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1. 发明专利

JP2007316616A Composite optical lens 审中-公开
标题翻译：复合光学镜头
公开(公告)号：JP2007316616A
公开(公告)日：2007-12-06
申请号：JP2007108611
申请日：2007-04-17
申请人： Chi Lin Technology Co Ltd , 奇菱科技股▲ふん▼有限公司
发明人： TSAI SHEN-YIN , SE KIGEN , CHENG SHIH-KAI , KUO CHIN-LUNG
IPC分类号： G02B5/02 , F21V5/00
CPC分类号： G02B5/0278 , G02B5/0215 , G02B5/0231 , G02B5/0242 , G02B5/045
摘要： PROBLEM TO BE SOLVED: To reduce thickness of a diffusion layer while maintaining diffusing and flattening of floodlighting by improving structure between a light condensing layer and a diffusion layer. SOLUTION: A composite optical lens comprises two layers composed of an upper layer and a lower layer. The lower layer 2 is the diffusion layer, an upper surface 22A of which is an outgoing surface and in which light incident on the lower layer is continuously refracted and then is diffusedly floodlighted from the outgoing surface. The upper layer 1 is the light condensing layer, a lower surface 11A of which comes into close contact with an upper surface of the diffusion layer and an upper surface of which diaphragms each beam in floodlighting arriving thereat after diffusion by the diffusion layer so as to be floodlighted upward. In the composite optical lens, a boundary surface 24 between upper and lower two layers is made to be nonplanar. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过改善聚光层和扩散层之间的结构，来减小扩散层的厚度，同时保持泛光灯的漫射和平坦化。解决方案：复合光学透镜包括由上层和下层组成的两层。下层2是扩散层，其上表面22A是出射表面，入射在下层上的光被连续地折射，然后从出射表面被扩散泛光。上层1是聚光层，其下表面11A与扩散层的上表面紧密接触，并且其上表面在通过扩散层扩散之后通过泛光照射到达其的每个光束，以便被向上泛光。在复合光学透镜中，上下两层之间的边界面24被制成非平面。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008073965A Method of manufacturing optical component having thin-film pattern surface of resin 审中-公开
标题翻译：制备薄膜薄膜表面光学元件的方法
公开(公告)号：JP2008073965A
公开(公告)日：2008-04-03
申请号：JP2006256229
申请日：2006-09-21
申请人： Chi Lin Technology Co Ltd , 奇菱科技股▲ふん▼有限公司
发明人： LEE MAO SONG , SE KIGEN , KUO CHIN-LUNG , CHENG SHIH-KAI , HAYASHI TOSHIHIRO , TSAI SHEN-YIN
IPC分类号： B29C59/02 , B29C39/10 , B29K33/04 , B29L11/00 , G02B5/02
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical part having a thin-film pattern surface of a resin which enables a treatment of hardening the resin layer formed with a pattern directly after removal of the mold before the hardening treatment.
SOLUTION: The method comprises a resin layer forming step of applying a resin in a half-hardened state for formation of a thin-film pattern layer to the surface of a substrate to form a resin layer, a pattern forming step of pressing the resin layer from the front surface side with a pattern forming die, with the die made to oppose the front surface of the substrate, so as to form a pattern, a die removal step of removing the die from the front surface of the substrate while leaving the resin layer formed with the pattern as it is and a hardening step of hardening directly the resin layer formed with a pattern.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种制造具有树脂薄膜图案表面的光学部件的方法，该方法能够在硬化处理之前在除去模具之后直接硬化处理图案形成的树脂层。解决方案：该方法包括：树脂层形成步骤，其将半硬化状态的树脂施加到基板的表面以形成树脂层，形成薄膜图案层的图案形成步骤，压制树脂层从表面侧具有图案形成模具，模具与基板的前表面相对，以形成图案;模具移除步骤，从基板的正面去除模具，同时留下形成图案的树脂层，直接硬化硬化步骤，形成图案的树脂层。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007279746A Light diffuser plate and backlight unit 审中-公开
标题翻译：光扩散板和背光单元
公开(公告)号：JP2007279746A
公开(公告)日：2007-10-25
申请号：JP2007100739
申请日：2007-04-06
申请人： Chi Lin Technology Co Ltd , 奇菱科技股▲ふん▼有限公司
发明人： TSAI SHEN-YIN , SE KIGEN , CHENG SHIH-KAI
