专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090289345A1 ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF 有权
标题翻译：电子器件封装及其制造方法
公开(公告)号：US20090289345A1
公开(公告)日：2009-11-26
申请号：US12470255
申请日：2009-05-21
申请人： Chia-Lun TSAI , Wen-Cheng CHIEN , Po-Han LEE , Wei-Ming CHEN
发明人： Chia-Lun TSAI , Wen-Cheng CHIEN , Po-Han LEE , Wei-Ming CHEN
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L23/481 , H01L21/76898 , H01L24/12 , H01L27/14618 , H01L27/14683 , H01L2224/05001 , H01L2224/05024 , H01L2224/05026 , H01L2224/05548 , H01L2224/05624 , H01L2224/05639 , H01L2224/05655 , H01L2924/00014 , H01L2924/01021 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H01L2924/3025 , H01L2924/00 , H01L2224/05099
摘要： An electronic device package and a fabrication method thereof are provided. The fabrication method includes providing a semiconductor substrate containing a plurality of chips having a first surface and an opposite second surface. A plurality of conductive electrodes is disposed on the first surface and the conductive electrodes of the two adjacent chips are arranged asymmetrically along side direction of the chip. A plurality of contact holes is formed in each chip, apart from the side of the chip, to expose the conductive electrodes.
摘要翻译：提供一种电子器件封装及其制造方法。制造方法包括提供含有多个具有第一表面和相对的第二表面的芯片的半导体衬底。多个导电电极设置在第一表面上，并且两个相邻芯片的导电电极沿着芯片的侧面方向非对称地布置。在每个芯片中，与芯片侧面形成多个接触孔，以露出导电电极。

2. 发明申请

US20110193225A1 ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF 有权
标题翻译：电子器件封装及其制造方法
公开(公告)号：US20110193225A1
公开(公告)日：2011-08-11
申请号：US13024902
申请日：2011-02-10
申请人： Wei-Ming CHEN , Shu-Ming CHANG
发明人： Wei-Ming CHEN , Shu-Ming CHANG
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/481 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24246 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73267 , H01L2224/82 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/00 , H01L2224/83
摘要： A chip package is disclosed. The package includes a carrier substrate, at least two semiconductor chips, a fill material layer, a protective layer, and a plurality of conductive bumps. The carrier substrate includes a grounding region. The semiconductor chips are disposed overlying the grounding region of the carrier substrate. Each semiconductor chip includes at least one signal pad and includes at least one grounding pad electrically connected to the grounding region. The fill material layer is formed overlying the carrier substrate and covers the semiconductor chips. The protective layer covers the fill material layer. The plurality of conductive bumps is disposed overlying the protective layer and is electrically connected to the semiconductor chips. A fabrication method of the chip package is also disclosed.
摘要翻译：公开了一种芯片封装。封装包括载体衬底，至少两个半导体芯片，填充材料层，保护层和多个导电凸块。载体基板包括接地区域。半导体芯片设置在载体基板的接地区域上。每个半导体芯片包括至少一个信号焊盘，并且包括电连接到接地区域的至少一个接地焊盘。填充材料层形成在载体衬底上并覆盖半导体芯片。保护层覆盖填充层。多个导电凸块设置在保护层的上方并与半导体芯片电连接。还公开了芯片封装的制造方法。

3. 发明申请

US20110042819A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
标题翻译：芯片包装及其形成方法
公开(公告)号：US20110042819A1
公开(公告)日：2011-02-24
申请号：US12860823
申请日：2010-08-20
申请人： Ying-Nan WEN , Baw-Ching PERNG , Wei-Ming CHEN , Shu-Ming CHANG
发明人： Ying-Nan WEN , Baw-Ching PERNG , Wei-Ming CHEN , Shu-Ming CHANG
IPC分类号： H01L23/522 , H01L21/50
CPC分类号： H01L23/3135 , H01L21/76898 , H01L23/147 , H01L23/3121 , H01L23/481 , H01L23/49827 , H01L24/16 , H01L24/24 , H01L24/28 , H01L24/32 , H01L24/82 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/18 , H01L2224/16225 , H01L2224/24051 , H01L2224/24226 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/8314 , H01L2224/8385 , H01L2224/92 , H01L2224/92244 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/12041 , H01L2924/12044 , H01L2924/1461 , H01L2224/83 , H01L2224/82 , H01L2924/00
摘要： According to an embodiment of the invention, a chip package is provided. The chip package includes a semiconductor substrate having an upper surface and an opposite lower surface, a through-hole penetrating the upper surface and the lower surface of the semiconductor substrate, a chip disposed overlying the upper surface of the semiconductor substrate, a conducting layer overlying a sidewall of the through-hole and electrically connecting the chip, a first insulating layer overlying the upper surface of the semiconductor substrate, a second insulating layer overlying the lower surface of the semiconductor substrate, and a bonding structure disposed overlying the lower surface of the semiconductor substrate, wherein a material of the second insulating layer is different from that of the first insulating layer.
摘要翻译：根据本发明的实施例，提供了芯片封装。芯片封装包括具有上表面和相对的下表面的半导体衬底，穿过半导体衬底的上表面和下表面的通孔，设置在半导体衬底的上表面上的芯片，覆盖所述通孔的侧壁电连接所述芯片，覆盖所述半导体衬底的上表面的第一绝缘层，覆盖所述半导体衬底的下表面的第二绝缘层和设置在所述半导体衬底的下表面上的接合结构半导体衬底，其中所述第二绝缘层的材料与所述第一绝缘层的材料不同。

4. 发明申请

US20130314323A1 PORTABLE ELECTRONIC DEVICE AND AN INPUT MODULE AND AN FLEXIBLE BRIDGING BOARD THEREOF 有权
标题翻译：便携式电子设备和输入模块及其柔性桥接器
公开(公告)号：US20130314323A1
公开(公告)日：2013-11-28
申请号：US13606171
申请日：2012-09-07
申请人： Wei-Ming CHEN , Wei-Wen Yang
发明人： Wei-Ming CHEN , Wei-Wen Yang
IPC分类号： G06F3/02
CPC分类号： G06F1/169
摘要： An input module is mounted on a portable electronic device and has a sensing substrate and a cover lens mounted on a top surface of the sensing substrate, a physical switch mounted on and electrically connected to a bottom surface of the sensing substrate, and a flexible bridging board having two opposite short sides respectively protruding from two short sides of the sensing substrate for the two short sides of the flexible bridging board to be mounted on the electronic device. As the two short sides of the input module are mounted on the electronic device and a lever arm between a pressed point to a fixed point of the input module is shortened, a torque applied to the input module is lowered and the input module is not easily deformed.
摘要翻译：输入模块安装在便携式电子设备上，并且具有安装在感测基板的顶表面上的感测基板和盖透镜，安装在感测基板的底表面上并电连接到感测基板的底表面的物理开关，以及柔性桥接板具有两个相对的短边，分别从感测基板的两个短边伸出，用于安装在电子设备上的柔性桥接板的两个短边。由于输入模块的两个短边安装在电子设备上，并且在压入点到输入模块的固定点之间的杠杆臂被缩短，施加到输入模块的扭矩降低，并且输入模块不容易变形

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式