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1. 发明授权

US09096044B2 Flexible display panel and method of fabricating the same 有权
标题翻译：柔性显示面板及其制造方法
公开(公告)号：US09096044B2
公开(公告)日：2015-08-04
申请号：US13167741
申请日：2011-06-24
申请人： Cheng-Chung Chen , Keh-Long Hwu , Chih-Jen Hu
发明人： Cheng-Chung Chen , Keh-Long Hwu , Chih-Jen Hu
IPC分类号： G03G7/00 , B32B9/04 , B32B9/00 , B32B37/02 , H01L27/00 , H01L51/00 , H01L29/66 , B32B38/00 , G02F1/1333
CPC分类号： B32B37/02 , B32B38/0004 , B32B2310/0843 , B32B2457/202 , B32B2457/206 , G02F1/133305 , G02F2202/28 , H01L27/00 , H01L29/66 , H01L51/00 , Y10T428/24802 , Y10T428/31504
摘要： In a method of fabricating a flexible display panel, a rigid substrate is provided. A flexible substrate having a first surface and a second surface opposite to the first surface is provided. A plurality of releasing-regions are formed on the first surface, and bonding strength of an area outside the releasing-regions is greater than bonding strength of the releasing-regions. An adhesive layer is formed between the rigid substrate and the first surface of the flexible substrate. A plurality of display units are formed on the second surface, and each of the display units is located over one of the releasing-regions, respectively. The flexible substrate is patterned to obtain a plurality of flexible carriers, and each of the flexible carriers carries one of the display units, respectively. The flexible carriers and the adhesive layer are de-bonded.
摘要翻译：在制造柔性显示面板的方法中，提供刚性衬底。提供具有第一表面和与第一表面相对的第二表面的柔性基板。在第一表面上形成多个释放区域，并且释放区域之外的区域的结合强度大于释放区域的结合强度。在刚性基板和柔性基板的第一表面之间形成粘合剂层。多个显示单元形成在第二表面上，并且每个显示单元分别位于一个释放区域上。图案化柔性基板以获得多个柔性载体，并且每个柔性载体分别承载显示单元之一。柔性载体和粘合剂层脱粘合。

2. 发明申请

US20110318544A1 FLEXIBLE DISPLAY PANEL AND METHOD OF FABRICATING THE SAME 有权
标题翻译：柔性显示面板及其制造方法
公开(公告)号：US20110318544A1
公开(公告)日：2011-12-29
申请号：US13167741
申请日：2011-06-24
申请人： Cheng-Chung Chen , Keh-Long Hwu , Chih-Jen Hu
发明人： Cheng-Chung Chen , Keh-Long Hwu , Chih-Jen Hu
IPC分类号： B32B3/16 , B32B9/00 , B32B38/10
CPC分类号： B32B37/02 , B32B38/0004 , B32B2310/0843 , B32B2457/202 , B32B2457/206 , G02F1/133305 , G02F2202/28 , H01L27/00 , H01L29/66 , H01L51/00 , Y10T428/24802 , Y10T428/31504
摘要： In a method of fabricating a flexible display panel, a rigid substrate is provided. A flexible substrate having a first surface and a second surface opposite to the first surface is provided. A plurality of releasing-regions are formed on the first surface, and bonding strength of an area outside the releasing-regions is greater than bonding strength of the releasing-regions. An adhesive layer is formed between the rigid substrate and the first surface of the flexible substrate. A plurality of display units are formed on the second surface, and each of the display units is located over one of the releasing-regions, respectively. The flexible substrate is patterned to obtain a plurality of flexible carriers, and each of the flexible carriers carries one of the display units, respectively. The flexible carriers and the adhesive layer are de-bonded.
摘要翻译：在制造柔性显示面板的方法中，提供刚性衬底。提供具有第一表面和与第一表面相对的第二表面的柔性基板。在第一表面上形成多个释放区域，并且释放区域之外的区域的结合强度大于释放区域的结合强度。在刚性基板和柔性基板的第一表面之间形成粘合剂层。多个显示单元形成在第二表面上，并且每个显示单元分别位于一个释放区域上。图案化柔性基板以获得多个柔性载体，并且每个柔性载体分别承载显示单元之一。柔性载体和粘合剂层脱粘合。

