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    • 5. 发明申请
    • METHOD FOR CONCURRENT MIGRATION AND DECOMPOSITION OF INTEGRATED CIRCUIT LAYOUT
    • 用于集成电路布局的同时移动和分解的方法
    • US20110004858A1
    • 2011-01-06
    • US12550484
    • 2009-08-31
    • Yao-Wen ChangChin-Hsiung Hsu
    • Yao-Wen ChangChin-Hsiung Hsu
    • G06F17/50
    • G06F17/5068
    • A method for concurrent migration and decomposition of an integrated circuit layout applicable to double patterning lithography techniques is provided. The method includes cutting a sub-pattern of an initial pattern to configure a potentially conflicting pattern having separate or cutting sections; removing odd cycles in the potential conflicting pattern so as to cut the separate or cutting sections; configuring the double patterning constraint based upon corresponding location relations between each and adjacent cut sections; and assigning a first color layer or a second color layer to the cut sections according to the double patterning constraint to obtain a final layout pattern. Therefore, disadvantageous factors and patterning conflicts caused by separate processes as encountered in the prior art are avoided.
    • 提供了一种用于并行迁移和分解适用于双重图案化光刻技术的集成电路布局的方法。 该方法包括切割初始图案的子图案以配置具有分离或切割部分的潜在冲突图案; 去除潜在的冲突图案中的奇数循环,从而切割单独或切割部分; 基于每个相邻切割部分之间的相应位置关系来配置双重图案化约束; 以及根据双重图案化约束将切割部分分配第一颜色层或第二颜色层以获得最终布局图案。 因此,避免了由现有技术中遇到的单独处理引起的不利因素和图案化冲突。