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1. 发明申请

US20080141971A1 CYLINDER HEAD AND EXHAUST SYSTEM OF A MULTI-CYLINDER ENGINE 审中-公开
标题翻译：多缸发动机气缸盖和排气系统
公开(公告)号：US20080141971A1
公开(公告)日：2008-06-19
申请号：US11950997
申请日：2007-12-05
申请人： Chan Hyo Park , Si Hun Lee , Wootae Kim , Ingee Suh , Jong Bae Kim , Jae Kee Lee
发明人： Chan Hyo Park , Si Hun Lee , Wootae Kim , Ingee Suh , Jong Bae Kim , Jae Kee Lee
IPC分类号： F02F1/42
CPC分类号： F02F1/4264 , F01N13/107 , Y02E20/16
摘要： Exhaust passages are integrally formed in at least a projection portion protruded from a side portion of a cylinder head. Interference between a vehicle body and an exhaust manifold can be reduced in a limited engine compartment space and engine performance can thereby be improved,
摘要翻译：排气通道一体地形成在至少从气缸盖的侧部突出的突出部分中。在有限的发动机舱空间中，可以减少车身与排气歧管之间的干扰，从而可以提高发动机性能，

2. 发明申请

US20080283210A1 METHOD OF MANUFACTURING CYLINDER HEAD SYSTEM FOR VEHICLE 审中-公开
标题翻译：制造汽车缸盖系统的方法
公开(公告)号：US20080283210A1
公开(公告)日：2008-11-20
申请号：US11943474
申请日：2007-11-20
申请人： Jong Bae Kim , Jae Kee Lee , Jin Yul Jung , Chan Hyo Park , Jin Hwa Kim
发明人： Jong Bae Kim , Jae Kee Lee , Jin Yul Jung , Chan Hyo Park , Jin Hwa Kim
IPC分类号： B22C9/00 , B22C9/02
CPC分类号： B22C9/103 , B22C9/02
摘要： A method for manufacturing a cylinder head system for a vehicle includes manufacturing a first main mold having an exhaust manifold mold and a first water jacket mold; manufacturing a second main mold having a second water jacket mold; and assembling the first main mold to the second main mold. The exhaust manifold mold is configured to form an exhaust manifold, the first water jacket mold is configured to form a first water jacket for cooling the exhaust manifold, and the second water jacket mold is configured to form a second water jacket for cooling a cylinder block.
摘要翻译：制造车辆用气缸盖系统的方法包括制造具有排气歧管模具和第一水套模具的第一主模具; 制造具有第二水套模具的第二主模具; 以及将所述第一主模具组装到所述第二主模具。排气歧管模具被配置成形成排气歧管，第一水套模具构造成形成用于冷却排气歧管的第一水套，并且第二水套模具构造成形成用于冷却气缸体的第二水套。

3. 发明申请

US20100230068A1 METHOD AND MOLD FOR MANUFACTURING CYLINDER HEAD SYSTEM FOR VEHICLE 审中-公开
标题翻译：用于制造汽车缸盖系统的方法和模具
公开(公告)号：US20100230068A1
公开(公告)日：2010-09-16
申请号：US12756803
申请日：2010-04-08
申请人： Jong Bae KIM , Jae Kee Lee , Jin Yul Jung , Chan Hyo Park , Jin Hwa Kim
发明人： Jong Bae KIM , Jae Kee Lee , Jin Yul Jung , Chan Hyo Park , Jin Hwa Kim
IPC分类号： B22C9/02 , B22C9/24 , B22C9/10
CPC分类号： B22C9/103 , B22C9/02
摘要： A method for manufacturing a cylinder head system for a vehicle includes manufacturing a first main mold to integrally form an exhaust manifold for discharging exhaust gas from a cylinder and a first water jacket for cooling the exhaust manifold, manufacturing a second main mold to form a second water jacket for cooling a cylinder block, and connecting the first main mold to the second main mold. The mold includes a first main mold having a plurality of exhaust manifold molds and a first water jacket mold, each exhaust manifold mold being configured to form a respective exhaust manifold, and the first water jacket mold being configured to form a first water jacket for cooling the exhaust manifolds, a second main mold having a second water jacket mold, the second water jacket mold being configured to form a second water jacket for cooling a cylinder block, and the second main mold being configured to be assembled with the first main mold. The first water jacket mold may be disposed between the exhaust manifold molds.
摘要翻译：一种用于车辆的气缸盖系统的制造方法包括制造第一主模具以一体地形成用于从气缸排出废气的排气歧管和用于冷却排气歧管的第一水套，制造第二主模以形成第二主模水套，用于冷却缸体，并将第一主模具连接到第二主模具。模具包括具有多个排气歧管模具和第一水套模具的第一主模具，每个排气歧管模具被配置为形成相应的排气歧管，并且第一水套模具被配置成形成第一水套以冷却所述排气歧管，具有第二水套模具的第二主模具，所述第二水套模具构造成形成用于冷却气缸体的第二水套，所述第二主模具被配置为与所述第一主模具组装。第一水套模具可以设置在排气歧管模具之间。

