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1. 发明授权

US07277242B1 Lens module 失效
标题翻译：镜头模块
公开(公告)号：US07277242B1
公开(公告)日：2007-10-02
申请号：US11723180
申请日：2007-03-16
申请人： Ching-Shun Wang , Chun-Hua Hsia , Yu-Heng Liu , Yang-Kai Wang , Kuang-Yau Teng , Miy-Chung Wang
发明人： Ching-Shun Wang , Chun-Hua Hsia , Yu-Heng Liu , Yang-Kai Wang , Kuang-Yau Teng , Miy-Chung Wang
IPC分类号： G02B7/02 , G02B27/00
CPC分类号： G02B7/02 , H04N5/2253 , H04N5/2257
摘要： A lens module includes a lens seat, an image sensor unit, a lens set, a circuit board, and a resilient interposer. The lens seat includes a top wall that is formed with a barrel hole, a side wall that extends from a periphery of the top wall and that cooperates with the top wall to define a chamber, and a lens barrel. The lens barrel has a first barrel portion disposed in the chamber and a second barrel portion extending from the first barrel portion and passing through the barrel hole in the top wall. The image sensor unit and the lens set are disposed in the first and second barrel portions of the lens barrel, respectively. The circuit board is disposed to cover an open side of the lens seat, and is connected electrically to the image sensor unit via the resilient interposer.
摘要翻译：透镜模块包括透镜座，图像传感器单元，透镜组，电路板和弹性插入器。透镜座包括形成有筒孔的顶壁，从顶壁的周边延伸并与顶壁配合以限定室的侧壁和透镜镜筒。透镜镜筒具有设置在腔室中的第一镜筒部分和从第一镜筒部分延伸并穿过顶壁中的镜筒孔的第二镜筒部分。图像传感器单元和透镜组分别设置在镜筒的第一和第二镜筒部分中。电路板被设置为覆盖透镜座的敞开侧，并且经由弹性插入件与图像传感器单元电连接。

2. 发明申请

US20080142965A1 Chip package 审中-公开
标题翻译：芯片封装
公开(公告)号：US20080142965A1
公开(公告)日：2008-06-19
申请号：US11785195
申请日：2007-04-16
申请人： Ching-Shun Wang , Chun-Hua Hsia , Yu-Heng Liu , Yang-Kai Wang , Kuang-Yau Teng , Ming-Chung Wang
发明人： Ching-Shun Wang , Chun-Hua Hsia , Yu-Heng Liu , Yang-Kai Wang , Kuang-Yau Teng , Ming-Chung Wang
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , H01L2224/16225 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A chip package includes: a circuit board formed with conductive traces; a semiconductor chip formed with conductive pads; a bridging member sandwiched between the circuit board and the semiconductor chip and including an elastic dielectric body and spaced apart flexible conductive lines, each of which extends through the elastic dielectric body to contact a respective one of the conductive traces of the circuit board and a respective one of the conductive pads of the semiconductor chip; and a holding member pressing the semiconductor chip against the elastic dielectric body so as to result in pressing action of the elastic dielectric body against the circuit board.
摘要翻译：芯片封装包括：形成有导电迹线的电路板; 形成有导电焊盘的半导体芯片; 夹在所述电路板和所述半导体芯片之间并且包括弹性介电体和间隔开的柔性导电线的桥接构件，每个所述桥接构件延伸穿过所述弹性介电体以接触所述电路板的相应导电迹线和相应的半导体芯片的导电焊盘之一; 以及保持构件，将半导体芯片压靠在弹性介电体上，以使弹性介电体抵抗电路板的压力。

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