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    • 10. 发明授权
    • Semiconductor structure and method for manufacturing the same
    • 半导体结构及其制造方法
    • US08766358B2
    • 2014-07-01
    • US13454149
    • 2012-04-24
    • Chiu-Te LeeKe-Feng LinShu-Wen LinKun-Huang YuChih-Chung WangTe-Yuan Wu
    • Chiu-Te LeeKe-Feng LinShu-Wen LinKun-Huang YuChih-Chung WangTe-Yuan Wu
    • H01L29/76
    • H01L29/0653H01L29/0878H01L29/407H01L29/7816
    • A semiconductor structure comprises a substrate having a first conductive type; a deep well having a second conductive type formed in the substrate and extending down from a surface of the substrate; a first well having the first conductive type and a second well having the second conductive type both formed in the deep well and extending down from the surface of the substrate, and the second well spaced apart from the first well; a gate electrode formed on the substrate and disposed between the first and second wells; an isolation extending down from the surface of the substrate and disposed between the gate electrode and the second well; a conductive plug including a first portion and a second portion electrically connected to each other, and the first portion electrically connected to the gate electrode, and the second portion penetrating into the isolation.
    • 半导体结构包括具有第一导电类型的衬底; 具有形成在所述基板中并从所述基板的表面向下延伸的第二导电类型的深阱; 具有第一导电类型的第一阱和具有第二导电类型的第二阱都形成在深阱中并且从衬底的表面向下延伸,并且第二阱与第一阱间隔开; 栅电极,形成在所述基板上并且设置在所述第一阱和所述第二阱之间; 从衬底的表面向下延伸并且设置在栅电极和第二阱之间的隔离件; 导电插头,其包括彼此电连接的第一部分和第二部分,并且所述第一部分电连接到所述栅电极,并且所述第二部分穿透所述隔离。