4. 发明授权

US08669038B2 Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same 有权
标题翻译：聚酰亚胺基聚合物，其共聚物和含有它们的正型光致抗蚀剂组合物
公开(公告)号：US08669038B2
公开(公告)日：2014-03-11
申请号：US13568911
申请日：2012-08-07
申请人： Chan Hyo Park , Sang Woo Kim , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
发明人： Chan Hyo Park , Sang Woo Kim , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
IPC分类号： G03F7/023
CPC分类号： G03F7/0233 , C08G73/1039 , C08G73/1042 , C08G73/1064 , C08L79/08 , G03F7/0045 , Y10S430/107
摘要： Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.
摘要翻译：提供了聚酰亚胺基聚合物及其共聚物。还提供了包含作为粘合剂树脂的至少一种聚酰亚胺基聚合物及其共聚物的正型光致抗蚀剂组合物。光致抗蚀剂组合物显示出形成半导体缓冲涂层所需的高分辨率，高灵敏度，优异的膜特性和改进的机械性能。

5. 发明授权

US08470914B2 Photosensitive polyimide and photosensitive resin composition comprising the same 有权
标题翻译：感光性聚酰亚胺和含有它们的感光性树脂组合物
公开(公告)号：US08470914B2
公开(公告)日：2013-06-25
申请号：US12861761
申请日：2010-08-23
申请人： Jung Ho Jo , Kyung Jun Kim , Hye Ran Seong , Hye Won Jeong , Chan Hyo Park , Yu Na Kim , Sang Woo Kim , Se Jin Shin , Kyoung Ho Ahn
发明人： Jung Ho Jo , Kyung Jun Kim , Hye Ran Seong , Hye Won Jeong , Chan Hyo Park , Yu Na Kim , Sang Woo Kim , Se Jin Shin , Kyoung Ho Ahn
IPC分类号： C08L79/08 , C08G69/26 , C08K5/41
CPC分类号： G03F7/0233 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/16 , C08L79/08 , G03F7/0048
摘要： The present invention relates to polyimide or precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive resin composition including the same. The polyimide or precursor thereof are fabricated using diamine comprising polyalkyleneoxide. The photosensitive resin composition of the present invention has excellent light transmissivity, an excellent resolution, and excellent photo sensitivity and image forming performance. Further, the photosensitive resin composition has high adhesiveness with substrates, such as a silicon film, a silicon oxide film, and a metal film. In particular, an excellent film without failure, such as crack, can be formed.
摘要翻译：本发明涉及由化学式1或2表示的聚酰亚胺或其前体和包含其的感光性树脂组合物。聚酰亚胺或其前体使用包含聚环氧烷的二胺制造。本发明的感光性树脂组合物具有优异的透光性，优异的分辨率，优异的光敏性和成像性能。此外，感光性树脂组合物与硅膜，氧化硅膜，金属膜等基材的粘合性高。特别地，可以形成无破裂的优异的膜，例如裂纹。

6. 发明授权

US08257901B2 Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same 有权
标题翻译：聚酰亚胺基聚合物，其共聚物和含有它们的正型光致抗蚀剂组合物
公开(公告)号：US08257901B2
公开(公告)日：2012-09-04
申请号：US12720364
申请日：2010-03-09
申请人： Sang Woo Kim , Chan Hyo Park , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
发明人： Sang Woo Kim , Chan Hyo Park , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
IPC分类号： G03F7/023 , C08G69/32
CPC分类号： G03F7/0233 , C08G73/1039 , C08G73/1042 , C08G73/1064 , C08L79/08 , G03F7/0045 , Y10S430/107
摘要： Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.
摘要翻译：提供了聚酰亚胺基聚合物及其共聚物。还提供了包含作为粘合剂树脂的至少一种聚酰亚胺基聚合物及其共聚物的正型光致抗蚀剂组合物。光致抗蚀剂组合物显示出形成半导体缓冲涂层所需的高分辨率，高灵敏度，优异的膜特性和改进的机械性能。

