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1. 发明授权

US08388195B2 Illumination device with heat dissipation structures 失效
标题翻译：具有散热结构的照明装置
公开(公告)号：US08388195B2
公开(公告)日：2013-03-05
申请号：US12824208
申请日：2010-06-27
申请人： Cheng-Tien Lai , Chi-Yuan Lai , Zhi-Yong Zhou
发明人： Cheng-Tien Lai , Chi-Yuan Lai , Zhi-Yong Zhou
IPC分类号： B60Q1/06 , B60Q1/26 , F21V29/00
CPC分类号： F21V29/83 , F21V29/507 , F21V29/745 , F21V29/80 , F21Y2105/10 , F21Y2115/10 , H05K1/0203 , H05K2201/09063 , H05K2201/10106
摘要： An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.
摘要翻译：示例性照明装置包括外壳，容纳在外壳中的半导体光源以及与外壳接合并覆盖半导体光源的外壳。由半导体光源产生的光可以穿过信封突出并且离开照明装置。半导体光源包括彼此独立的多个光源模块。在每个光源模块中限定多个空气通道，用于穿过其中的空气将半导体光源产生的热量散发到环境空气中。

2. 发明授权

US08196645B2 Heat sink with heat pipes 有权
标题翻译：带热管的散热器
公开(公告)号：US08196645B2
公开(公告)日：2012-06-12
申请号：US11964919
申请日：2007-12-27
申请人： Chi-Yuan Lai , Zhi-Yong Zhou , Cheng-Tien Lai
发明人： Chi-Yuan Lai , Zhi-Yong Zhou , Cheng-Tien Lai
IPC分类号： F28D15/02 , F28F7/00 , H05K7/20
CPC分类号： F28F1/126 , F28D15/0233 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.
摘要翻译：用于冷却电子部件的散热适配器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管下板。下板包括接触热管的面板，从面板向上延伸并与热管分离的两个侧壁，以及两个从两个侧壁相反延伸并焊接在上板上的凸缘。热管是S形并列并且从头到尾直接接触。

3. 发明授权

US07746642B2 Heat sink and a method for manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US07746642B2
公开(公告)日：2010-06-29
申请号：US12202393
申请日：2008-09-01
申请人： Chi-Yuan Lai , Zhi-Yong Zhou , Cheng-Tien Lai
发明人： Chi-Yuan Lai , Zhi-Yong Zhou , Cheng-Tien Lai
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28F3/02 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.
摘要翻译：用于冷却电子部件的散热器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管下板下板形成从其向下突出的突起。突起的底面被研磨成平坦和平滑的，由此底部表面可以紧密接触电子部件。一种用于制造散热器的方法，包括：铣削从下板向下冲压的突起的底面，由此底表面可以平坦和平滑，足以与电子元件紧密接触，并且将上板依次焊接在下板和分别在下板和上板上的多个翅片。

4. 发明授权

US07959327B2 LED lamp having a vapor chamber for dissipating heat generated by LEDs of the LED lamp 失效
标题翻译： LED灯具有用于散发由LED灯发出的热量的蒸气室
公开(公告)号：US07959327B2
公开(公告)日：2011-06-14
申请号：US12422300
申请日：2009-04-13
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Chi-Yuan Lai
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Chi-Yuan Lai
IPC分类号： F21V29/00
CPC分类号： F21V29/70 , F21V29/004 , F21V29/51 , F21V29/75 , F21V29/763 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
摘要： An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.
摘要翻译： LED灯包括灯壳体，由金属制成的散热器并安装在灯壳的底侧，多个LED模块和蒸汽室，其底表面连接到散热器的顶表面，具有其上附接有LED模块的顶表面，工作液体被密封在蒸气室中。蒸气室在其中限定了一个密封室，工作液体是相变液体，并被密封在密封室中。多个肋布置在蒸气室中，用于加强蒸气室的完整性，并且肋将密封室分成多个连通空间。

5. 发明授权

US07694721B2 Miniature liquid cooling device having an integral pump 失效
标题翻译：具有整体泵的微型液体冷却装置
公开(公告)号：US07694721B2
公开(公告)日：2010-04-13
申请号：US11309612
申请日：2006-08-31
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/473 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).
摘要翻译：微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。收容空间由外壳封闭。吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

