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1. 发明申请

US20110114371A1 COMPOSITE DOUBLE-SIDED COPPER FOIL SUBSTRATES AND FLEXIBLE PRINTED CIRCUIT BOARD STRUCTURES USING THE SAME 有权
标题翻译：复合双面铜箔基板和使用其的柔性印刷电路板结构
公开(公告)号：US20110114371A1
公开(公告)日：2011-05-19
申请号：US12915467
申请日：2010-10-29
申请人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
发明人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
IPC分类号： H05K1/00 , B32B3/02
CPC分类号： H05K3/386 , B32B7/12 , B32B15/08 , B32B15/20 , B32B2457/08 , H05K1/028 , H05K1/0346 , H05K1/0393 , H05K2201/0154 , H05K2201/0195 , H05K2201/0355
摘要： A double-sided copper foil substrate, which comprises: a polymer layer; a first copper foil; an adhesive layer formed on the polymer layer such that the polymer layer is sandwiched between the adhesive layer and the first copper layer; and a second copper foil causing the adhesive layer to be sandwiched between the second copper foil and the polymer layer, wherein the polymer layer and the adhesive layer have a total thickness of from 12 to 25 μm. The present invention further provides a flexible printed circuit board structure utilizing the composite double-sided copper foil substrate of the present invention, wherein the second double-sided copper foil substrate has a trench for exposing a portion of the adhesive layer. The double-sided copper foil substrate of the present invention are lower in rebound and satisfying the demand for the greater number of bending and sliding cycles under a lower R angle, and particularly is suitable for thin and flexible electronic products.
摘要翻译：一种双面铜箔衬底，其包括：聚合物层; 第一个铜箔; 形成在所述聚合物层上的粘合剂层，使得所述聚合物层夹在所述粘合剂层和所述第一铜层之间; 以及使所述粘合剂层夹在所述第二铜箔和所述聚合物层之间的第二铜箔，其中所述聚合物层和所述粘合剂层的总厚度为12〜25μm。本发明还提供了利用本发明的复合双面铜箔基板的柔性印刷电路板结构，其中第二双面铜箔基板具有用于暴露粘合层的一部分的沟槽。本发明的双面铜箔基板的回弹率较低，并且在较低的R角下满足对较大数量的弯曲和滑动循环的需求，特别适用于薄而柔性的电子产品。

2. 发明授权

US08536460B2 Composite double-sided copper foil substrates and flexible printed circuit board structures using the same 有权
标题翻译：复合双面铜箔基板和使用其的柔性印刷电路板结构
公开(公告)号：US08536460B2
公开(公告)日：2013-09-17
申请号：US12915467
申请日：2010-10-29
申请人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
发明人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
IPC分类号： H05K1/03
CPC分类号： H05K3/386 , B32B7/12 , B32B15/08 , B32B15/20 , B32B2457/08 , H05K1/028 , H05K1/0346 , H05K1/0393 , H05K2201/0154 , H05K2201/0195 , H05K2201/0355
摘要： A double-sided copper foil substrate, which comprises: a polymer layer; a first copper foil; an adhesive layer formed on the polymer layer such that the polymer layer is sandwiched between the adhesive layer and the first copper layer; and a second copper foil causing the adhesive layer to be sandwiched between the second copper foil and the polymer layer, wherein the polymer layer and the adhesive layer have a total thickness of from 12 to 25 μm. The present invention further provides a flexible printed circuit board structure utilizing the composite double-sided copper foil substrate of the present invention, wherein the second double-sided copper foil substrate has a trench for exposing a portion of the adhesive layer. The double-sided copper foil substrate of the present invention are lower in rebound and satisfying the demand for the greater number of bending and sliding cycles under a lower R angle, and particularly is suitable for thin and flexible electronic products.
摘要翻译：一种双面铜箔衬底，其包括：聚合物层; 第一个铜箔; 形成在所述聚合物层上的粘合剂层，使得所述聚合物层夹在所述粘合剂层和所述第一铜层之间; 以及使所述粘合剂层夹在所述第二铜箔和所述聚合物层之间的第二铜箔，其中所述聚合物层和所述粘合剂层的总厚度为12至25μm。本发明还提供了利用本发明的复合双面铜箔基板的柔性印刷电路板结构，其中第二双面铜箔基板具有用于暴露粘合层的一部分的沟槽。本发明的双面铜箔基板的回弹率较低，并且在较低的R角下满足对较大数量的弯曲和滑动循环的需求，特别适用于薄而柔性的电子产品。