3. 发明授权

US09656600B2 Vehicular side view mirror including an illuminating device 有权
公开(公告)号：US09656600B2
公开(公告)日：2017-05-23
申请号：US14882142
申请日：2015-10-13
申请人： Cheng-Chung Chen
发明人： Cheng-Chung Chen
IPC分类号： B60Q1/00 , B60Q3/00 , F21V11/00 , F21V15/01 , B60Q1/26 , B60R1/00
CPC分类号： B60Q1/2661 , B60Q1/0088 , B60Q1/2665 , B60R1/006 , B60R1/1207
摘要： A vehicular side view minor includes a minor seat having an engagement portion. A light-impermeable first annular wall protrudes rearwards from an inner periphery of a through-hole in the engagement portion. A minor is mounted in front of the minor seat and includes a reflective layer. A light-permeable housing is mounted to the engagement portion and has a second annular wall extending through the first annular wall. A front wall of the second annular wall includes an optical lens portion. A circuit board is received in the housing and has a lighting element. The circuit board includes a periphery abutting an abutment portion of the second annular wall. A gluing material is filled in a gluing space behind the circuit board and sealingly covers a rear surface of the circuit board, front sections of two wires, and a portion of the second annular wall to form a sealing portion.

4. 发明授权

US07833827B1 Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base 失效
标题翻译：制造具有凸起端子，填充物和绝缘基底的半导体芯片组件的方法
公开(公告)号：US07833827B1
公开(公告)日：2010-11-16
申请号：US11708839
申请日：2007-02-21
申请人： Charles W. C. Lin , Cheng-Chung Chen
发明人： Charles W. C. Lin , Cheng-Chung Chen
IPC分类号： H01L23/48
CPC分类号： H01L21/4832 , H01L21/4846 , H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/24 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L25/0657 , H01L2221/68345 , H01L2221/68359 , H01L2221/68377 , H01L2224/05554 , H01L2224/18 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/83385 , H01L2224/92247 , H01L2225/0651 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0134 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H01L2924/3512 , H01L2924/3651 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2924/00012 , H01L2924/00015
摘要： A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then forming an insulative base that covers a peripheral portion of the bumped terminal.
摘要翻译：制造半导体芯片组件的方法包括提供金属基座，布线线，凸起端子和填充物，其中布线线接触凸起端子和填充物，然后机械地将半导体芯片附接到金属基底，布线线，凸起端子和填料，然后形成密封剂，然后蚀刻金属基底以暴露凸起的端子，然后形成覆盖凸起端子的周边部分的绝缘基底。

5. 发明申请

US20100224832A1 Modified nano-dot, fabrication method thereof and composition element thereof 审中-公开
标题翻译：改性纳米点，其制造方法及其组成元素
公开(公告)号：US20100224832A1
公开(公告)日：2010-09-09
申请号：US12660556
申请日：2010-03-01
申请人： Jwo-Huei Jou , Wei-Ben Wang , Mao-Feng Hsu , Cheng-Chung Chen
发明人： Jwo-Huei Jou , Wei-Ben Wang , Mao-Feng Hsu , Cheng-Chung Chen
IPC分类号： C09K11/06
CPC分类号： H05B33/22 , B82Y30/00 , C01P2004/64 , C01P2006/40 , C09C1/3081 , H01L51/5012
摘要： The present invention discloses a modified nano-dot and a fabrication method thereof. The modified nano-dot comprises a surface portion having a functional group and a core portion comprising a polymeric metal oxide, polymeric metalloid oxide or polymeric metal alloy oxide. The mean particle size of the modified nano-dot is 1-100 nm, preferably 1-10 nm. The modified nano-dot capable of modulating a carrier flux can be further applied to the element manufacture in the organic semiconductor industry, optoelectronics industry, and solar cell industry.
摘要翻译：本发明公开了一种改性纳米点及其制造方法。修饰的纳米点包括具有官能团的表面部分和包含聚合物金属氧化物，聚合物类金属氧化物或聚合物金属合金氧化物的芯部分。改性纳米点的平均粒径为1-100nm，优选1-10nm。能够调制载流子的改性纳米点可以进一步应用于有机半导体工业，光电子工业和太阳能电池工业中的元件制造。

