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    • 1. 发明申请
    • NON-VOLATILE MEMORY WITH A STABLE THRESHOLD VOLTAGE ON SOI SUBSTRATE
    • 在SOI衬底上具有稳定阈值电压的非易失性存储器
    • US20110057243A1
    • 2011-03-10
    • US12943945
    • 2010-11-11
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • H01L27/12
    • H01L27/115
    • A non-volatile memory disposed in a SOI substrate is provided. The non-volatile memory includes a memory cell and a first conductive type doped region. The memory cell includes a gate, a charge storage structure, a bottom dielectric layer, a second conductive type drain region, and a second conductive type source region. The gate is disposed on the SOI substrate. The charge storage structure is disposed between the gate and the SOI substrate. The bottom dielectric layer is disposed between the charge storage layer and the SOI substrate. The second conductive type drain region and the second conductive type source region are disposed in a first conductive type silicon body layer next to the two sides of the gate. The first conductive type doped region is disposed in the first conductive type silicon body layer and electrically connected to the first conductive type silicon body layer beneath the gate.
    • 设置在SOI衬底中的非易失性存储器。 非易失性存储器包括存储单元和第一导电类型掺杂区域。 存储单元包括栅极,电荷存储结构,底部电介质层,第二导电类型漏极区域和第二导电型源极区域。 栅极设置在SOI衬底上。 电荷存储结构设置在栅极和SOI衬底之间。 底部电介质层设置在电荷存储层和SOI衬底之间。 第二导电型漏极区域和第二导电型源极区域设置在栅极的两侧旁边的第一导电型硅体层中。 第一导电型掺杂区域设置在第一导电型硅体层中,并且与栅极下方的第一导电型硅体层电连接。
    • 3. 发明授权
    • Non-volatile memory with a stable threshold voltage on SOI substrate
    • 在SOI衬底上具有稳定阈值电压的非易失性存储器
    • US07855417B2
    • 2010-12-21
    • US11833235
    • 2007-08-03
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • H01L29/786H01L29/792
    • H01L27/115
    • A non-volatile memory disposed in a SOI substrate is provided. The non-volatile memory includes a memory cell and a first conductive type doped region. The memory cell includes a gate, a charge storage structure, a bottom dielectric layer, a second conductive type drain region, and a second conductive type source region. The gate is disposed on the SOI substrate. The charge storage structure is disposed between the gate and the SOI substrate. The bottom dielectric layer is disposed between the charge storage layer and the SOI substrate. The second conductive type drain region and the second conductive type source region are disposed in a first conductive type silicon body layer next to the two sides of the gate. The first conductive type doped region is disposed in the first conductive type silicon body layer and electrically connected to the conductive type silicon body layer beneath the gate.
    • 设置在SOI衬底中的非易失性存储器。 非易失性存储器包括存储单元和第一导电类型掺杂区域。 存储单元包括栅极,电荷存储结构,底部电介质层,第二导电类型漏极区域和第二导电型源极区域。 栅极设置在SOI衬底上。 电荷存储结构设置在栅极和SOI衬底之间。 底部电介质层设置在电荷存储层和SOI衬底之间。 第二导电型漏极区域和第二导电型源极区域设置在栅极的两侧旁边的第一导电型硅体层中。 第一导电型掺杂区域设置在第一导电型硅体层中,并且电连接到栅极下方的导电型硅体层。
    • 4. 发明申请
    • NON-VOLATILE MEMORY AND OPERATING METHOD THEREOF
    • 非易失性存储器及其操作方法
    • US20080031038A1
    • 2008-02-07
    • US11833235
    • 2007-08-03
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • G11C11/34H01L29/792
    • H01L27/115
    • A non-volatile memory disposed in a SOI substrate is provided. The non-volatile memory includes a memory cell and a first conductive type doped region. The memory cell includes a gate, a charge storage structure, a bottom dielectric layer, a second conductive type drain region, and a second conductive type source region. The gate is disposed on the SOI substrate. The charge storage structure is disposed between the gate and the SOI substrate. The bottom dielectric layer is disposed between the charge storage layer and the SOI substrate. The second conductive type drain region and the second conductive type source region are disposed in a first conductive type silicon body layer next to the two sides of the gate. The first conductive type doped region is disposed in the first conductive type silicon body layer and electrically connected to the first conductive type silicon body layer beneath the gate.
