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    • 5. 发明授权
    • Carrier assembly for semiconductor IC (integrated circuit) packages
    • 半导体IC(集成电路)封装的载体组件
    • US06474477B1
    • 2002-11-05
    • US09847389
    • 2001-05-02
    • Ching T. Chang
    • Ching T. Chang
    • B65D8500
    • H01L21/67333H01L2221/68313
    • A semiconductor chip package carrier assembly is provided with a tray component having depending support legs that support multiple semiconductor chip packages in open package pockets, with a cover component having depending clamping legs in open package pockets that register with the tray component open package pockets, and with snap latches that securely and removably join the cover component to the tray component in a manner whereby each contained semiconductor chip package is locked by the depending support legs and depending clamping legs in a fixed position with respect to the tray and cover components throughout all spatial orientations of the assembly.
    • 半导体芯片封装载体组件设置有托盘部件,该托盘部件具有悬挂的支撑腿,该支撑腿支撑在开放封装袋中的多个半导体芯片封装,其中盖部件具有与托盘部件打开封装袋对准的开放封装袋中的固定夹持腿, 具有卡扣闩锁,其以可拆卸地将盖部件连接到托盘部件的方式使得每个所包含的半导体芯片封装被悬挂的支撑腿和相应的夹持腿锁定在相对于托盘的固定位置并且覆盖所有空间的部件 装配的方位。
    • 7. 发明授权
    • Triple minimum dispersion wavelengths for a high NA single-mode
step-index fiber
    • 用于高NA单模阶跃折射率光纤的三重最小色散波长
    • US4402570A
    • 1983-09-06
    • US253622
    • 1981-04-13
    • Ching T. Chang
    • Ching T. Chang
    • G02B5/14
    • G02B6/02223
    • Single-mode, step-index optical fibers can be fabricated which enable the deband long-distance duplex transmission of data at 1.3 .mu.m and 1.55 .mu.m, where attenuation and dispersion are both minimized. The appropriate index difference between the core and cladding materials and the dimensions of the core diameter are identified and selected to achieve minimum total dispersion at three discrete wavelengths in the single-mode, step-index fibers. The three minimum total dispersion wavelengths results from a cancellation between the material and waveguide dispersions which is owed to the proper selection of the parameters.
    • 可以制造单模,阶跃折射率光纤,使得能够在1.3μm和1.55μm的宽带长距离双工传输数据,其中衰减和色散都被最小化。 识别和选择芯和包层材料之间的适当的折射率差异和芯径的尺寸,以在单模,阶跃折射率光纤中实现三个离散波长处的最小总色散。 三个最小总色散波长是由材料和波导分散体之间的抵消导致的,这是由于适当选择参数而导致的。