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1. 发明授权

US08148747B2 Semiconductor chip assembly with post/base/cap heat spreader 有权
标题翻译：半导体芯片组件，带有底座/盖/散热器
公开(公告)号：US08148747B2
公开(公告)日：2012-04-03
申请号：US12626883
申请日：2009-11-28
申请人： Charles W. C. Lin , Chia-Chung Wang , David M. Sigmond
发明人： Charles W. C. Lin , Chia-Chung Wang , David M. Sigmond
IPC分类号： H01L33/00 , H01L23/34
CPC分类号： H01L21/486 , H01L23/3677 , H01L24/45 , H01L24/48 , H01L33/483 , H01L33/642 , H01L2224/32188 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12041 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H05K2203/0369 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post, a base and a cap. The post extends upwardly from the base into an opening in the adhesive, the base extends below and laterally from the post, and the cap extends above and laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal and the heat spreader provides thermal dissipation between the cap and the base.
摘要翻译：半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。半导体器件电连接到导电迹线并热连接到散热器。散热器包括柱子，底座和帽子。柱从基部向上延伸到粘合剂中的开口中，基部从柱延伸到下方和侧向，并且帽从柱上方和侧向延伸。粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。导电迹线提供垫和端子之间的信号路由，并且散热器在盖和基座之间提供散热。

2. 发明授权

US08148207B2 Method of making a semiconductor chip assembly with a post/base/cap heat spreader 有权
标题翻译：制造具有柱/底/盖散热器的半导体芯片组件的方法
公开(公告)号：US08148207B2
公开(公告)日：2012-04-03
申请号：US12626940
申请日：2009-11-30
申请人： Charles W. C. Lin , Chia-Chung Wang , David M. Sigmond
发明人： Charles W. C. Lin , Chia-Chung Wang , David M. Sigmond
IPC分类号： H01L21/00
CPC分类号： H01L21/486 , H01L23/3677 , H01L24/45 , H01L24/48 , H01L33/483 , H01L33/642 , H01L2224/32188 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12041 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H05K2203/0369 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
摘要翻译：一种制造半导体芯片组件的方法包括提供柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上，包括使导柱与导电层，然后使粘合剂在位于柱和导电层之间的孔中的间隙中向上流动，固化粘合剂，然后提供包括导电层的焊盘，端子和选定部分的导电迹线，提供在支柱上的盖子，将半导体器件安装在包括柱，基座和盖子的散热器上，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

3. 发明授权

US07811863B1 Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment 失效
标题翻译：制造具有金属柱和密封剂研磨和散热器附件的半导体芯片组件的方法
公开(公告)号：US07811863B1
公开(公告)日：2010-10-12
申请号：US12363765
申请日：2009-02-01
申请人： Charles W. C. Lin , Chia-Chung Wang , David M. Sigmond
发明人： Charles W. C. Lin , Chia-Chung Wang , David M. Sigmond
IPC分类号： H01L21/44
CPC分类号： H01L24/20 , H01L21/565 , H01L21/6835 , H01L23/3128 , H01L23/3677 , H01L23/42 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2221/68327 , H01L2221/68345 , H01L2221/68377 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05082 , H01L2224/051 , H01L2224/05118 , H01L2224/056 , H01L2224/05655 , H01L2224/11001 , H01L2224/11011 , H01L2224/11334 , H01L2224/1134 , H01L2224/116 , H01L2224/11849 , H01L2224/12105 , H01L2224/1301 , H01L2224/13111 , H01L2224/13147 , H01L2224/16225 , H01L2224/19 , H01L2224/2101 , H01L2224/2105 , H01L2224/215 , H01L2224/24227 , H01L2224/27001 , H01L2224/27011 , H01L2224/2901 , H01L2224/2902 , H01L2224/29082 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29191 , H01L2224/29198 , H01L2224/2929 , H01L2224/293 , H01L2224/3001 , H01L2224/301 , H01L2224/3205 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48655 , H01L2224/48799 , H01L2224/48855 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2224/8385 , H01L2224/83851 , H01L2224/83855 , H01L2224/83856 , H01L2224/8388 , H01L2224/85207 , H01L2224/92144 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/14 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/15724 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/00012 , H01L2924/2076 , H01L2924/00015 , H01L2221/68304
摘要： A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a metal pillar on the routing line, forming an encapsulant that covers the chip and the metal pillar, grinding the encapsulant without grinding the metal pillar, then grinding the encapsulant and the metal pillar such that the encapsulant and the metal pillar are laterally aligned, and then attaching a heat sink to the metal pillar.
摘要翻译：制造半导体芯片组件的方法包括将半导体芯片机械地附接到布线线，在布线线上形成金属柱，形成覆盖芯片和金属柱的密封剂，研磨密封剂而不研磨金属柱，然后研磨密封剂和金属柱，使得密封剂和金属柱横向对齐，然后将散热器附接到金属支柱。

