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1. 发明申请

US20080048689A1 Wafer type probe card, method for fabricating the same, and semiconductor test apparatus having the same 失效
标题翻译：晶圆型探针卡及其制造方法以及具有该晶片的半导体测试装置
公开(公告)号：US20080048689A1
公开(公告)日：2008-02-28
申请号：US11892433
申请日：2007-08-23
申请人： Chang-hwan Lee
发明人： Chang-hwan Lee
IPC分类号： G01R31/02 , G01R1/073 , H01L21/44
CPC分类号： G01R1/07307 , G01R3/00 , G01R31/2886
摘要： Example embodiments may provide a wafer type probe card, a method of fabricating a wafer type probe card, and/or a semiconductor test apparatus having the wafer type probe card. The wafer type probe card may include a semiconductor and a plurality of probing chips. The semiconductor substrate may include a plurality of probing area each including a first surface and/or a second surface opposite to the first surface. Each of the plurality of probing chips may include a plurality of conductive first pads arranged in the first surface of each of the plurality of probing areas and/or a plurality of conductive second pads arranged in the second surface of each the plurality of probing chips to be respectively connected to the first pads.
摘要翻译：示例性实施例可以提供晶片型探针卡，制造晶片型探针卡的方法和/或具有晶片型探针卡的半导体测试装置。晶片型探针卡可以包括半导体和多个探测芯片。半导体衬底可以包括多个探测区域，每个探测区域包括与第一表面相对的第一表面和/或第二表面。多个探测芯片中的每一个可以包括布置在多个探测区域中的每一个的第一表面中的多个导电第一焊盘和/或布置在每个多个探测芯片的第二表面中的多个导电第二焊盘，分别连接到第一焊盘。

2. 发明授权

US08860452B2 Tester to test a plurality of semiconductor devices and test system including the same 有权
标题翻译：测试仪测试多个半导体器件和包括其的测试系统
公开(公告)号：US08860452B2
公开(公告)日：2014-10-14
申请号：US13328004
申请日：2011-12-16
申请人： Chang-hwan Lee
发明人： Chang-hwan Lee
IPC分类号： G01R31/26 , G11C29/00 , G11C29/56 , G01R31/319 , G01R31/28 , G11C29/26
CPC分类号： G01R31/2601 , G01R31/2886 , G01R31/31908 , G11C29/006 , G11C29/56 , G11C2029/2602 , G11C2029/5602
摘要： Provided are a tester configured to test a semiconductor device and a test system including the same. The tester may include at least one contact unit and at least one memory controller. The contact unit is in contact with the semiconductor device. The memory controller is connected to the contact unit. The memory controller controls data input/output (I/O) operations of the semiconductor device and tests the semiconductor device.
摘要翻译：提供了一种被配置为测试半导体器件和包括其的测试系统的测试器。测试器可以包括至少一个接触单元和至少一个存储器控制器。接触单元与半导体器件接触。存储器控制器连接到接触单元。存储器控制器控制半导体器件的数据输入/输出（I / O）操作并测试半导体器件。

3. 发明授权

US07616015B2 Wafer type probe card, method for fabricating the same, and semiconductor test apparatus having the same 失效
标题翻译：晶圆型探针卡及其制造方法以及具有该晶片的半导体测试装置
公开(公告)号：US07616015B2
公开(公告)日：2009-11-10
申请号：US11892433
申请日：2007-08-23
申请人： Chang-hwan Lee
发明人： Chang-hwan Lee
IPC分类号： G01R31/02
CPC分类号： G01R1/07307 , G01R3/00 , G01R31/2886
摘要： Example embodiments may provide a wafer type probe card, a method of fabricating a wafer type probe card, and/or a semiconductor test apparatus having the wafer type probe card. The wafer type probe card may include a semiconductor and a plurality of probing chips. The semiconductor substrate may include a plurality of probing area each including a first surface and/or a second surface opposite to the first surface. Each of the plurality of probing chips may include a plurality of conductive first pads arranged in the first surface of each of the plurality of probing areas and/or a plurality of conductive second pads arranged in the second surface of each the plurality of probing chips to be respectively connected to the first pads.
摘要翻译：示例性实施例可以提供晶片型探针卡，制造晶片型探针卡的方法和/或具有晶片型探针卡的半导体测试装置。晶片型探针卡可以包括半导体和多个探测芯片。半导体衬底可以包括多个探测区域，每个探测区域包括与第一表面相对的第一表面和/或第二表面。多个探测芯片中的每一个可以包括布置在多个探测区域中的每一个的第一表面中的多个导电第一焊盘和/或布置在每个多个探测芯片的第二表面中的多个导电第二焊盘，分别连接到第一焊盘。

4. 发明申请

US20060145323A1 Multi-chip package mounted memory card 审中-公开
标题翻译：多芯片封装安装的存储卡
公开(公告)号：US20060145323A1
公开(公告)日：2006-07-06
申请号：US11297276
申请日：2005-12-08
申请人： Chang-hwan Lee
发明人： Chang-hwan Lee
IPC分类号： H01L23/02
CPC分类号： H01L23/3121 , H01L23/5388 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2924/00014 , H01L2924/01033 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip package mounted memory card includes at least one multi-chip package mounted on a printed circuit board, and card connectors connected to electrode terminals on the multi-chip package via a wiring on the printed circuit board. The same or different types of multi-chip packages may be mounted on the memory card, and same or different types of semiconductor chips may be mounted on each multi-chip package. In the multi-chip package, input pins or output pins may be connected to the semiconductor chips such that they are shared by the semiconductor chips, or may be separately connected to the semiconductor chips. Also, the semiconductor chips in the multi-chip package may have separate power supply lines or may share a power supply line.
摘要翻译：多芯片封装安装的存储卡包括安装在印刷电路板上的至少一个多芯片封装以及通过印刷电路板上的布线连接到多芯片封装上的电极端子的卡连接器。可以将相同或不同类型的多芯片封装安装在存储卡上，并且可以在每个多芯片封装上安装相同或不同类型的半导体芯片。在多芯片封装中，输入引脚或输出引脚可以连接到半导体芯片，使得它们被半导体芯片共享，或者可以单独连接到半导体芯片。此外，多芯片封装中的半导体芯片可以具有单独的电源线或者可以共享电源线。

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