6. 发明授权

US07736483B2 Method for electroplating metal wire 有权
标题翻译：电镀金属丝的方法
公开(公告)号：US07736483B2
公开(公告)日：2010-06-15
申请号：US11625269
申请日：2007-01-19
申请人： Chun-Yau Huang , Cheng-Chung Chen , Yong-Fu Wu , Cheng-Hung Tsai , Chwan-Gwo Chyau , Fang-Tsun Chu
发明人： Chun-Yau Huang , Cheng-Chung Chen , Yong-Fu Wu , Cheng-Hung Tsai , Chwan-Gwo Chyau , Fang-Tsun Chu
IPC分类号： C25D5/02 , H01L21/00
CPC分类号： C25D5/10 , C25D5/02 , C25D5/34 , C25D7/0607
摘要： A method for electroplating low-resistance metal wire for resolving the problem to fabricate the metal wire on large-area substrate through the technology of photolithographing and etching in the prior art. Then the invention improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) (GOLDD).
摘要翻译：一种电镀低电阻金属线的方法，用于解决现有技术中通过光刻和蚀刻技术在大面积基板上制造金属线的问题。然后，本发明改进了大面积衬底上电路的RC延迟特性，并减少了用于处理栅极重叠轻掺杂漏极（源极）（GOLDD）的结构的掩模的数量。

7. 发明授权

US07453140B1 Semiconductor chip assembly with laterally aligned filler and insulative base 失效
标题翻译：具有横向排列的填料和绝缘基底的半导体芯片组件
公开(公告)号：US07453140B1
公开(公告)日：2008-11-18
申请号：US11604578
申请日：2006-11-27
申请人： Charles W. C. Lin , Cheng-Chung Chen
发明人： Charles W. C. Lin , Cheng-Chung Chen
IPC分类号： H01L23/495 , H01L23/48 , H01L23/04
CPC分类号： H01L23/3128 , H01L21/4832 , H01L21/486 , H01L21/6835 , H01L23/49827 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L2224/04105 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05548 , H01L2224/05569 , H01L2224/056 , H01L2224/13008 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/351 , H01L2924/3512 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/32245 , H01L2224/48247
摘要： A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant and an insulative base. The routing line contacts the filler and extends laterally beyond the filler, and the filler contacts the insulative base in an aperture that extends through the insulative base.
摘要翻译：半导体芯片组件包括：半导体芯片，其包括导电焊盘，包括布线线和填充物的导电迹线，将布线线和焊盘电连接的连接接头，密封剂和绝缘基底。布线线接触填料并横向延伸穿过填料，填料与绝缘基体接触，孔穿过绝缘基体。

8. 发明申请

US20060164854A1 Onboard lamp fixture for a vehicle 审中-公开
标题翻译：用于车辆的车载灯具
公开(公告)号：US20060164854A1
公开(公告)日：2006-07-27
申请号：US11043919
申请日：2005-01-24
申请人： Cheng-Chung Chen
发明人： Cheng-Chung Chen
IPC分类号： B60Q1/00
CPC分类号： B60Q1/2626 , B60Q1/263
摘要： An onboard lamp fixture for a vehicle includes a hollow conical body. The conical body is divided into a top portion having multiple flanges formed on an outer periphery of the top portion and multiple indentations each defined between two adjacent flanges, a middle portion having multiple intermittently formed threads on an outer periphery of the middle portion and annular gaps each defined between two adjacent threads and a bottom portion. After the conical body is extended through a through hole, a bottom face defining the annular gap of each thread is able to engage with an outer periphery defining the through hole and the flanges are able to securely engage with an inner periphery defining the through hole to secure the conical body.
摘要翻译：用于车辆的车载灯具包括中空圆锥体。圆锥体被分成具有形成在顶部的外周上的多个凸缘的顶部部分和分别限定在两个相邻的凸缘之间的多个凹口，在中间部分的外周上具有多个间歇形成的螺纹的中间部分和环形间隙每个限定在两个相邻的螺纹和底部之间。在锥形体延伸穿过通孔之后，限定每个螺纹的环形间隙的底面能够与限定通孔的外周接合，并且凸缘能够与限定通孔的内周牢固地接合，固定锥体。

