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1. 发明授权

US08453467B2 Hybrid heat exchanger 有权
标题翻译：混合式换热器
公开(公告)号：US08453467B2
公开(公告)日：2013-06-04
申请号：US11580671
申请日：2006-10-13
申请人： Charles D. Hood, III , Ioan Sauciuc , Mohammed Tantoush
发明人： Charles D. Hood, III , Ioan Sauciuc , Mohammed Tantoush
IPC分类号： F25B21/02 , F25D23/12
CPC分类号： G06F1/20 , F25B21/02 , F25B2321/0251 , F28D1/0408 , H01L23/38 , H01L35/30 , H01L37/00 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.
摘要翻译：热电冷却器组件包括冷板，第一热电冷却器和第二热电冷却器。冷板具有第一面和第二面。第一热电冷却器与冷板的第一侧热连通，第二热电冷却器与冷板的第二侧热连通。还公开了一种热交换器组件。

2. 发明申请

US20080087024A1 Hybrid heat exchanger 有权
标题翻译：混合式换热器
公开(公告)号：US20080087024A1
公开(公告)日：2008-04-17
申请号：US11580671
申请日：2006-10-13
申请人： Charles D. Hood , Ioan Sauciuc , Mohammed Tantoush
发明人： Charles D. Hood , Ioan Sauciuc , Mohammed Tantoush
IPC分类号： F25B21/02
CPC分类号： G06F1/20 , F25B21/02 , F25B2321/0251 , F28D1/0408 , H01L23/38 , H01L35/30 , H01L37/00 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.
摘要翻译：热电冷却器组件包括冷板，第一热电冷却器和第二热电冷却器。冷板具有第一面和第二面。第一热电冷却器与冷板的第一侧热连通，第二热电冷却器与冷板的第二侧热连通。还公开了一种热交换器组件。

3. 发明申请

US20130248153A1 DIRECT AIR IMPINGMENT COOLING OF PACKAGE STRUCTURES 有权
标题翻译：包装结构的直接空气侵入冷却
公开(公告)号：US20130248153A1
公开(公告)日：2013-09-26
申请号：US13992422
申请日：2011-12-30
申请人： Ioan Sauciuc
发明人： Ioan Sauciuc
IPC分类号： F28D15/04 , F28F23/00 , F28F13/06
CPC分类号： F28D15/04 , F28D15/0275 , F28F13/06 , F28F23/00 , F28F2260/02 , H01L23/467 , H01L23/4735 , H01L2224/73204 , H01L2224/73253 , H01L2924/1461 , H01L2924/00
摘要： Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.
摘要翻译：描述微电子封装冷却组件的各种实施例。这些实施例包括冷却组件，其包括耦合到散热器的垂直分离的微通道的阵列，其中散热器是无鳍的，并且其中每个入口微通道具有两个相邻的出口微通道。单个垂直分离的微通道之间的距离包括小于约20微米，并且热管嵌入散热器中。

4. 发明授权

US07779638B2 Localized microelectronic cooling apparatuses and associated methods and systems 有权
标题翻译：本地化微电子冷却装置及相关方法和系统
公开(公告)号：US07779638B2
公开(公告)日：2010-08-24
申请号：US11319297
申请日：2005-12-27
申请人： Ioan Sauciuc , Gregory M. Chrysler
发明人： Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25D19/006 , H01L23/3677 , H01L23/38 , H01L2224/16 , H01L2924/12044
摘要： Apparatuses and associated methods and systems to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a microelectronic cooling apparatus comprising a microelectronic device thermally coupled to one or more thermally conductive pin(s) provides cooling to one or more hot spot(s) of the microelectronic device.
摘要翻译：通常描述用于向微电子器件提供局部冷却的装置和相关方法和系统。在这方面，根据一个示例性实施例，包括热耦合到一个或多个导热引脚的微电子器件的微电子冷却装置向微电子器件的一个或多个热点提供冷却。

5. 发明授权

US07532476B2 Flow solutions for microelectronic cooling 有权
标题翻译：微电子冷却流程解决方案
公开(公告)号：US07532476B2
公开(公告)日：2009-05-12
申请号：US11479584
申请日：2006-06-29
申请人： Ioan Sauciuc
发明人： Ioan Sauciuc
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Flow solutions for cooling one or more microelectronic device(s) are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat sink base coupled with a plurality of fins includes a first pathway for a fluid to flow across one or more of the fins and a second pathway for a fluid to flow across one or more fins in a direction substantially opposite the fluid in the first pathway.
摘要翻译：通常描述用于冷却一个或多个微电子器件的流动解决方案。在这方面，根据一个示例性实施例，包括与多个翅片联接的散热器底座的冷却装置包括用于流体流过一个或多个翅片的第一路径和用于流体流过的第二路径在与第一路径中的流体基本上相反的方向上的一个或多个翅片。

