Seeger , Chiung C. Lo , Baris Cagdaser , Derek Shaeffer
IPC分类号： G01R33/02 , G01R33/038 , G01R33/028
CPC分类号： G01R33/038 , G01R33/0286
摘要： A micromachined magnetic field sensor is disclosed. The micromachined magnetic field sensor includes a substrate; and a drive subsystem partially supported by the substrate with a plurality of beams, and at least one anchor; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field vector along a third axis. The micromachined magnetic field sensor also includes a position transducer to detect the motion of the drive subsystem and an electrostatic offset cancellation mechanism coupled to the drive subsystem.
摘要翻译：公开了一种微加工磁场传感器。微加工磁场传感器包括基板; 以及驱动子系统，其由具有多个梁的所述衬底部分地支撑，以及至少一个锚; 用于沿着第一轴线提供穿过所述驱动子系统的电流的机构; 以及响应于沿着第三轴的磁场矢量沿第二轴作用在驱动子系统上的洛伦兹力。微加工磁场传感器还包括位置传感器，用于检测驱动子系统的运动和耦合到驱动子系统的静电偏移消除机构。

6. 发明申请

US20120235670A1 DRIVE SYSTEM FOR MICROMACHINED MAGNETIC FIELD SENSORS 审中-公开
标题翻译：微型磁场传感器的驱动系统
公开(公告)号：US20120235670A1
公开(公告)日：2012-09-20
申请号：US13421545
申请日：2012-03-15
申请人： Baris Cagdaser , Derek Shaeffer , Joe Seeger , Chiung C. Lo
发明人： Baris Cagdaser , Derek Shaeffer , Joe Seeger , Chiung C. Lo
IPC分类号： G01R35/00
CPC分类号： G01R33/028
摘要： Described herein are systems, devices, and methods that provide a stable magnetometer. The magnetometer includes a drive element that facilitates flow of a drive current through a node and a sense element operable to detect a magnetic field operating on the drive current. To reduce offset in the detection of the magnetic field, a voltage detector, electrically coupled to the drive element through the node, determines a variation between a node voltage and a target voltage. The voltage detector facilitates suppression of the variation and thereby minimizes the offset in the sense element.
摘要翻译：这里描述了提供稳定磁力计的系统，装置和方法。磁力计包括驱动元件，其驱动驱动电流流过节点，感测元件可操作以检测在驱动电流上运行的磁场。为了减少磁场检测中的偏移，通过节点电耦合到驱动元件的电压检测器确定节点电压和目标电压之间的变化。电压检测器有助于抑制变化，从而使感测元件中的偏移最小化。

7. 发明授权

US08395381B2 Micromachined magnetic field sensors 有权
标题翻译：微加工磁场传感器
公开(公告)号：US08395381B2
公开(公告)日：2013-03-12
申请号：US12833390
申请日：2010-07-09
申请人： Chiung C. Lo , Joseph Seeger , Martin Lim
发明人： Chiung C. Lo , Joseph Seeger , Martin Lim
IPC分类号： G01R33/02 , G01R33/09 , G01R33/07
CPC分类号： G01R33/0011 , G01R33/07 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology.
摘要翻译：公开了一种与电子器件集成的微加工磁场传感器。磁场传感器利用霍尔效应感测机构实现3轴感测。 Z轴传感器可以在设备层或常规IC基板上制造，具有常规水平霍尔板的设计。 X和Y轴传感器构造在器件层上。在一些实施例中，施加磁通集中器以增强磁场传感器的性能。在一些实施例中，磁场传感器被放置在倾斜侧壁上以实现3轴磁感测系统。在一些实施例中，结合了应力隔离结构以降低传感器偏移。常规IC基板和器件层电连接以形成3轴磁感测系统。磁场传感器也可以与以类似技术构造的运动传感器集成。

