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    • 5. 发明申请
    • Light-Emitting Device
    • 发光装置
    • US20090114940A1
    • 2009-05-07
    • US12055119
    • 2008-03-25
    • Chih-Chung YangDong-Ming YehCheng-Yen ChenYen-Cheng LuKun-Ching ShenChi-Feng Huang
    • Chih-Chung YangDong-Ming YehCheng-Yen ChenYen-Cheng LuKun-Ching ShenChi-Feng Huang
    • H01L33/00
    • H01L33/44
    • The invention provides a light-emitting device, comprising a light-emitting element and a surface plasmon coupling element connected to the light-emitting element. In an embodiment of the invention, the surface plasmon coupling element comprises a dielectric layer connected to the light-emitting element and a metal layer on the dielectric layer. In another embodiment of the invention, the light-emitting device is a light-emitting diode, comprising an active layer between an n-type semiconductor layer and a p-type semiconductor layer, and a surface plasmon coupling element adjacent to the n-type semiconductor layer. In a further embodiment of the invention, a current spreading layer on a second type semiconductor layer of the light-emitting device includes a plurality of strip-shaped structures, and the surface plasmon coupling element is disposed on the current spreading layer and filled into the gap between the strip-shaped structures of the current spreading layer.
    • 本发明提供了一种发光装置,包括发光元件和连接到发光元件的表面等离子体激元耦合元件。 在本发明的实施例中,表面等离子体激元耦合元件包括连接到发光元件的电介质层和介电层上的金属层。 在本发明的另一个实施例中,发光装置是发光二极管,其包括n型半导体层和p型半导体层之间的有源层以及与n型半导体层相邻的表面等离子体耦合元件 半导体层。 在本发明的另一实施例中,发光器件的第二类型半导体层上的电流扩展层包括多个条形结构,并且表面等离子体激元耦合元件设置在电流扩展层上并被填充到 电流扩展层的带状结构之间的间隙。