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    • 5. 发明授权
    • Method of controlling internal voltage and multi-chip package memory prepared using the same
    • 控制内部电压的方法和使用其制备的多芯片封装存储器
    • US07957217B2
    • 2011-06-07
    • US12266716
    • 2008-11-07
    • Moon-sook ParkHoe-ju ChungJung-bae Lee
    • Moon-sook ParkHoe-ju ChungJung-bae Lee
    • G11C8/00
    • G11C5/147G11C5/04
    • The invention relates generally to a multi-chip package (MCP) memory device, and more particularly, but without limitation, to a MCP memory device having a reduced size. In one embodiment, the MCP memory device includes: a transfer memory chip; and a plurality of memory chips coupled to the transfer memory chip, each of the plurality of memory chips including an internal voltage generating circuit, the transfer memory chip configured to receive a plurality of command signals from outside the MCP memory device, the transfer memory chip further configured to output a plurality of control signals to the plurality of memory chips based on the plurality of command signals. Embodiments of the invention also relate to a method of controlling an internal voltage of the MCP memory device.
    • 本发明一般涉及一种多芯片封装(MCP)存储器件,尤其涉及但不限于具有减小尺寸的MCP存储器件。 在一个实施例中,MCP存储器件包括:传送存储器芯片; 以及多个存储器芯片,其耦合到所述传送存储器芯片,所述多个存储器芯片中的每一个包括内部电压产生电路,所述传送存储器芯片被配置为从所述MCP存储器设备的外部接收多个命令信号,所述传送存储器芯片 还被配置为基于所述多个命令信号将多个控制信号输出到所述多个存储器芯片。 本发明的实施例还涉及一种控制MCP存储器件的内部电压的方法。
    • 6. 发明授权
    • Input buffer for detecting an input signal
    • 用于检测输入信号的输入缓冲器
    • US07948272B2
    • 2011-05-24
    • US10990412
    • 2004-11-18
    • Dong-jin LeeJung-bae LeeKyu-hyoun Kim
    • Dong-jin LeeJung-bae LeeKyu-hyoun Kim
    • H03K5/22
    • H03K19/003
    • An input buffer which detects an input signal. The input buffer including an output node, a first buffer, and a second buffer. The first buffer may control the voltage level of the output node when the voltage level of a reference voltage signal is equal to a predetermined voltage level. The second buffer may control the voltage level of the output node in response to the input signal when the voltage level of the reference voltage signal is lower than the predetermined voltage level. The second buffer may maintain the output node at a first level. The second buffer may include an output control section and a level control unit. The output control section may receive the input signal and generate a level output signal at a second level. The level control section may generate a control signal which maintains the output node at the first level, in response to the level output signal when the voltage level of the reference voltage signal is lower than the predetermined voltage level of the first voltage and may intercept the control signal when the voltage level of the reference voltage signal is equal to the predetermined voltage level.
    • 输入缓冲器,用于检测输入信号。 输入缓冲器包括输出节点,第一缓冲器和第二缓冲器。 当参考电压信号的电压电平等于预定电压电平时,第一缓冲器可以控制输出节点的电压电平。 当参考电压信号的电压电平低于预定电压电平时,第二缓冲器可以响应于输入信号来控制输出节点的电压电平。 第二缓冲器可以将输出节点维持在第一级。 第二缓冲器可以包括输出控制部分和电平控制单元。 输出控制部分可以接收输入信号并产生第二电平的电平输出信号。 当参考电压信号的电压电平低于第一电压的预定电压电平时,电平控制部分可以响应于电平输出信号而产生将输出节点维持在第一电平的控制信号,并且可以拦截 当参考电压信号的电压电平等于预定电压电平时,控制信号。
    • 10. 发明授权
    • Semiconductor memory device for reducing chip size
    • 用于减小芯片尺寸的半导体存储器件
    • US06804163B2
    • 2004-10-12
    • US10305986
    • 2002-11-29
    • Yun-sang LeeJung-bae Lee
    • Yun-sang LeeJung-bae Lee
    • G11C800
    • G11C7/12G11C5/025G11C7/06G11C7/10
    • A semiconductor memory device that minimizes chip area is provided. The semiconductor memory device includes local input/output (I/O) lines, global I/O lines, and a memory core that is coupled between a bit line and a complementary bit line. The memory core includes a memory cell array, a bit line equalizer circuit, a PMOS sense amplifier (S/A), a PMOS S/A driving circuit for driving the PMOS S/A, a transmission gate circuit, an NMOS S/A, and an NMOS S/A driving circuit for driving the NMOS S/A. First and second transistors for connecting the local I/O lines to the global I/O lines are installed between adjacent bit lines. The PMOS S/A driving circuit, which is a first driving transistor, and the NMOS S/A driving circuit, which is a second driving transistor, are also installed between adjacent bit lines. Because the semiconductor memory device arranges a PMOS S/A driving circuit, an NMOS S/A driving circuit, and a gating circuit for connecting local I/O lines to global I/O lines, between adjacent bit lines, the chip area is reduced.
    • 提供了最小化芯片面积的半导体存储器件。 半导体存储器件包括本地输入/输出(I / O)线,全局I / O线和耦合在位线和互补位线之间的存储器核。 存储器芯包括存储单元阵列,位线均衡器电路,PMOS读出放大器(S / A),用于驱动PMOS S / A的PMOS S / A驱动电路,传输门电路,NMOS S / A 以及用于驱动NMOS S / A的NMOS S / A驱动电路。 用于将本地I / O线连接到全局I / O线的第一和第二晶体管安装在相邻位线之间。 作为第一驱动晶体管的PMOS S / A驱动电路和作为第二驱动晶体管的NMOS S / A驱动电路也安装在相邻位线之间。 由于半导体存储器件在相邻位线之间配置PMOS S / A驱动电路,NMOS S / A驱动电路和用于将本地I / O线连接到全局I / O线的选通电路,芯片面积减小 。