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    • 7. 发明授权
    • Method and apparatus for removing material from microfeature workpieces
    • 从微型工件去除材料的方法和装置
    • US08105131B2
    • 2012-01-31
    • US12621366
    • 2009-11-18
    • Rodney C. KistlerAndrew Carswell
    • Rodney C. KistlerAndrew Carswell
    • B24B1/00
    • B24B37/22B24B37/24
    • Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent in the matrix. The hydro-control agent has a hydrophobicity that inhibits liquid from absorbing into the subpad. The hydro-control agent, for example, can be coupling agents that are generally hydrophobic, surfactants that are hydrophobic, or other agents that are compatible with the matrix and at least generally hydrophobic.
    • 从微型工件中去除材料的方法和设备。 根据本发明的子垫的一个实施例包括具有构造成支撑抛光介质的第一表面和与第一表面相对的第二表面的矩阵。 该实施例中的子垫还包括基质中的加氢控制剂。 加氢控制剂具有抑制液体吸收到亚垫中的疏水性。 例如,加氢控制剂可以是通常为疏水性的偶联剂,疏水性表面活性剂或与基质相容并且至少一般疏水的其它试剂。
    • 9. 发明授权
    • Afferent-based polishing media for chemical mechanical planarization
    • 用于化学机械平面化的基于传入的抛光介质
    • US06752693B1
    • 2004-06-22
    • US10206749
    • 2002-07-26
    • Rodney C. Kistler
    • Rodney C. Kistler
    • B24B4900
    • B24B37/24B24B49/10B24B49/16
    • One polishing media for chemical mechanical planarization includes an underlayer and a plurality of pressure sensors provided on the underlayer. At least some of the pressure sensors have a pad asperity provided thereon. The pressure sensors may be micro electromechanical systems (MEMS) pressure transducers or MEMS thermal actuators that monitor at least one of localized strain and temperature variation. Another polishing media includes a plurality of chemical sensors. Yet another polishing media includes pressure sensors, chemical sensors, and piezoelectric elements. Based upon the sensory outputs received from adjacent sensors, the piezoelectric elements provide active control to the process input by, for example, inducing localized vibration to modify the spatial removal behavior, inducing localized electric fields, or inducing localized heating/cooling elements.
    • 用于化学机械平面化的一种抛光介质包括底层和设置在底层上的多个压力传感器。 至少一些压力传感器具有设置在其上的垫粗糙度。 压力传感器可以是监测局部应变和温度变化中的至少一个的微机电系统(MEMS)压力换能器或MEMS热致动器。 另一抛光介质包括多个化学传感器。 另一种抛光介质包括压力传感器,化学传感器和压电元件。 基于从相邻传感器接收的感觉输出,压电元件通过例如引起局部振动来改变空间去除行为,诱导局部电场或引起局部加热/冷却元件,来为过程输入提供主动控制。