4. 发明申请

US20100075448A1 METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/CAP HEAT SPREADER 有权
标题翻译：用POST / BASE / CAP HEAT SPREADER制造半导体芯片组件的方法
公开(公告)号：US20100075448A1
公开(公告)日：2010-03-25
申请号：US12626940
申请日：2009-11-30
申请人： Charles W.C. Lin , Chia-Chung Wang , David M. Sigmond
发明人： Charles W.C. Lin , Chia-Chung Wang , David M. Sigmond
IPC分类号： H01L33/00 , H01L23/48 , H01L23/36
CPC分类号： H01L21/486 , H01L23/3677 , H01L24/45 , H01L24/48 , H01L33/483 , H01L33/642 , H01L2224/32188 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12041 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H05K2203/0369 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
摘要翻译：一种制造半导体芯片组件的方法包括提供柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上，包括使导柱与导电层，然后使粘合剂在位于柱和导电层之间的孔中的间隙中向上流动，固化粘合剂，然后提供包括导电层的焊盘，端子和选定部分的导电迹线，提供在支柱上的盖子，将半导体器件安装在包括柱，基座和盖子的散热器上，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

5. 发明授权

US5116463A Detecting completion of electroless via fill 失效
标题翻译：检测无电解通孔的完成
公开(公告)号：US5116463A
公开(公告)日：1992-05-26
申请号：US717767
申请日：1991-06-19
申请人： Charles W. C. Lin , Randy L. German , Ian Y. K. Yee , David M. Sigmond
发明人： Charles W. C. Lin , Randy L. German , Ian Y. K. Yee , David M. Sigmond
IPC分类号： H01L21/48 , H05K3/42 , H05K3/46
CPC分类号： H05K3/422 , H01L21/4846 , H01L21/486 , H05K2203/163 , H05K3/4644
摘要： A method for detecting the completion of electrolessly depositing metal into a via. The method includes providing a non-autocatalytic detection mask with an opening over a via containing an autocatalytic material, electrolessly depositing a conductive metal into the via which fails to plate to the mask, and continuing the deposition until metal in the via contacts the mask, at which time the electrochemical potential of the mask changes and the metal plates to and covers the entire mask. The completion of the electroless via fill can be detected by changes in both the appearance and electrochemical potential of the mask.
摘要翻译：一种用于检测无电沉积金属到通孔中的完成方法。该方法包括提供非自动催化检测掩模，该通孔包含含有自催化材料的通孔，将导电金属无电沉积到通孔中，该通孔不能平铺于掩模上，并且继续沉积，直到通孔中的金属接触掩模，此时，掩模的电化学电位改变，金属板覆盖整个掩模。可以通过掩模的外观和电化学电位的变化来检测无电通孔填充物的完成。

