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1. 发明专利

JP2008011333A Chip antenna connecting device 审中-公开
标题翻译：芯片天线连接设备
公开(公告)号：JP2008011333A
公开(公告)日：2008-01-17
申请号：JP2006181234
申请日：2006-06-30
申请人： Chant Sincere Co Ltd , 詮欣股▲分▼有限公司
发明人： HU CHUAN-LING , CHEN YU-WEI , LIAO CHANG-LUN , LIN SHUN-TIAN , YANG CHANG-FA , CHEN YEN-MING , WANG CHAO-WEI
IPC分类号： H01Q3/02 , H01Q1/12 , H01Q1/24 , H01Q3/24
摘要： PROBLEM TO BE SOLVED: To provide a chip antenna connecting device that ensures stable supporting force, enables a chip antenna to generate a desired antenna radiation pattern, and reduces the spatial region of a circuit board in the chip antenna for miniaturization.
SOLUTION: A connection seat 110b of the chip antenna connecting device 150b has a plurality of slots 120b. A different angle is formed between the slot 120b and the bottom surface of the connection seat 110b, thus changing an insertion position of the chip antenna 140b to the slot 120b depending on an angle corresponding to a radiation pattern, and hence increasing the degree of freedom in adjustment in the chip antenna 140b. The connection seat 110b has a connection circuit 112b for connecting an electronic unit 114b on the circuit board 130b to the chip antenna 140b. Each slot 120b has a contact 122b for connecting feeding 116b of the chip antenna 140b.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供确保稳定的支撑力的芯片天线连接装置，能够使芯片天线产生期望的天线辐射图案，并且减小芯片天线中的电路板的空间区域以进行小型化。解决方案：芯片天线连接装置150b的连接座110b具有多个槽120b。在槽120b和连接座110b的底面之间形成不同的角度，从而根据对应于辐射图案的角度改变芯片天线140b到狭槽120b的插入位置，并因此增加自由度在芯片天线140b中进行调整。连接座110b具有用于将电路板130b上的电子单元114b连接到芯片天线140b的连接电路112b。每个槽120b具有用于连接芯片天线140b的馈电116b的触点122b。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2006303957A System on chip for realizing mini antenna matching 审中-公开
标题翻译：用于实现微型天线匹配的芯片系统
公开(公告)号：JP2006303957A
公开(公告)日：2006-11-02
申请号：JP2005123467
申请日：2005-04-21
申请人： Chant Sincere Co Ltd , 詮欣股▲分▼有限公司
发明人： HU CHUAN-LING , LIN SHUN-TIAN , YANG CHANG-FA
IPC分类号： H04B1/40 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide a system on chip for realizing mini antenna matching.
SOLUTION: In an emission frequency wave module, each of active elements and each of passive elements are selected. A circuit board 2 is provided with, by using printing technology, a logical circuit and an antenna unit 3 and then there is provided a coupling device of each of the active and passive elements of the emission frequency wave module. In the antenna unit 3, a radiation conductor line of antenna is made up by a single or multiple input terminals and multiple bent lines to constitute a mini-type antenna unit 3. Via the components described above, after an emission frequency wave IC and the active and passive elements have been selected, the antenna unit 3 and a correlative circuit are distributed and arranged in the circuit board 2 together. A sealing outer packaging process is applied to the circuit board 2 by embedding projection, resin injection or the like, so that both upper and lower surfaces of the circuit board are each covered with a sealing outer packaging material 4. Thus, the circuit board involves the emission frequency wave module and the antenna unit 3 by means of sealing and outer packaging.