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1. 发明申请

US20120325667A1 MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS 失效
标题翻译：用于均匀镀合金的多阳极系统
公开(公告)号：US20120325667A1
公开(公告)日：2012-12-27
申请号：US13604666
申请日：2012-09-06
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
IPC分类号： C25D3/00 , C25D3/56 , C25D21/12
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译：公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例。该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。

2. 发明申请

US20080179192A1 MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS 有权
标题翻译：用于均匀镀合金的多阳极系统
公开(公告)号：US20080179192A1
公开(公告)日：2008-07-31
申请号：US11627494
申请日：2007-01-26
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
IPC分类号： C25D3/56 , C25D17/00
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译：公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例。该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。

3. 发明授权

US08623194B2 Multi-anode system for uniform plating of alloys 失效
标题翻译：用于均匀电镀合金的多阳极系统
公开(公告)号：US08623194B2
公开(公告)日：2014-01-07
申请号：US13604666
申请日：2012-09-06
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
IPC分类号： C25D3/56
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译：公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例。该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。

4. 发明授权

US09035459B2 Structures for improving current carrying capability of interconnects and methods of fabricating the same 有权
标题翻译：用于改善互连的载流能力的结构及其制造方法
公开(公告)号：US09035459B2
公开(公告)日：2015-05-19
申请号：US12421723
申请日：2009-04-10
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Timothy H. Daubenspeck , Krystyna W. Semkow , Timothy D. Sullivan
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Timothy H. Daubenspeck , Krystyna W. Semkow , Timothy D. Sullivan
IPC分类号： C23C14/24 , H01L23/00 , C25D5/02 , C25D5/14 , C25D5/48
CPC分类号： H01L24/05 , C25D5/02 , C25D5/14 , C25D5/48 , H01L24/11 , H01L2224/0401 , H01L2224/05075 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/013 , H01L2924/01027
摘要： Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.
摘要翻译：提供互连结构及其制造方法。互连结构提供用于改善载流能力（例如，电流扩展）的高可靠性铜互连结构。该结构包括在沟槽中形成的凸块下金属。凸起下冶金至少包括：粘合层; 电镀阻挡层; 以及设置在粘合层和镀层阻挡层之间的镀覆导电金属层。该结构还包括形成在凸块下金属上的焊料凸块。

5. 发明授权

US08551303B2 Multi-anode system for uniform plating of alloys 失效
标题翻译：用于均匀电镀合金的多阳极系统
公开(公告)号：US08551303B2
公开(公告)日：2013-10-08
申请号：US13406679
申请日：2012-02-28
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
IPC分类号： C25B9/00 , C25B9/06
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译：公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例。该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。

6. 发明授权

US08803317B2 Structures for improving current carrying capability of interconnects and methods of fabricating the same 有权
标题翻译：用于改善互连的载流能力的结构及其制造方法
公开(公告)号：US08803317B2
公开(公告)日：2014-08-12
申请号：US13433974
申请日：2012-03-29
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Timothy H. Daubenspeck , Krystyna W. Semkow , Timothy D. Sullivan
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Timothy H. Daubenspeck , Krystyna W. Semkow , Timothy D. Sullivan
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/44 , H01L23/00
CPC分类号： H01L24/05 , C25D5/02 , C25D5/14 , C25D5/48 , H01L24/11 , H01L2224/0401 , H01L2224/05075 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/013 , H01L2924/01027
摘要： Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.
摘要翻译：提供互连结构及其制造方法。互连结构提供用于改善载流能力（例如，电流扩展）的高可靠性铜互连结构。该结构包括在沟槽中形成的凸块下金属。凸起下冶金至少包括：粘合层; 电镀阻挡层; 以及设置在粘合层和镀层阻挡层之间的镀覆导电金属层。该结构还包括形成在凸块下金属上的焊料凸块。

7. 发明申请

US20120152750A1 MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS 失效
公开(公告)号：US20120152750A1
公开(公告)日：2012-06-21
申请号：US13406679
申请日：2012-02-28
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
IPC分类号： C25D5/00 , C25D17/00 , C25D17/12
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.

8. 发明授权

US08177945B2 Multi-anode system for uniform plating of alloys 有权
标题翻译：用于均匀电镀合金的多阳极系统
公开(公告)号：US08177945B2
公开(公告)日：2012-05-15
申请号：US11627494
申请日：2007-01-26
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
IPC分类号： C25B9/00
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译：公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例。该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。

9. 发明申请

US20100258335A1 STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNECTS AND METHODS OF FABRICATING THE SAME 有权
标题翻译：提高互连电流承载能力的结构及其制作方法
公开(公告)号：US20100258335A1
公开(公告)日：2010-10-14
申请号：US12421723
申请日：2009-04-10
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Timothy H. Daubenspeck , Krystyna W. Semkow , Timothy D. Sullivan
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Timothy H. Daubenspeck , Krystyna W. Semkow , Timothy D. Sullivan
IPC分类号： H01B5/00 , C25D5/14
CPC分类号： H01L24/05 , C25D5/02 , C25D5/14 , C25D5/48 , H01L24/11 , H01L2224/0401 , H01L2224/05075 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/013 , H01L2924/01027
摘要： Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.
摘要翻译：提供互连结构及其制造方法。互连结构提供用于改善载流能力（例如，电流扩展）的高可靠性铜互连结构。该结构包括在沟槽中形成的凸块下金属。凸起下冶金至少包括：粘合层; 电镀阻挡层; 以及设置在粘合层和镀层阻挡层之间的镀覆导电金属层。该结构还包括形成在凸块下金属上的焊料凸块。

10. 发明申请

US20090267228A1 INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE 失效
标题翻译：中间扩散块装置及其制造方法
公开(公告)号：US20090267228A1
公开(公告)日：2009-10-29
申请号：US12111510
申请日：2008-04-29
申请人： Charles L. Arvin , Carla A. Bailey , Harry D. Cox , Hua Gan , Hsichang Liu , Arthur G. Merryman , Vall F. McClean , Srinivasa S. N. Reddy , Brian R. Sundlof
发明人： Charles L. Arvin , Carla A. Bailey , Harry D. Cox , Hua Gan , Hsichang Liu , Arthur G. Merryman , Vall F. McClean , Srinivasa S. N. Reddy , Brian R. Sundlof
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/03462 , H01L2224/03472 , H01L2224/03831 , H01L2224/0401 , H01L2224/05011 , H01L2224/05017 , H01L2224/05147 , H01L2224/05166 , H01L2224/05564 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2924/00013 , H01L2924/0002 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/14 , H01L2924/1461 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： One embodiment of the present invention is directed to an under bump metallurgy material. The under bump metallurgy material of this embodiment includes an adhesion layer and a conduction layer formed on top of the adhesion layer. The under bump metallurgy material of this embodiment also includes a barrier layer plated on top of the conduction layer and a sacrificial layer plated on top of the barrier layer. The conduction layer of this embodiment includes a trench formed therein, the trench contacting a portion of the barrier layer and blocking a path of intermetallic formation between the conduction layer and the sacrificial layer.
摘要翻译：本发明的一个实施例涉及一种凸块下金属材料。本实施方式的凸块状冶金材料包括粘合层和形成在粘合层顶部的导电层。该实施例的凸块下冶金材料还包括电镀在导电层顶部上的阻挡层和镀在阻挡层顶部上的牺牲层。该实施例的导电层包括在其中形成的沟槽，沟槽接触势垒层的一部分并且阻挡导电层和牺牲层之间的金属间形成路径。

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