3. 发明授权

US08765258B2 Cover film 有权
标题翻译：封面胶片
公开(公告)号：US08765258B2
公开(公告)日：2014-07-01
申请号：US12841535
申请日：2010-07-22
申请人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
发明人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
IPC分类号： B32B7/12 , B32B15/04
CPC分类号： H05K3/281 , H05K2201/0195 , H05K2201/0209 , H05K2201/026 , H05K2201/0323 , Y10T428/1476 , Y10T428/24975 , Y10T428/264 , Y10T428/265 , Y10T428/266 , Y10T428/28 , Y10T428/2848 , Y10T428/2852
摘要： The present invention provides a cover film for a printed circuit board. The cover film includes an adhesive layer; a core layer made of a polymer; and a composite material layer formed on the core layer, comprising epoxy resin, a black material selected from the group consisting of a black pigment, carbon powder, nano carbon tube and a combination thereof, and an additive selected from the group consisting of titanium dioxide, boron nitride, barium sulfate and a combination thereof, wherein the core layer is disposed between the adhesive layer and the composite material layer, and the adhesive layer and the composite material layer have the same thickness or have a thickness difference being no more than 15 micro meters. The cover film of the preset invention is capable of shielding circuit patterns and has great folding endurance, and is thus applicable to flexible printed circuit boards.
摘要翻译：本发明提供一种印刷电路板用覆盖膜。覆盖膜包括粘合剂层; 由聚合物制成的芯层; 以及形成在芯层上的复合材料层，包括环氧树脂，选自黑色颜料，碳粉末，纳米碳管及其组合的黑色材料，以及选自二氧化钛，氮化硼，硫酸钡及其组合，其中芯层设置在粘合剂层和复合材料层之间，粘合剂层和复合材料层具有相同的厚度或厚度差不超过15 微米。本发明的覆盖膜能够屏蔽电路图案并且具有很大的折叠耐久性，因此可应用于柔性印刷电路板。

4. 发明申请

US20110086192A1 COVER LAYER FOR PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板盖层
公开(公告)号：US20110086192A1
公开(公告)日：2011-04-14
申请号：US12841535
申请日：2010-07-22
申请人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
发明人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
IPC分类号： C09J7/02 , B32B5/00
CPC分类号： H05K3/281 , H05K2201/0195 , H05K2201/0209 , H05K2201/026 , H05K2201/0323 , Y10T428/1476 , Y10T428/24975 , Y10T428/264 , Y10T428/265 , Y10T428/266 , Y10T428/28 , Y10T428/2848 , Y10T428/2852
摘要： The present invention provides a cover film for a printed circuit board. The cover film includes an adhesive layer; a core layer made of a polymer; and a composite material layer formed on the core layer, comprising epoxy resin, a black material selected from the group consisting of a black pigment, carbon powder, nano carbon tube and a combination thereof, and an additive selected from the group consisting of titanium dioxide, boron nitride, barium sulfate and a combination thereof, wherein the core layer is disposed between the adhesive layer and the composite material layer, and the adhesive layer and the composite material layer have the same thickness or have a thickness difference being no more than 15 micro meters. The cover film of the preset invention is capable of shielding circuit patterns and has great folding endurance, and is thus applicable to flexible printed circuit boards.
摘要翻译：本发明提供一种印刷电路板用覆盖膜。覆盖膜包括粘合剂层; 由聚合物制成的芯层; 以及形成在芯层上的复合材料层，包括环氧树脂，选自黑色颜料，碳粉末，纳米碳管及其组合的黑色材料，以及选自二氧化钛，氮化硼，硫酸钡及其组合，其中芯层设置在粘合剂层和复合材料层之间，粘合剂层和复合材料层具有相同的厚度或厚度差不超过15 微米。本发明的覆盖膜能够屏蔽电路图案并且具有很大的折叠耐久性，因此可应用于柔性印刷电路板。

5. 发明申请

US20100330321A1 COVER LAYER FOR PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板盖层
公开(公告)号：US20100330321A1
公开(公告)日：2010-12-30
申请号：US12822540
申请日：2010-06-24
申请人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
发明人： Chih-Ming Lin , Shou-Jui Hsiang , Chien-Hui Lee
IPC分类号： G02B1/11 , B32B27/08 , B32B27/20 , B32B7/02
CPC分类号： G02B5/0808 , H05K1/0274 , H05K1/0393 , H05K3/281 , H05K2201/0195 , H05K2201/0209 , H05K2201/2054 , Y10T428/1476 , Y10T428/2495 , Y10T428/24975
摘要： The present invention provides a cover layer for a printed circuit board. The cover layer includes a first polymer layer, a second polymer layer and a light-reflecting layer disposed between the first and second polymer layers and having a thickness being 0.5 to 10 micro meters. Due to the light-reflecting layer, the cover layer of the present invention has high reflection rate and great flexibility suitable for a flexible printed circuit board.
摘要翻译：本发明提供了一种用于印刷电路板的覆盖层。覆盖层包括第一聚合物层，第二聚合物层和设置在第一和第二聚合物层之间的厚度为0.5至10微米的光反射层。由于光反射层，本发明的覆盖层具有高柔性印刷电路板的高反射率和大的柔性。

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