9. 发明申请

US20050068245A1 Reflective signal booster for omini-antenna 审中-公开
标题翻译：用于小型天线的反射信号增强器
公开(公告)号：US20050068245A1
公开(公告)日：2005-03-31
申请号：US10672542
申请日：2003-09-25
申请人： Cheng-Chung Chen
发明人： Cheng-Chung Chen
IPC分类号： H01Q15/18 , H01Q19/10
CPC分类号： H01Q15/18 , H01Q19/106
摘要： A reflective signal booster for omni-directional antenna is applicable to a tube or flat omni-directional dipole antenna for changing the antenna from an omni-directional type into a directional type, preventing interference of the radiation of the antenna with other equipments, and improving the antenna gain. The signal booster which can be attached easily to an antenna is composed of a reflector formed by two metal plates forming an included angle that is fixed by an angle fixer. The antenna is supported by a supported member and thus properly located between the metal plates. Thus, electromagnetic waves from the antenna and traveling toward the metal plates is blocked and reflected toward a front opening formed between the metal plates whereby signal intensity in a frontward direction is enhanced and interference with equipments located behind the metal plates is eliminated.
摘要翻译：用于全向天线的反射信号增强器适用于管或平面全向偶极天线，用于将天线从全向改变为定向型，防止天线与其他设备的辐射干扰，并改善天线增益。可以容易地附接到天线的信号增强器由形成由角度定影器固定的夹角的两个金属板形成的反射器构成。天线由支撑的构件支撑，因此适当地位于金属板之间。因此，来自天线的电磁波向金属板移动，被阻挡并朝着形成在金属板之间的前开口反射，从而增强了向前方向的信号强度，并且消除了位于金属板后面的设备的干扰。

10. 发明授权

US06844143B2 Sandwich photoresist structure in photolithographic process 有权
标题翻译：光刻工艺中的三明治光刻胶结构
公开(公告)号：US06844143B2
公开(公告)日：2005-01-18
申请号：US10064649
申请日：2002-08-02
申请人： Benjamin Szu-Min Lin , Vencent Chang , George Liu , Cheng-Chung Chen
发明人： Benjamin Szu-Min Lin , Vencent Chang , George Liu , Cheng-Chung Chen
IPC分类号： G03F7/00 , H01L21/027 , H01L21/311 , H01L21/768 , G03F7/20
CPC分类号： G03F7/0035 , H01L21/0271 , H01L21/31144 , H01L21/76807 , Y10S430/151
摘要： A photolithographic process that involves building a sandwich photoresist structure. A first photoresist layer is formed over a substrate. An anti-reflection layer is formed over the first photoresist layer. A second photoresist layer is formed over the anti-reflection layer. A first photo-exposure is conducted and the exposed second photoresist layer is developed to pattern the second photoresist layer and the anti-reflection layer. Using the second photoresist layer and the anti-reflection layer as a mask, a second photo-exposure and a second photoresist development are conducted to pattern the first photoresist layer.
摘要翻译：涉及建立夹心光刻胶结构的光刻工艺。在衬底上形成第一光致抗蚀剂层。在第一光致抗蚀剂层上形成防反射层。在防反射层上形成第二光致抗蚀剂层。进行第一次曝光并且曝光的第二光致抗蚀剂层被显影以对第二光致抗蚀剂层和抗反射层进行图案化。使用第二光致抗蚀剂层和抗反射层作为掩模，进行第二光曝光和第二光致抗蚀剂显影以对第一光致抗蚀剂层进行图案化。

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