8. 发明申请

US20120007597A1 MICROMACHINED OFFSET REDUCTION STRUCTURES FOR MAGNETIC FIELD SENSING 审中-公开
标题翻译：用于磁场感测的MICROMACHINED偏移减少结构
公开(公告)号：US20120007597A1
公开(公告)日：2012-01-12
申请号：US12833622
申请日：2010-07-09
申请人： Joseph Seeger , Chiung C. Lo
发明人： Joseph Seeger , Chiung C. Lo
IPC分类号： G01R33/02
CPC分类号： G01R33/07 , G01R33/0011
摘要： A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology.
摘要翻译：公开了一种与电子器件集成的微加工磁场传感器。磁场传感器利用霍尔效应感测机构实现3轴感测。 Z轴传感器可以在设备层或常规IC基板上制造，具有常规水平霍尔板的设计。 X和Y轴传感器构造在器件层上。在一些实施例中，施加磁通集中器以增强磁场传感器的性能。在一些实施例中，磁场传感器被放置在倾斜侧壁上以实现3轴磁感测系统。在一些实施例中，结合了应力隔离结构以降低传感器偏移。常规IC基板和器件层电连接以形成3轴磁感测系统。磁场传感器也可以与以类似技术构造的运动传感器集成。

9. 发明授权

US08860409B2 Micromachined resonant magnetic field sensors 有权
标题翻译：微机械谐振磁场传感器
公开(公告)号：US08860409B2
公开(公告)日：2014-10-14
申请号：US13004365
申请日：2011-01-11
申请人： Joseph Seeger , Chiung C. Lo , Baris Cagdaser , Derek Shaeffer
发明人： Joseph Seeger , Chiung C. Lo , Baris Cagdaser , Derek Shaeffer
IPC分类号： G01R33/02 , G01R33/028 , G01R33/038
CPC分类号： G01R33/038 , G01R33/0286
摘要： A micromachined magnetic field sensor is disclosed. The micromachined magnetic field comprises a substrate; a drive subsystem, the drive subsystem comprises a plurality of beams, and at least one anchor connected to the substrate; a mechanism for providing an electrical current through the drive subsystem along a first axis; and Lorentz force acting on the drive subsystem along a second axis in response to a magnetic field along a third axis. The micromachined magnetic field sensor also includes a sense subsystem, the sense subsystem includes a plurality of beams, and at least one anchor connected to the substrate; wherein a portion of the sense subsystem moves along a fourth axis; a coupling spring between the drive subsystem and the sense subsystem which causes motion of the sense subsystem in response to the magnetic field; and a position transducer to detect the motion of the sense subsystem.
摘要翻译：公开了一种微加工磁场传感器。微加工磁场包括基片; 驱动子系统，所述驱动子系统包括多个梁，以及连接到所述基板的至少一个锚固件; 用于沿着第一轴线提供穿过所述驱动子系统的电流的机构; 以及响应于沿着第三轴的磁场沿第二轴作用在驱动子系统上的洛伦兹力。微加工磁场传感器还包括感测子系统，感测子系统包括多个光束，以及至少一个连接到衬底的锚; 其中所述感测子系统的一部分沿着第四轴线移动; 驱动子系统和感测子系统之间的耦合弹簧，其引起感测子系统响应于磁场的运动; 以及用于检测感测子系统的运动的位置传感器。

10. 发明授权

US08567246B2 Integrated MEMS device and method of use 有权
标题翻译：集成MEMS器件及其使用方法
公开(公告)号：US08567246B2
公开(公告)日：2013-10-29
申请号：US12979960
申请日：2010-12-28
申请人： Derek Shaeffer , Baris Cagdaser , Chiung C. Lo , Joseph Seeger
发明人： Derek Shaeffer , Baris Cagdaser , Chiung C. Lo , Joseph Seeger
IPC分类号： G01C19/56
CPC分类号： G01R33/0286 , H03H3/0073
摘要： An integrated MEMS device is disclosed. The system comprises a MEMS resonator; and a MEMS device coupled to a MEMS resonator. The MEMS resonator and MEMS device are fabricated on a common substrate so that certain characteristics of the MEM resonator and MEMS device track each other as operating conditions vary.
摘要翻译：公开了集成的MEMS器件。该系统包括MEMS谐振器; 以及耦合到MEMS谐振器的MEMS器件。 MEMS谐振器和MEMS器件制造在公共衬底上，使得MEM谐振器和MEMS器件的某些特性在操作条件变化时彼此跟踪。

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