6. 发明授权

US07584781B2 Liquid-cooling device 失效
标题翻译：液冷装置
公开(公告)号：US07584781B2
公开(公告)日：2009-09-08
申请号：US11309491
申请日：2006-08-11
申请人： Cheng-Tien Lai , Zhi-Yong Zhou
发明人： Cheng-Tien Lai , Zhi-Yong Zhou
IPC分类号： F28F7/00 , F28F3/12 , H05K7/20
CPC分类号： F28F3/086 , F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling device includes a base, a housing and a heat exchanger. The base and the housing enclose a chamber which receives the heat exchanger therein. Inlet and outlet for liquid are provided at the housing. The heat exchanger includes stacked flakes. Each flake includes parallel and alternately arranged first and second strips each having a void defined therein. The flakes are stacked in a manner such that each first strip overlays and abuts against a corresponding second strip of an adjacent flake and that the void in each first strip and the void in the corresponding second strip of the adjacent flake are in fluid communication with each other to thereby form a channel between the inlet and the outlet.
摘要翻译：液体冷却装置包括基座，壳体和热交换器。基座和壳体包围容纳热交换器的腔室。在壳体处设有用于液体的入口和出口。热交换器包括堆积的薄片。每个薄片包括平行且交替布置的第一和第二条带，每个带有限定在其中的空隙。薄片以这样的方式堆叠，使得每个第一条覆盖并邻接相邻片状物的对应的第二条带，并且每个第一条带中的空隙和相邻片状物的相应第二条带中的空隙与每个从而在入口和出口之间形成通道。

7. 发明授权

US07447029B2 Vapor chamber for dissipation heat generated by electronic component 失效
标题翻译：用于电子部件产生的散热的蒸气室
公开(公告)号：US07447029B2
公开(公告)日：2008-11-04
申请号：US11308231
申请日：2006-03-14
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.
摘要翻译：蒸气室包括用于接触发热部件（500），盖（200），位于基座中的第一多孔毛细管板（300）和位于所述第二多孔毛细管板（400）中的基座（100）覆盖并面向第一多孔毛细管片。基座包括从基座延伸以与盖子热连接的块体（130）。盖子安装在基座上，与基座一起形成一个密封的容器。第一和第二多孔毛细管片一起形成外壳并容纳在容器中，并且块延伸穿过第一和第二多孔毛细管片并与其接合。

8. 发明申请

US20080053641A1 MINIATURE LIQUID COOLING DEVICE HAVING AN INTEGRAL PUMP 失效
标题翻译：具有整体泵的微型液体冷却装置
公开(公告)号：US20080053641A1
公开(公告)日：2008-03-06
申请号：US11309612
申请日：2006-08-31
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： B29C47/88 , F24H3/02
CPC分类号： H01L23/473 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).
摘要翻译：微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。收容空间由外壳封闭。吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

9. 发明授权

US07301774B2 Universal locking device for heat sink 失效
标题翻译：通用散热器锁紧装置
公开(公告)号：US07301774B2
公开(公告)日：2007-11-27
申请号：US11210130
申请日：2005-08-23
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Shao-Long Zhai , Zhi-Yong Zhou
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.
摘要翻译：用于将散热器固定到发热部件的锁定装置包括锁定板，多个锁定脚，每个锁定脚可枢转地附接到锁定板，以及多个锁定构件，其连接到锁定脚。多个锁定脚中的相邻的两个能够从锁定脚彼此分开的第一位置朝向彼此旋转，锁定构件将第一安装位置限定到锁定脚堆叠的第二位置以及限定第二安装位置的锁定构件。

10. 发明申请

US20070246204A1 LIQUID-COOLING DEVICE 失效
标题翻译：液体冷却装置
公开(公告)号：US20070246204A1
公开(公告)日：2007-10-25
申请号：US11309491
申请日：2006-08-11
申请人： CHENG-TIEN LAI , Zhi-Yong Zhou
发明人： CHENG-TIEN LAI , Zhi-Yong Zhou
IPC分类号： F28F3/00
CPC分类号： F28F3/086 , F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling device includes a base, a housing and a heat exchanger. The base and the housing enclose a chamber which receives the heat exchanger therein. Inlet and outlet for liquid are provided at the housing. The heat exchanger includes stacked flakes. Each flake includes parallel and alternately arranged first and second strips each having a void defined therein. The flakes are stacked in a manner such that each first strip overlays and abuts against a corresponding second strip of an adjacent flake and that the void in each first strip and the void in the corresponding second strip of the adjacent flake are in fluid communication with each other to thereby form a channel between the inlet and the outlet.
摘要翻译：液体冷却装置包括基座，壳体和热交换器。基座和壳体包围容纳热交换器的腔室。在壳体处设有用于液体的入口和出口。热交换器包括堆积的薄片。每个薄片包括平行且交替布置的第一和第二条带，每个带有限定在其中的空隙。薄片以这样的方式堆叠，使得每个第一条覆盖并邻接相邻片状物的对应的第二条带，并且每个第一条带中的空隙和相邻片状物的相应第二条带中的空隙与每个从而在入口和出口之间形成通道。

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