6. 发明授权

US07510418B1 Loading mechanisms for integrated circuit (IC) packages 有权
标题翻译：集成电路（IC）封装的装载机制
公开(公告)号：US07510418B1
公开(公告)日：2009-03-31
申请号：US11931805
申请日：2007-10-31
申请人： Ward Scott , Hong Xie , Ioan Sauciuc
发明人： Ward Scott , Hong Xie , Ioan Sauciuc
IPC分类号： H01R13/62
CPC分类号： H01L23/4093 , H01L2224/16 , H01L2224/73204 , H01R12/714 , H01R12/88
摘要： Disclosed is a socket assembly comprising a retention mechanism, a circuit board, an IC socket, a heat sink unit and a loading mechanism. The retention mechanism includes a support plate, on which the circuit board, the IC socket comprising die and package, and the heat sink unit are stacked respectively. The retention mechanism further includes a plurality of standoffs perpendicular to the support plate and include a pair of latches at different heights. The loading mechanism includes a loading plate configured on end portions of the standoffs and a pair of downwardly extending clips that are capable of engaging to the latches on the both standoffs. Correspondingly, the circuit board, the IC socket and the heat sink unit are sandwiched between the loading plate and the support plate. The heights of the pair of latches on the standoffs are based on the die and package in the IC socket.
摘要翻译：公开了一种插座组件，其包括保持机构，电路板，IC插座，散热器单元和装载机构。保持机构包括支撑板，电路板，包含芯片和封装的IC插座和散热单元分别堆叠在支撑板上。保持机构还包括垂直于支撑板的多个支座，并且包括在不同高度处的一对闩锁。装载机构包括配置在支座的端部上的装载板和能够与两个支座上的闩锁接合的一对向下延伸的夹子。相应地，电路板，IC插座和散热单元夹在装载板和支撑板之间。支架上的这对闩锁的高度基于IC插座中的裸片和封装。

7. 发明申请

US20080218972A1 Cooling device, system containing same, and cooling method 审中-公开
标题翻译：冷却装置，含有其的系统和冷却方法
公开(公告)号：US20080218972A1
公开(公告)日：2008-09-11
申请号：US11714333
申请日：2007-03-06
申请人： Ioan Sauciuc , Seri Lee , Alin Ila , Steven Girouard , Javier Leija , Behre Mulugeta
发明人： Ioan Sauciuc , Seri Lee , Alin Ila , Steven Girouard , Javier Leija , Behre Mulugeta
IPC分类号： H05K7/20 , F28F13/00
CPC分类号： F04D33/00 , F04D29/582 , F28F3/02 , F28F13/10 , H01L23/467 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： A cooling device includes a heat sink (110) having a plurality of fins (111) and a piezoelectric assembly (120) having an actuator (121) and a plurality of blades (122) coupled to the actuator. The actuator includes a plurality of metal electrodes (227) and a plurality of piezoelectric layers (228). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.
摘要翻译：冷却装置包括具有多个翅片（111）和具有致动器（121）的压电组件（120）和耦合到致动器的多个叶片（122）的散热器（110）。致动器包括多个金属电极（227）和多个压电层（228）。散热片的翅片与压电组件的叶片相互缠绕。

8. 发明申请

US20080006389A1 Preventing burst-related hazards in microelectronic cooling systems 审中-公开
标题翻译：防止微电子冷却系统中爆炸相关危害
公开(公告)号：US20080006389A1
公开(公告)日：2008-01-10
申请号：US11477095
申请日：2006-06-27
申请人： Ioan Sauciuc , Gregory M. Chrysler , Je-Young Chang , Ravi Prasher
发明人： Ioan Sauciuc , Gregory M. Chrysler , Je-Young Chang , Ravi Prasher
IPC分类号： A23C3/02 , H01L23/34
CPC分类号： F28D15/00 , F28F2250/06 , F28F2265/12 , H05K7/20272
摘要： Devices and associated methods to prevent burst-related hazards by providing pressure relief in a microelectronic cooling system are generally described. In this regard, according to one example embodiment, a pump outlet line includes at least one pressure relief indentation to rupture along the indentation at a selected pressure to prevent burst-related hazards in a microelectronic cooling system.
摘要翻译：通常描述了通过在微电子冷却系统中提供压力释放来防止爆发相关危害的装置和相关方法。在这方面，根据一个示例性实施例，泵出口管线包括至少一个压力释放压痕，以在选定的压力下沿着压痕破裂，以防止微电子冷却系统中的突发相关危险。

9. 发明申请

US20080002359A1 Flow solutions for microelectronic cooling 有权
标题翻译：微电子冷却流程解决方案
公开(公告)号：US20080002359A1
公开(公告)日：2008-01-03
申请号：US11479584
申请日：2006-06-29
申请人： Ioan Sauciuc
发明人： Ioan Sauciuc
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Flow solutions for cooling one or more microelectronic device(s) are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat sink base coupled with a plurality of fins includes a first pathway for a fluid to flow across one or more of the fins and a second pathway for a fluid to flow across one or more fins in a direction substantially opposite the fluid in the first pathway.
摘要翻译：通常描述用于冷却一个或多个微电子器件的流动解决方案。在这方面，根据一个示例性实施例，包括与多个翅片联接的散热器底座的冷却装置包括用于流体流过一个或多个翅片的第一路径和用于流体流过的第二路径在与第一路径中的流体基本上相反的方向上的一个或多个翅片。

10. 发明申请

US20070297139A1 Heat sink with themoelectric module 有权
标题翻译：散热器与电力模块
公开(公告)号：US20070297139A1
公开(公告)日：2007-12-27
申请号：US11472927
申请日：2006-06-22
申请人： Brian A. Scott , Panl J. Gwin , Ioan Sauciuc
发明人： Brian A. Scott , Panl J. Gwin , Ioan Sauciuc
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F25B21/02 , H01L23/38 , H01L2924/0002 , H01L2924/00
摘要： An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.
摘要翻译：装置可以包括具有至少一个表面的导热散热芯，包括第一表面和第二表面的固态热泵，第一表面与芯的至少一个表面接触，并且热导电单元与固态热泵的第二表面接触。还包括可以是与导热单元接触的止动件，其至少部分地设置在由导热单元限定的空腔的第一端上，并且限定开口，以及穿过空腔的紧固件，与核心，并将核心偏向于停止。

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