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于实现小型天线匹配的芯片上系统。解决方案：在发射频率波模块中，选择每个有源元件和每个无源元件。电路板2通过使用打印技术设置有逻辑电路和天线单元3，然后提供发射频率波模块的有源和无源元件的耦合装置。在天线单元3中，天线的辐射导线由单个或多个输入端子和多条弯曲线构成，以构成微型天线单元3.通过上述组件，在发射频率波形IC和已选择有源和无源元件，天线单元3和相关电路一起分布并布置在电路板2中。通过嵌入突起，树脂注射等将电路板2施加密封外包装处理，使得电路板的上表面和下表面均被密封外包装材料4覆盖。因此，电路板包括发射频率波模块和天线单元3通过密封和外包装。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007221513A Casing of wireless communication product with common antenna 审中-公开
标题翻译：无线通信产品与普通天线的合作
公开(公告)号：JP2007221513A
公开(公告)日：2007-08-30
申请号：JP2006040403
申请日：2006-02-17
申请人： Chant Sincere Co Ltd , 詮欣股▲分▼有限公司
发明人： LIN SHUN-TIAN , YANG CHANG-FA , RYU JUNTAKU , HUANG KUO-LUN , CHEN YEN-MING , WANG CHAO-WEI , HU CHUAN-LING , CHEN YU-WEI , LIAO CHANG-LUN
IPC分类号： H01Q1/40 , H01Q1/22 , H01Q1/38 , H01Q1/44
摘要： PROBLEM TO BE SOLVED: To provide a casing of a wireless communication product with a common antenna.
SOLUTION: An antenna conductor circuit 2 selected in advance is integrally cast inside a casing 1. The antenna conductor circuit 2 is formed with a feed end 21 consisting of a plug needle or spring strip in advance. By being combined with a circuit board inside a product, the feed end 21 forms electrical coupling with the circuit board. The antenna conductor circuit 2 is integrally cast on the front surface, inside, or on the inner surface of the casing 1, and gives a distribution shape of a flat plane, curved plane, or multilayer solid by being combined with the unspecified shape of the casing 1. An antenna is so arranged as to be separated from the circuit board 1 and be dependent on the casing 1. Due to this structure, the circuit board space can be kept clean and the volume of an antenna module can be reduced, resulting in leading to the reduction in volume of the wireless communication product.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有公共天线的无线通信产品的外壳。解决方案：预先选择的天线导体电路2整体铸造在壳体1内。天线导体电路2预先形成有由插头针或弹簧带组成的馈送端21。通过与产品内的电路板组合，馈电端21与电路板形成电耦合。天线导体电路2一体地铸造在壳体1的前表面，内侧或内表面上，并且通过与平面，曲面或多层固体的分布形状结合，外壳1.天线被布置为与电路板1分离并且取决于壳体1.由于这种结构，电路板空间可以保持清洁，并且天线模块的体积可以减小，从而导致导致无线通信产品的数量减少。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2008011336A Chip antenna device capable of receiving global positioning system signal 审中-公开
标题翻译：可接收全球定位系统信号的芯片天线设备
公开(公告)号：JP2008011336A
公开(公告)日：2008-01-17
申请号：JP2006181256
申请日：2006-06-30
申请人： Chant Sincere Co Ltd , 詮欣股▲分▼有限公司
发明人： HU CHUAN-LING , CHEN YU-WEI , LIAO CHANG-LUN , LIN SHUN-TIAN , YANG CHANG-FA , CHEN YEN-MING , WANG CHAO-WEI
IPC分类号： H01Q1/38 , H01Q1/24 , H01Q9/30 , H01Q19/10
摘要： PROBLEM TO BE SOLVED: To provide a chip antenna device capable of receiving a global positioning system signal.
