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1. 发明申请

US20130207128A1 LIGHT-EMITTING DIODE LIGHT MODULE FREE OF JUMPER WIRES 失效
标题翻译：发光二极管光模块，无需跳线
公开(公告)号：US20130207128A1
公开(公告)日：2013-08-15
申请号：US13371993
申请日：2012-02-13
申请人： Chin-Lung LIN , Yen-Chang TU , Pai-Ti LIN , Che-Chang HU
发明人： Chin-Lung LIN , Yen-Chang TU , Pai-Ti LIN , Che-Chang HU
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , H01L33/52 , H01L2924/0002 , H01L2924/00
摘要： An LED light module free of jumper wires has a substrate and multiple LED chips. The substrate has a positive side circuit, a negative side circuit, multiple first chip connection portions and multiple second connection portions. The first and second chip connection portions are respectively connected to the positive and negative side circuits, and are juxtaposedly and alternately arranged on the substrate so that a width between each first chip connection portion and a corresponding second chip connection portion is smaller than a width of each LED chip. Each LED chip can be directly mounted on corresponding first and second chip connection portions to electrically connect to the positive and negative side circuits. Accordingly, jumper wires for connecting the LED chips and the positive and negative side circuits can be removed to avoid broken jumper wires occurring when the LED light module is shipped or assembled.
摘要翻译：没有跳线的LED灯模块有一个基板和多个LED芯片。基板具有正侧电路，负侧电路，多个第一芯片连接部分和多个第二连接部分。第一和第二芯片连接部分分别连接到正侧电路和负侧电路，并且并置并交替地布置在基板上，使得每个第一芯片连接部分和相应的第二芯片连接部分之间的宽度小于每个LED芯片。每个LED芯片可以直接安装在相应的第一和第二芯片连接部分上，以电连接到正极和负极侧电路。因此，可以去除用于连接LED芯片和正极侧和负极侧电路的跨接线，以避免当LED灯模块运输或组装时发生跳线断线。

2. 发明申请

US20130207129A1 Light-Emitting Diode Area Light Module and Method for Packaging the Same 审中-公开
标题翻译：发光二极管区域灯模块及其包装方法
公开(公告)号：US20130207129A1
公开(公告)日：2013-08-15
申请号：US13372432
申请日：2012-02-13
申请人： Chin-Lung LIN , Yen-Chang TU , Pai-Ti LIN , Che-Chang HU
发明人： Chin-Lung LIN , Yen-Chang TU , Pai-Ti LIN , Che-Chang HU
IPC分类号： H01L33/48 , B23K31/02
CPC分类号： B23K1/0016 , B23K2101/42 , H01L25/0753 , H01L33/52 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/0002 , H01L2924/00014
摘要： An LED area light module has a substrate and a circuit layer and a solder mask layer formed on the substrate. The solder mask layer partially covers the circuit layer for the partially exposed circuit layer to form multiple electrical contacts. An embankment wall is formed on the solder mask layer with a solder mask material for the electrical contacts to be located within the embankment wall. Multiple LED chips are mounted on the solder mask layer within the embankment wall and electrically connected to the electrical contacts. Optically-transmissive adhesive is filled and concentrated within the embankment wall and covers the LED chips by a tension force thereof, and forms an optically-transmissive adhesive layer after congealed. Accordingly, the LED area light module eliminates the use of thick frame made of metal or rubber and steps of manufacturing and mounting the frame to simplify the packaging processes.
摘要翻译： LED区域光模块具有基板和形成在基板上的电路层和焊接掩模层。焊接掩模层部分地覆盖用于部分暴露的电路层的电路层以形成多个电触点。在焊接掩模层上形成有一个路堤，其中一个焊接掩模材料用于电触点位于路堤内。多个LED芯片安装在路堤内的焊接掩模层上并电连接到电触头。透光性粘合剂被填充并集中在路堤内并且通过其张力覆盖LED芯片，并且在凝结之后形成透光性粘合剂层。因此，LED区域灯模块消除了使用由金属或橡胶制成的厚框架以及制造和安装框架以简化包装过程的步骤。

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