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    • 2. 发明授权
    • Sensing apparatus
    • 传感装置
    • US08904868B2
    • 2014-12-09
    • US13458359
    • 2012-04-27
    • Chih-Wei HuangChieh-Pin ChangJa-Hao ChenChuan-Jane ChaoYing-Zong JuangShyh-Chyi WongYeong-Her Wang
    • Chih-Wei HuangChieh-Pin ChangJa-Hao ChenChuan-Jane ChaoYing-Zong JuangShyh-Chyi WongYeong-Her Wang
    • G01P15/125G01P15/08
    • G01P15/125G01P2015/0814
    • A sensing apparatus includes an acceleration sensing unit, for measuring an acceleration applied to a proof mass, further including: a proof mass; a carrier signal source, for providing a carrier signal; a capacitive half-bridge, including a first and a second capacitor, wherein each capacitor is coupled to the proof mass and the carrier signal source, one with a positive electrode and the other one with a negative electrode, and the acceleration applied to the proof mass makes the carrier signal flow through the first and the second capacitor so that the first capacitor and the second capacitor respectively generates a first voltage and a second voltage variation which have opposite phases with each other; and an instrumentation amplifier, for receiving and amplifying the first voltage and the second voltage variation, whereby the magnitude and the direction of the acceleration applied to the proof mass is determined.
    • 感测装置包括加速度检测单元,用于测量施加到检验质量块的加速度,还包括:检验质量块; 载波信号源,用于提供载波信号; 包括第一和第二电容器的电容半桥,其中每个电容器耦合到检测质量块和载波信号源,一个具有正电极,另一个与负电极耦合,并且加速度应用于证明 质量使载体信号流过第一和第二电容器,使得第一电容器和第二电容器分别产生彼此具有相反相位的第一电压和第二电压变化; 以及用于接收和放大第一电压和第二电压变化的仪表放大器,由此确定施加到检验质量块的加速度的大小和方向。
    • 3. 发明授权
    • Adaptive bias circuit and system thereof
    • 自适应偏置电路及其系统
    • US08026767B2
    • 2011-09-27
    • US12545084
    • 2009-08-21
    • Chih-Wei ChenChuan-Jane ChaoShyh-Chyi Wong
    • Chih-Wei ChenChuan-Jane ChaoShyh-Chyi Wong
    • H03F3/04
    • H03F1/0266H03F1/56H03F3/195H03F3/245H03F2200/108H03F2200/222H03F2200/387H03F2200/451H03F2200/555
    • An adaptive bias circuit which provides a more sensitive adaptive bias current with respect to power level is used for biasing an electronic circuit. The adaptive bias circuit has a first transistor coupled to a power supply, a voltage bias circuit coupled to the first transistor and the power supply biasing the first transistor, and a first power coupling module coupled to the first transistor and the electronic circuit for coupling a portion of input signal power to the first transistor. A second transistor is coupled to the first transistor and the power supply to increase the current gain of the adaptive bias circuit, and a second current coupling module is coupled to the second transistor and the electronic circuit to provide adaptive bias current to the electronic circuit.
    • 使用相对于功率电平提供更灵敏的自适应偏置电流的自适应偏置电路用于偏置电子电路。 自适应偏置电路具有耦合到电源的第一晶体管,耦合到第一晶体管的电压偏置电路和偏置第一晶体管的电源,以及耦合到第一晶体管和电子电路的第一功率耦合模块,用于耦合 输入信号功率的一部分到第一晶体管。 第二晶体管耦合到第一晶体管和电源以增加自适应偏置电路的电流增益,并且第二电流耦合模块耦合到第二晶体管和电子电路以向电子电路提供自适应偏置电流。
    • 5. 发明授权
    • High-efficiency single to differential amplifier
    • 高效单差分放大器
    • US07692493B1
    • 2010-04-06
    • US12356537
    • 2009-01-21
    • Chih-Wei ChenChuan-Jane ChaoShyh-Chyi Wong
    • Chih-Wei ChenChuan-Jane ChaoShyh-Chyi Wong
    • H03F3/04
    • H03F3/191H03F1/0261H03F3/45085H03F3/45098H03F2203/45166
    • A high-efficiency single-to-differential amplifier has a first transistor acting as a first amplification stage. A second transistor, a third transistor, a first choke, a second choke, and a first capacitor form a second single-to-differential amplification stage. The first amplification stage receives and amplifies an input signal, outputs the amplified signal to the second single-to-differential amplification stage through a coupling module, and concurrently provides DC bias current to the second single-to-differential amplification stage through a tank. The second single-to-differential amplification stage reuses DC current of the first amplification stage, amplifies the output signal of the first amplification stage, and transfers it to a differential output.