IPC分类号： G02B5/02 , G02F1/13357
CPC分类号： F21V5/00 , F21V2200/30 , G02B5/0247 , G02B5/0257 , G02B5/0278 , G02F1/133606
摘要： PROBLEM TO BE SOLVED: To provide a light diffuser plate through which uniformly bright surface light emission having increased diffusivity and transmissivity to a light beam and improved color unevenness and luminance unevenness can be obtained, and a backlight unit using the light diffuser plate. SOLUTION: In a base sheet (1) which is thick and has four thickness-directional peripheries enclosed with planes, a plurality of hollow elongate holes (2) having respective inner peripheral surface (21) curved at least partially are provided to be extended penetrating two opposite peripheral surfaces of the four peripheral surfaces. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种光漫射板，通过该光漫射板可以获得具有增加的对光束的扩散率和透射率的均匀亮度的发光，并且可以获得改善的颜色不均匀性和亮度不均匀性，并且可以获得使用光漫射板。解决方案：在厚度为四个厚度方向的外围由平面包围的基片（1）中，具有至少部分弯曲的相应内周表面（21）的多个中空细长孔（2）设置成延伸穿过四个周边表面的两个相对的外围表面。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2006032016A Support structure for straight down back light module 审中-公开
标题翻译：支撑结构，用于直下光束模块
公开(公告)号：JP2006032016A
公开(公告)日：2006-02-02
申请号：JP2004206261
申请日：2004-07-13
申请人： Chi Lin Technology Co Ltd , 奇菱科技股▲分▼有限公司
发明人： TSAI SHEN-YIN , HSU PAO-YUAN , YU HUNG-WEN , HSIEH CHIEN-CHANG , HUNG MING-HUNG
IPC分类号： F21V19/00 , F21S2/00 , F21Y103/00
摘要： PROBLEM TO BE SOLVED: To provide a support structure for a straight down back light module preventing deformation of a lamp and a diffusion plate due to temperature change.
SOLUTION: This straight down back light has the diffusion plate, a reflection plate (back plate) arranged in the lower part of the diffusion plate, the lamp arranged between the diffusion plate and the reflection plate, and a supporting member arranged between the diffusion plate and the reflection plate.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于防止由于温度变化引起的灯和扩散板的变形的直下背光模块的支撑结构。解决方案：该直下背光具有扩散板，布置在扩散板下部的反射板（背板），布置在漫射板和反射板之间的灯以及布置在扩散板和反射板之间的支撑件扩散板和反射板。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2007258701A Package structure of light emitting diode, and method for manufacturing same 审中-公开
标题翻译：发光二极管的包装结构及其制造方法
公开(公告)号：JP2007258701A
公开(公告)日：2007-10-04
申请号：JP2007056952
申请日：2007-03-07
申请人： Chi Lin Technology Co Ltd , 奇菱科技股▲分▼有限公司
发明人： HU CHEN-ZE , TSAI SHEN-YIN , WANG CHIN-MING
IPC分类号： H01L33/44 , H01L33/56
CPC分类号： H01L33/44 , H01L33/56 , H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide the package structure of a light emitting diode that improves light extraction efficiency in light emitting diode chip, and to provide a method for manufacturing the same.
SOLUTION: The system is provided with a substrate 100, at least one light emitting diode, a plasma chemical vapor phase epitaxial layer 130 and a transparent material layer 140. The substrate 100 has a plurality of contacts. Light emitting diodes are disposed on the substrate 100 and are electrically connected to the contacts. The layer 130 is disposed on the light emitting diode and the refractive index thereof is smaller than that of the light emitting diode. The layer 140 is disposed on the layer 130 and the refractive index thereof is smaller than that of the layer 130.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供改善发光二极管芯片中的光提取效率的发光二极管的封装结构，并提供其制造方法。解决方案：该系统设置有基板100，至少一个发光二极管，等离子体化学气相外延层130和透明材料层140.基板100具有多个触点。发光二极管设置在基板100上并与触点电连接。层130设置在发光二极管上，其折射率小于发光二极管的折射率。层140设置在层130上，其折射率小于层130的折射率。（C）2008，JPO和INPIT

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