SOLUTION: The antenna device 100 capable of receiving a global positioning system signal receives a global positioning signal omnidirectionally by an omnidirectional chip antenna 120. The omnidirectional chip antenna 120 is arranged in a chipped port 140 on an L-shaped grounding surface 110. An electromagnetic junction effect occurs between the omnidirectional chip antenna 120 and the L-shaped grounding surface 110, thus reinforcing the strength of a circular polarization signal for receiving global positioning, and improving precision in positioning by the omnidirectional chip antenna 120.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够接收全球定位系统信号的芯片天线装置。解决方案：能够接收全球定位系统信号的天线装置100由全向芯片天线120全方位地接收全球定位信号。全向芯片天线120布置在L形接地表面110上的切口端口140中在全向芯片天线120和L形接地面110之间产生电磁接合效应，从而增强了用于接收全局定位的圆偏振信号的强度，并提高了全向芯片天线120的定位精度。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2006217047A Method for manufacturing microchip antenna 审中-公开
标题翻译：制造微波天线的方法
公开(公告)号：JP2006217047A
公开(公告)日：2006-08-17
申请号：JP2005025235
申请日：2005-02-01
申请人： Chant Sincere Co Ltd , 詮欣股▲分▼有限公司
发明人： HU CHUAN-LING , PAN MENG-CHIU , LIN SHUN-TIAN , YANG CHANG-FA , CHENG KUO-CHUNG , WANG SEA-FUE , CHANG LISEN , LIAO CHANG-LUN , CHEN CHIA-HUNG
IPC分类号： H01Q1/38 , H01Q13/08
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing microchip antenna in which the central frequency shift of a reflection loss can be adjusted over wide multiple frequencies.
SOLUTION: On a dielectric substrate 1 such as a printed circuit board (PCB), a plastic plate, a resin plate, a composite material of ceramic and resin, ceramic plate, and a chip, a conduction circuit 2 of an antenna is manufactured by a system of various combinations of exposure, development, etching, plating and nonplating. The conduction circuit 2 passes up to a soldering point 3 (i. e. feed terminal) on the other side of the dielectric substrate 1. Alternatively, an elongating conduction circuit is made by boring the dielectric substrate 1 and the length of a conductor is increased. Subsequently, the conduction circuit is coated and sealed with a composite material 4 of resin and ceramic having a different specific dielectric constant (i. e. coating material for sealing) by such a technology system as injection, model injection, thick film printing, dot printing, transfer printing, or multilayer superposition. A means for adjusting the central frequency of the reflection loss of an antenna can be attained by altering the dielectric constant of the composite material of resin and ceramic easily.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造微芯片天线的方法，其中可以在宽的多个频率上调整反射损耗的中心频移。解决方案：在诸如印刷电路板（PCB），塑料板，树脂板，陶瓷和树脂的复合材料，陶瓷板和芯片的电介质基板1上，天线的导电电路2 通过曝光，显影，蚀刻，电镀和非电镀的各种组合的系统制造。导通电路2通过电介质基板1的另一侧的焊接点3（即，馈电端子）。或者，通过使电介质基板1镗孔并且导体的长度增加而形成延长导通电路。随后，通过诸如注射，模型注射，厚膜印刷，点印刷，转印的技术系统，用具有不同比介电常数的树脂和陶瓷的复合材料4（即用于密封的涂层材料）将传导电路进行涂覆和密封打印或多层叠加。可以通过改变树脂和陶瓷的复合材料的介电常数来容易地调节天线的反射损耗的中心频率的装置。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2007104631A Antenna apparatus 审中-公开
标题翻译：天线装置
公开(公告)号：JP2007104631A
公开(公告)日：2007-04-19
申请号：JP2006111989
申请日：2006-04-14
申请人： Chant Sincere Co Ltd , チャントシンシアカンパニーリミテッド
发明人： YANG CHANG-FA , LIN SHUN-TIAN , LAI CHAO-HUNG , WANG CHAO-WEI , CHEN YEN-MING , HU CHUAN-LIN , CHEN YU-WEI , LIAO CHANG-LUN
IPC分类号： H01Q21/30 , H01Q1/38 , H01Q1/44
CPC分类号： H01Q1/38 , H01Q7/00
摘要： PROBLEM TO BE SOLVED: To provide an antenna apparatus for reducing the size of an antenna by obtaining the effects of multiple and wide-frequency bands, using multiple coupled strips and a plurality of current routes.