    • 设置在SOI衬底中的非易失性存储器。 非易失性存储器包括存储单元和第一导电类型掺杂区域。 存储单元包括栅极,电荷存储结构,底部电介质层,第二导电类型漏极区域和第二导电型源极区域。 栅极设置在SOI衬底上。 电荷存储结构设置在栅极和SOI衬底之间。 底部电介质层设置在电荷存储层和SOI衬底之间。 第二导电型漏极区域和第二导电型源极区域设置在栅极的两侧旁边的第一导电型硅体层中。 第一导电型掺杂区域设置在第一导电型硅体层中,并且与栅极下方的第一导电型硅体层电连接。
    • 7. 发明授权
    • Operating method of non-volatile memory
    • 非易失性存储器的操作方法
    • US07903472B2
    • 2011-03-08
    • US12565778
    • 2009-09-24
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • G11C11/34
    • H01L27/115
    • An operating method of a non-volatile memory adapted for a non-volatile memory disposed on an SOI substrate including a first conductive type silicon body layer is provided. The non-volatile memory includes a gate, a charge storage structure, a second conductive type drain region, and a second conductive type source region. In operating such a non-volatile memory, voltages are applied to the gate, the second conductive type drain region, the second conductive type source region and the first conductive type silicon body layer beneath the gate, to inject electrons or holes in to the charge storage structure or evacuate the electrons from the charge storage structure by a method selected from a group consisting of channel hot carrier injection, source side injection, band-to-band tunnelling hot carrier injection and Fowler-Nordheim (F-N) tunnelling.
    • 提供了适用于设置在包括第一导电型硅体层的SOI衬底上的非易失性存储器的非易失性存储器的操作方法。 非易失性存储器包括栅极,电荷存储结构,第二导电类型漏极区域和第二导电型源极区域。 在操作这种非易失性存储器时,电压施加到门下方的栅极,第二导电型漏极区域,第二导电型源极区域和第一导电型硅体层,以将电荷或空穴注入电荷 通过选自由通道热载流子注入,源侧注入,带对带隧穿热载流子注入和Fowler-Nordheim(FN)隧道的组中选择的方法,从电荷存储结构排出电子。
    • 9. 发明申请
    • OPERATING METHOD OF NON-VOLATILE MEMORY
    • 非易失性存储器的操作方法
    • US20100014359A1
    • 2010-01-21
    • US12565778
    • 2009-09-24
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • Hsin-Ming ChenHai-Ming LeeShih-Jye ShenChing-Hsiang Hsu
    • G11C16/04G11C11/34
    • H01L27/115
    • An operating method of a non-volatile memory adapted for a non-volatile memory disposed on an SOI substrate including a first conductive type silicon body layer is provided. The non-volatile memory includes a gate, a charge storage structure, a second conductive type drain region, and a second conductive type source region. In operating such a non-volatile memory, voltages are applied to the gate, the second conductive type drain region, the second conductive type source region and the first conductive type silicon body layer beneath the gate, to inject electrons or holes in to the charge storage structure or evacuate the electrons from the charge storage structure by a method selected from a group consisting of channel hot carrier injection, source side injection, band-to-band tunnelling hot carrier injection and Fowler-Nordheim (F-N) tunnelling.
    • 提供了适用于设置在包括第一导电型硅体层的SOI衬底上的非易失性存储器的非易失性存储器的操作方法。 非易失性存储器包括栅极,电荷存储结构,第二导电类型漏极区域和第二导电型源极区域。 在操作这种非易失性存储器时,电压施加到门下方的栅极,第二导电型漏极区域,第二导电型源极区域和第一导电型硅体层,以将电荷或空穴注入电荷 通过选自由通道热载流子注入,源侧注入,带对带隧穿热载流子注入和Fowler-Nordheim(FN)隧道的组中选择的方法,从电荷存储结构排出电子。