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    • 2. 发明授权
    • Non-volatile memory device, non-volatile memory cell thereof and method of fabricating the same
    • 非易失性存储器件,其非易失性存储单元及其制造方法
    • US07759726B2
    • 2010-07-20
    • US11179294
    • 2005-07-12
    • Chao-Lun YuChao-I Wu
    • Chao-Lun YuChao-I Wu
    • H01L29/792
    • H01L29/792H01L21/28282H01L27/115H01L27/11568H01L29/4232H01L29/66833
    • The present invention disclosed a non-volatile memory device and fabricating method thereof. The structure of non-volatile memory device at least comprises a substrate, several dielectric strips, several bit lines, a dielectrically stacking multi-layer, and several word lines. The substrate has several recesses. The dielectric strips are formed on the substrate, and each of the recess is interposed between two adjacent dielectric strips. The bit lines are respectively formed on the dielectric strips. The dielectrically stacking multi-layer comprising a charge-trapping layer is disposed on the bit lines and the recesses. The word lines are formed on the dielectrically stacking multi-layer and intersecting to the bit lines. When a voltage is applied to the bit lines, a plurality of inversion regions are respectively generated on the substrate.
    • 本发明公开了一种非易失性存储器件及其制造方法。 非易失性存储器件的结构至少包括衬底,多个介质条,几个位线,介电层叠多层和多个字线。 基板有几个凹槽。 介质条形成在基板上,并且每个凹槽介于两个相邻的介质条之间。 位线分别形成在介质条上。 包含电荷捕获层的介电层叠多层设置在位线和凹部上。 字线形成在介电堆叠多层上并与位线相交。 当对位线施加电压时,在基板上分别产生多个反转区域。
    • 4. 发明申请
    • Non-volatile memory device, non-volatile memory cell thereof and method of fabricating the same
    • 非易失性存储器件,其非易失性存储单元及其制造方法
    • US20070012993A1
    • 2007-01-18
    • US11179294
    • 2005-07-12
    • Chao-Lun YuChao-I Wu
    • Chao-Lun YuChao-I Wu
    • H01L29/792
    • H01L29/792H01L21/28282H01L27/115H01L27/11568H01L29/4232H01L29/66833
    • The present invention disclosed a non-volatile memory device and fabricating method thereof. The structure of non-volatile memory device at least comprises a substrate, several dielectric strips, several bit lines, a dielectrically stacking multi-layer, and several word lines. The substrate has several recesses. The dielectric strips are formed on the substrate, and each of the recess is interposed between two adjacent dielectric strips. The bit lines are respectively formed on the dielectric strips. The dielectrically stacking multi-layer comprising a charge-trapping layer is disposed on the bit lines and the recesses. The word lines are formed on the dielectrically stacking multi-layer and intersecting to the bit lines. When a voltage is applied to the bit lines, a plurality of inversion regions are respectively generated on the substrate.
    • 本发明公开了一种非易失性存储器件及其制造方法。 非易失性存储器件的结构至少包括衬底,多个介质条,几个位线,介电层叠多层和多个字线。 基板有几个凹槽。 介质条形成在基板上,并且每个凹槽介于两个相邻的介质条之间。 位线分别形成在介质条上。 包含电荷捕获层的介电层叠多层设置在位线和凹部上。 字线形成在介电堆叠多层上并与位线相交。 当对位线施加电压时,在基板上分别产生多个反转区域。
    • 6. 发明授权
    • High second bit operation window method for virtual ground array with two-bit memory cells
    • 具有两位存储单元的虚拟接地阵列的高二位操作窗口方法
    • US08432745B2
    • 2013-04-30
    • US13184189
    • 2011-07-15
    • Chao-I Wu
    • Chao-I Wu
    • G11C16/00
    • H01L21/28282G11C16/0475G11C16/0491H01L27/11568H01L29/7923
    • A non-volatile VG memory array employing memory semiconductor cells capable of storing two bits of information having a non-conducting charge trapping dielectric, such as silicon nitride, layered in associating with at least one electrical insulating layer, such as an oxide, is disclosed. Bit lines of the memory array are capable of transmitting positive voltage to reach the source/drain regions of the memory cells of the array. A method that includes the hole injection erasure of the memory cells of the array that lowers the voltage threshold of the memory cells to a value lower than the initial voltage threshold of the cells is disclosed. The hole injection induced lower voltage threshold reduces the second bit effect such that the window of operation between the programmed and un-programmed voltage thresholds of the bits is widened. The programming and read steps reduce leakage current of the memory cells in the array.
    • 公开了一种采用存储器半导体单元的非易失性VG存储器阵列,该存储器半导体单元能够存储与至少一个电绝缘层(例如氧化物)相结合的分层的非导电电荷俘获电介质(例如氮化硅)的两比特信息。 。 存储器阵列的位线能够传输正电压以到达阵列的存储器单元的源极/漏极区域。 公开了一种方法,其包括将阵列的存储单元的空穴注入擦除将存储单元的电压阈值降低到低于单元的初始电压阈值的值。 空穴注入诱导的较低电压阈值降低了第二位效应,使得位的编程和未编程电压阈值之间的操作窗口变宽。 编程和读取步骤减少阵列中存储单元的泄漏电流。