SOLUTION: This antenna apparatus 100 includes a substrate 102, a plurality of meandering conductive strips 104, and a feeding conductive strip 106 disposed on the substrate 102. Those meandered conductive strips 104 have different sizes, and are spaced at intervals and arranged in parallel according to their sizes, in the order. The feeding conductive strip 106 is electrically connected to those meandering conductive strips 104.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过使用多个耦合条和多条电流路径获得多个和宽频带的效果来减小天线的尺寸的天线装置。解决方案：该天线装置100包括基板102，多个曲折导电条104和设置在基板102上的馈电导电条106.这些曲折的导电条104具有不同的尺寸，并且间隔开并布置根据他们的大小，按顺序并行。馈电导电条106电连接到那些曲折的导电条104.版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007143101A Chip antenna unit 审中-公开
标题翻译：芯片天线单元
公开(公告)号：JP2007143101A
公开(公告)日：2007-06-07
申请号：JP2006111999
申请日：2006-04-14
申请人： Chant Sincere Co Ltd , チャントシンシアカンパニーリミテッド
发明人： CHEN YEN-MING , WANG CHAO-WEI , YANG CHANG-FA , LIN SHUN-TIAN , HU CHUAN-LIN , LIAO CHANG-LUN , CHEN YU-WEI
IPC分类号： H01Q21/30 , H01Q1/38 , H01Q9/42
CPC分类号： H01Q1/38
摘要： PROBLEM TO BE SOLVED: To provide a chip antenna unit improved in the function of an antenna device by downsizing the antenna device by making use of a specific line structure.
SOLUTION: The chip antenna unit comprises: a dielectric material layer 102; a first bent line 104; a second bent line 106, and a plurality of flexed lines 108. The first bent line 104 is disposed onto a dielectric material layer 102 in its state bent in a first direction 114, and the second bent line 106 is disposed onto the dielectric material layer 102 in its state bent in a second direction 116. The first bent line 104 and the second bent line 106 are connected with each other, and each of the flexed lines 108 is connected to a curved portion 126 of each of the plurality of the lines of the bent lines.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过利用特定的线路结构来减小天线装置的尺寸，提供改善天线装置的功能的芯片天线单元。解决方案：芯片天线单元包括：电介质材料层102; 第一弯曲线104; 第二弯曲线106和多条弯曲线108.第一弯曲线104以其在第一方向114上弯曲的状态设置在电介质材料层102上，并且第二弯曲线106设置在电介质材料层 102处于其第二方向116弯曲的状态。第一弯曲线104和第二弯曲线106彼此连接，并且每条弯曲线108连接到多条线中的每条线的弯曲部分126 的弯曲线。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2007129686A Wide-band antenna device 审中-公开
标题翻译：宽带天线设备
公开(公告)号：JP2007129686A
公开(公告)日：2007-05-24
申请号：JP2006111994
申请日：2006-04-14
申请人： Chant Sincere Co Ltd , チャントシンシアカンパニーリミテッド
发明人： HU CHUAN-LIN , YANG CHANG-FA , LIN SHUN-TIAN , LIAO CHANG-LUN , CHEN YU-WEI , CHEN YEN-MING , WANG CHAO-WEI
IPC分类号： H01Q9/27 , H01Q1/38
CPC分类号： H01Q9/27 , H01Q1/38
摘要： PROBLEM TO BE SOLVED: To provide a wide-band antenna device which achieves multi-band and wide-band performances and allows the antenna compact with one or a plurality of spiral lines.
SOLUTION: The antenna device includes a dielectric material layer 102 and one or a plurality of spiral lines 104, 106 wound on the dielectric material layer 102. The feeding point and the grounding point of the antenna are arranged on one or a plurality of spiral lines 104, 106.
COPYRIGHT: (C)2007,JPO&INPIT

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