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    • 1. 发明授权
    • Open-circuit testing system and method
    • 开路测试系统及方法
    • US07612568B2
    • 2009-11-03
    • US11743641
    • 2007-05-02
    • Chien-Wei ChenChia-Ming Chen
    • Chien-Wei ChenChia-Ming Chen
    • G01R31/00G01R31/02
    • G01R31/046
    • The invention discloses a testing system and method suitable for determining the connection state of an electronic component in an electronic device assembly. In an embodiment, the testing system comprises a signal sensing unit configured to provide a sensed signal induced by capacitive coupling in response to the output of a testing signal passing through a tested pin, a signal processor unit configured to filter and over-sample the sensed signal to obtain a digital signal, and an analyzer unit configured to compute the digital signal for determining a connection state of the test pin.
    • 本发明公开了一种适用于确定电子设备组件中的电子部件的连接状态的测试系统和方法。 在一个实施例中,测试系统包括信号感测单元,其被配置为响应于通过测试引脚的测试信号的输出来提供由电容耦合引起的感测信号,信号处理器单元被配置为对所感测的信号进行滤波和过采样 信号以获得数字信号,以及分析器单元,被配置为计算用于确定测试引脚的连接状态的数字信号。
    • 2. 发明申请
    • Open-Circuit Testing System and Method
    • 开环测试系统及方法
    • US20080218175A1
    • 2008-09-11
    • US11743641
    • 2007-05-02
    • Chien-Wei ChenChia-Ming Chen
    • Chien-Wei ChenChia-Ming Chen
    • G01R31/04
    • G01R31/046
    • The invention discloses a testing system and method suitable for determining the connection state of an electronic component in an electronic device assembly. In an embodiment, the testing system comprises a signal sensing unit configured to provide a sensed signal induced by capacitive coupling in response to the output of a testing signal passing through a tested pin, a signal processor unit configured to filter and over-sample the sensed signal to obtain a digital signal, and an analyzer unit configured to compute the digital signal for determining a connection state of the test pin.
    • 本发明公开了一种适用于确定电子设备组件中的电子部件的连接状态的测试系统和方法。 在一个实施例中,测试系统包括信号感测单元,其被配置为响应于通过测试引脚的测试信号的输出来提供由电容耦合引起的感测信号,信号处理器单元被配置为对所感测的信号进行滤波和过采样 信号以获得数字信号,以及分析器单元,被配置为计算用于确定测试引脚的连接状态的数字信号。
    • 7. 发明授权
    • Transfer printing method and system for printing images on a workpiece with supercritical fluid
    • 用超临界流体在工件上印刷图像的转印方法和系统
    • US08790478B2
    • 2014-07-29
    • US13348601
    • 2012-01-11
    • Chien-Wei ChenChing-Fu Hsu
    • Chien-Wei ChenChing-Fu Hsu
    • B29C65/48B29C47/78B29C47/02B32B37/04B32B37/10B32B38/14B41F16/00B29C47/08
    • B41F16/008
    • The present invention relates to a transfer printing method and a system using the method for printing images on a workpiece with supercritical fluid. The method includes disposing the workpiece inside the first mold and disposing a transfer film above the workpiece, closing the first mold with a second mold and injecting pressured gas, whose pressure is greater than a critical pressure, into the first mold and the second mold, ensuring a temperature of the pressured gas being greater than a critical temperature so as to convert into supercritical fluid, softening the transfer film with the supercritical fluid, transferring an adhesive layer, a print layer and a hardening layer of the transfer film onto the workpiece, and opening the first mold and the second mold to take out the workpiece.
    • 本发明涉及一种转印印刷方法和一种使用超临界流体在工件上印刷图像的方法的系统。 该方法包括将工件设置在第一模具内部并且在工件上方设置转印膜,用第二模具封闭第一模具,并将压力大于临界压力的压力气体注入到第一模具和第二模具中, 确保加压气体的温度大于临界温度,以便转化为超临界流体,用超临界流体软化转移膜,将转移膜的粘合剂层,印刷层和硬化层转移到工件上, 并打开第一个模具和第二个模具取出工件。
    • 8. 发明申请
    • ELECTRONIC DEVICE AND TOUCH MODULE THEREOF
    • 电子设备和触控模块
    • US20130016066A1
    • 2013-01-17
    • US13341774
    • 2011-12-30
    • Chien-Wei ChenChing-Fu HsuJun-Hong WenYen-Chi Liu
    • Chien-Wei ChenChing-Fu HsuJun-Hong WenYen-Chi Liu
    • G06F3/042
    • G06F3/0425
    • An electronic device and its touch module are provided. The touch module includes a touch area, a detecting device, and a touch position determining device. The touch area is formed on a case of the electronic device, wherein the touch area includes a plurality of holes; each of the holes can allow light to pass through it when it is not covered by an external object, but cannot allow light to pass through it when it is covered by an external object. The detecting device is positioned under the touch area for detecting whether each hole can allow light to pass through it to determine whether each hole is covered by an external object. The touch position determining device is connected to the detecting device for determining the touch position of the external object according to whether each hole is covered or not.
    • 提供电子设备及其触摸模块。 触摸模块包括触摸区域,检测装置和触摸位置确定装置。 触摸区域形成在电子设备的壳体上,其中触摸区域包括多个孔; 当它不被外部物体覆盖时,每个孔可以允许光通过它,但是当它被外部物体覆盖时不能允许光通过它。 检测装置位于触摸区域下方,用于检测每个孔是否允许光通过它,以确定每个孔是否被外部物体覆盖。 触摸位置确定装置连接到检测装置,用于根据每个孔是否被覆盖来确定外部物体的触摸位置。