    • 高效率的单对差分放大器具有作为第一放大级的第一晶体管。 第二晶体管,第三晶体管,第一扼流圈,第二扼流圈和第一电容器形成第二单差放大级。 第一放大级接收并放大输入信号,通过耦合模块将放大的信号输出到第二单差分放大级,并通过一个容器向第二单差放大级提供DC偏置电流。 第二单差分放大级重新利用第一放大级的直流电流,放大第一放大级的输出信号,并将其传送到差分输出。
    • 6. 发明授权
    • Method and test structures for measuring interconnect coupling capacitance in an IC chip
    • 用于测量IC芯片中互连耦合电容的方法和测试结构
    • US06870387B2
    • 2005-03-22
    • US10699830
    • 2003-11-04
    • Kai-Ye HuangChuan-Jane Chao
    • Kai-Ye HuangChuan-Jane Chao
    • G01R31/28G01R31/26
    • G01R31/2884G01R31/2853
    • Measurement method and test structures for measuring interconnect coupling capacitance in an IC chip are provided. This method employs CBCM technique. In the first step, two test structures are used to measure a target configuration in order to obtain the total capacitance C of a metal line with respect to ground including line-to-line, fringe and area components (C=2Cc+2Cf+Ca). In the second step, two other test structures are used to measure a dummy configuration in order to obtain the area and fringe capacitance Cdummy of the metal line with respect to ground including fringe and area components (Cdummy=2Cf+Ca). After the two steps, the coupling capacitance Cc between the metal line and another line can be determined according to the formula Cc=(C−Cdummy)/2.
    • 提供了用于测量IC芯片中的互连耦合电容的测量方法和测试结构。 该方法采用CBCM技术。 在第一步中,使用两个测试结构来测量目标结构,以获得金属线相对于包括线对线,边缘和面积分量的金属线的总电容C(C = 2Cc + 2Cf + Ca )。 在第二步中,为了获得金属线相对于包括边缘和面积分量(Cdummy = 2Cf + Ca)的地面的金属线的面积和边缘电容Cdummy,使用另外两个测试结构来测量虚拟配置。 在两步之后,可以根据公式Cc =(C-Cdummy)/ 2来确定金属线与另一条线之间的耦合电容Cc。
    • 7. 发明申请
    • Method and test structures for measuring interconnect coupling capacitance in an IC chip
    • 用于测量IC芯片中互连耦合电容的方法和测试结构
    • US20050024077A1
    • 2005-02-03
    • US10699830
    • 2003-11-04
    • Kai-Ye HuangChuan-Jane Chao
    • Kai-Ye HuangChuan-Jane Chao
    • G01R31/28G01R31/26
    • G01R31/2884G01R31/2853
    • Measurement method and test structures for measuring interconnect coupling capacitance in an IC chip are provided. This method employs CBCM technique. In the first step, two test structures are used to measure a target configuration in order to obtain the total capacitance C of a metal line with respect to ground including line-to-line, fringe and area components(C=2Cc+2Cf+Ca). In the second step, two other test structures are used to measure a dummy configuration in order to obtain the area and fringe capacitance Cdummy of the metal line with respect to ground including fringe and area components (Cdummy=2Cf+Ca). After the two steps, the coupling capacitance Cc between the metal line and another line can be determined according to the formula Cc=(C-Cdummy)/2.
    • 提供了用于测量IC芯片中的互连耦合电容的测量方法和测试结构。 该方法采用CBCM技术。 在第一步中,使用两个测试结构来测量目标结构,以获得金属线相对于包括线对线,边缘和面积分量的金属线的总电容C(C = 2Cc + 2Cf + Ca )。 在第二步中,为了获得金属线相对于包括边缘和面积分量(Cdummy = 2Cf + Ca)的地面的面积和边缘电容Cdummy,使用另外两个测试结构来测量虚拟配置。 在两步之后,可以根据公式Cc =(C-Cdummy)/ 2来确定金属线与另一条线之间的耦合电容Cc。