6. 发明申请

US20100072510A1 SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/CAP HEAT SPREADER 有权
标题翻译：半导体芯片组件与POST / BASE / CAP热膨胀机
公开(公告)号：US20100072510A1
公开(公告)日：2010-03-25
申请号：US12626883
申请日：2009-11-28
申请人： Charles W.C. Lin , Chia-Chung Wang , David M. Sigmond
发明人： Charles W.C. Lin , Chia-Chung Wang , David M. Sigmond
IPC分类号： H01L33/00
CPC分类号： H01L21/486 , H01L23/3677 , H01L24/45 , H01L24/48 , H01L33/483 , H01L33/642 , H01L2224/32188 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12041 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H05K2203/0369 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post, a base and a cap. The post extends upwardly from the base into an opening in the adhesive, the base extends below and laterally from the post, and the cap extends above and laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal and the heat spreader provides thermal dissipation between the cap and the base.
摘要翻译：半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。半导体器件电连接到导电迹线并热连接到散热器。散热器包括柱子，底座和帽子。柱从基部向上延伸到粘合剂中的开口中，基部从柱延伸到下方和侧向，并且帽从柱上方和侧向延伸。粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。导电迹线提供垫和端子之间的信号路由，并且散热器在盖和基座之间提供散热。

7. 发明授权

US06794741B1 Three-dimensional stacked semiconductor package with pillars in pillar cavities 有权
标题翻译：三维堆叠半导体封装，在柱腔中具有支柱
公开(公告)号：US06794741B1
公开(公告)日：2004-09-21
申请号：US10137012
申请日：2002-04-30
申请人： Charles W. C. Lin , Cheng-Lien Chiang , David M. Sigmond
发明人： Charles W. C. Lin , Cheng-Lien Chiang , David M. Sigmond
IPC分类号： H01L2352
CPC分类号： H01L25/0657 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2225/06586 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies and a conductive bond. The first semiconductor chip assembly includes a first semiconductor chip and a first conductive trace with a first routing line and a first pillar. The second semiconductor chip assembly includes a second semiconductor chip and a second conductive trace with a second routing line and a second pillar. The chips are aligned with one another, the pillars are disposed outside the peripheries of the chips and aligned with one another, and the first pillar extends into a cavity in the second pillar. The conductive bond is within the cavity and contacts and electrically connects the pillars.
摘要翻译：三维堆叠半导体封装包括第一和第二半导体芯片组件和导电结合。第一半导体芯片组件包括第一半导体芯片和具有第一布线线和第一支柱的第一导电迹线。第二半导体芯片组件包括第二半导体芯片和具有第二布线线和第二支柱的第二导电迹线。芯片彼此对准，支柱设置在芯片的周边的外侧并彼此对准，并且第一柱延伸到第二柱的空腔中。导电结合在腔内，并接触并电连接支柱。

8. 发明授权

US09142237B1 Slider of a disk drive having data favorable load/unload attitude 有权
标题翻译：具有数据有利负载/卸载姿态的磁盘驱动器的滑块
公开(公告)号：US09142237B1
公开(公告)日：2015-09-22
申请号：US11441645
申请日：2006-05-26
申请人： Bernhard Hiller , David M. Sigmond
发明人： Bernhard Hiller , David M. Sigmond
IPC分类号： G11B21/02 , G11B5/60
CPC分类号： G11B5/6058 , G11B5/6029 , G11B21/12
摘要： A disk drive includes a drive housing, a storage disk, a head suspension assembly, an actuator assembly and a controller. The storage disk has a disk surface including a data region that stores data. In one embodiment, the head suspension assembly includes a slider and an attitude adjuster. The slider has an inner side edge, an outer side edge and a data transducer. The attitude adjuster can adjust a roll attitude and/or a pitch attitude of the slider relative to the disk surface. The slider moves between a first position wherein the data transducer is not positioned directly over the data region and a second position wherein the data transducer is positioned directly over the data region during one of a load operation and an unload operation. The controller controls an electrical signal to the attitude adjuster during one of the load operation and the unload operation to dynamically adjust the attitude of the slider. The attitude adjuster can include one or more piezoelectric elements that expand and/or contract to adjust the orientation of the slider relative to the storage disk.
摘要翻译：磁盘驱动器包括驱动器壳体，存储盘，磁头悬挂组件，致动器组件和控制器。存储盘具有包括存储数据的数据区域的磁盘表面。在一个实施例中，头悬挂组件包括滑块和姿态调节器。滑块具有内侧边缘，外侧边缘和数据传感器。姿态调节器可以相对于盘表面调节滑块的滚动姿态和/或俯仰姿态。滑块在数据传感器不直接位于数据区域上的第一位置和第二位置之间移动，其中在负载操作和卸载操作期间，数据传感器直接位于数据区域上方。在负载操作和卸载操作之一期间，控制器控制对姿态调节器的电信号，以动态地调节滑块的姿态。姿态调节器可以包括一个或多个压电元件，其膨胀和/或收缩以调节滑块相对于存储盘的取向。

9. 发明授权

US06687081B1 Disk drive using seek profile to enhance fly height control 失效
标题翻译：磁盘驱动器使用查找配置文件来增强飞行高度控制
公开(公告)号：US06687081B1
公开(公告)日：2004-02-03
申请号：US09570799
申请日：2000-05-15
申请人： Matthew O'Hara , Don Brunnet , Yu Sun , David M. Sigmond
发明人： Matthew O'Hara , Don Brunnet , Yu Sun , David M. Sigmond
IPC分类号： G11B5596
CPC分类号： G11B5/5547 , G11B5/5534 , G11B5/6011
摘要： A disk drive uses seek profile manipulation to provide enhanced transducer fly height control. The maximum seek velocity that is used during a seek operation is made dependent upon, among other things, the direction associated with the seek operation (i.e., either radially inward or radially outward with respect to the disk). In a preferred embodiment, the maximum seek velocity in a direction that normally results in a fly height loss is made less than the maximum seek velocity in the opposite direction. Thus, a minimum transducer fly height can be maintained with minimal effect on average seek time in the disk drive. In one approach, the maximum seek velocity values are stored within a lookup table within the disk drive.
摘要翻译：磁盘驱动器使用查找配置文件操作来提供增强的换能器飞行高度控制。在搜索操作期间使用的最大寻道速度取决于除了别的以外与寻道操作相关联的方向（即，相对于盘径向向内或径向向外）。在优选实施例中，使通常导致飞高高度损失的方向上的最大寻道速度小于相反方向上的最大寻道速度。因此，可以保持最小的传感器飞行高度，对磁盘驱动器中的平均寻道时间影响最小。在一种方法中，最大寻道速度值存储在磁盘驱动器内的查找表中。

10. 发明授权

US5219787A Trenching techniques for forming channels, vias and components in substrates 失效
标题翻译：用于在基底中形成通道，通孔和部件的沟槽技术
公开(公告)号：US5219787A
公开(公告)日：1993-06-15
申请号：US840428
申请日：1992-02-24
申请人： David H. Carey , Douglass A. Pietila , David M. Sigmond
发明人： David H. Carey , Douglass A. Pietila , David M. Sigmond
IPC分类号： H01L21/311 , H01L21/48 , H01L21/768 , H01L23/485 , H05K3/00 , H05K3/10 , H05K3/38 , H05K3/40 , H05K3/42 , H05K3/46
CPC分类号： H01L21/76808 , H01L21/31144 , H01L21/486 , H01L21/76804 , H01L23/485 , H05K3/0032 , H05K3/0041 , H05K3/005 , H01L2221/1026 , H01L2221/1031 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K2201/0166 , H05K2201/09563 , H05K2203/0108 , H05K2203/025 , H05K2203/0554 , H05K2203/0574 , H05K2203/107 , H05K2203/1189 , H05K3/0023 , H05K3/0035 , H05K3/107 , H05K3/388 , H05K3/4076 , H05K3/422 , H05K3/4644 , H05K3/4661
摘要： Trenching techniques for forming a channel partially through and a via completely through the insulating layer of a substrate are disclosed. With additional steps the channel can form an electrically conductive line, an electrode of an integrated capacitor, or an optical waveguide.
摘要翻译：公开了用于通过完全穿过衬底的绝缘层形成通道和通孔的沟槽的沟槽技术。通过附加步骤，通道可以形成导电线，集成电容器的电极或光波导。

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