7. 发明申请

US20110123927A1 PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYIMIDE RESIN AND NOVOLAK RESIN 审中-公开
标题翻译：含有聚酰胺树脂和NOVOLAK树脂的感光树脂组合物
公开(公告)号：US20110123927A1
公开(公告)日：2011-05-26
申请号：US12994010
申请日：2009-05-20
申请人： Chan Hyo Park , Hye In Shin , Hye Ran Seong , Kyung Jun Kim , Dong Hyun Oh
发明人： Chan Hyo Park , Hye In Shin , Hye Ran Seong , Kyung Jun Kim , Dong Hyun Oh
IPC分类号： G03F7/004 , G03F7/20 , B05D3/02 , B05D7/24 , B05D7/14
CPC分类号： G03F7/0233 , G03F7/0046 , G03F7/40
摘要： A photosensitive resin composition is provided. The photosensitive resin composition comprises a) an alkali-soluble polyimide resin, b) an alkali-soluble novolak resin, c) a photosensitizer, and d) an organic solvent. The photosensitive resin composition is resistant to heat and can be used to form a pattern whose lateral angles are easily controllable. A large difference in developability between exposed and unexposed portions of the photosensitive resin composition is caused when patterning. The photosensitive resin composition is advantageous in terms of sensitivity, resolution, heat resistance and adhesiveness. Particularly, the lateral angles of the pattern can be easily controlled by varying the contents of the alkali-soluble resins. Therefore, the photosensitive resin composition is useful in the formation of an insulating film pattern of an organic light emitting diode (OLED).
摘要翻译：提供感光性树脂组合物。感光性树脂组合物包含a）碱溶性聚酰亚胺树脂，b）碱溶性酚醛清漆树脂，c）光敏剂，和d）有机溶剂。感光性树脂组合物耐热，可用于形成其横向角度容易控制的图案。当图案化时，引起感光性树脂组合物的曝光部与未曝光部之间的显影性差。感光性树脂组合物在灵敏度，分辨率，耐热性和粘合性方面是有利的。特别地，可以通过改变碱溶性树脂的含量来容易地控制图案的横向角度。因此，感光性树脂组合物可用于形成有机发光二极管（OLED）的绝缘膜图案。

8. 发明申请

US20100233618A1 POLYIMIDE-BASED POLYMERS, COPOLYMERS THEREOF AND POSITIVE TYPE PHOTORESIST COMPOSITIONS COMPRISING THE SAME 有权
标题翻译：基于聚酰亚胺的聚合物，其共聚物和包含其的正型类型的光电组合物
公开(公告)号：US20100233618A1
公开(公告)日：2010-09-16
申请号：US12720364
申请日：2010-03-09
申请人： Sang Woo KIM , Chan Hyo Park , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
发明人： Sang Woo KIM , Chan Hyo Park , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
IPC分类号： G03F7/004 , C08G73/10
CPC分类号： G03F7/0233 , C08G73/1039 , C08G73/1042 , C08G73/1064 , C08L79/08 , G03F7/0045 , Y10S430/107
摘要： Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.
摘要翻译：提供了聚酰亚胺基聚合物及其共聚物。还提供了包含作为粘合剂树脂的至少一种聚酰亚胺基聚合物及其共聚物的正型光致抗蚀剂组合物。光致抗蚀剂组合物显示出形成半导体缓冲涂层所需的高分辨率，高灵敏度，优异的膜特性和改进的机械性能。

9. 发明申请

US20120301826A1 POLYIMIDE-BASED POLYMERS, COPOLYMERS THEREOF AND POSITIVE TYPE PHOTORESIST COMPOSITIONS COMPRISING THE SAME 有权
标题翻译：基于聚酰亚胺的聚合物，其共聚物和包含其的正型类型的光电组合物
公开(公告)号：US20120301826A1
公开(公告)日：2012-11-29
申请号：US13568911
申请日：2012-08-07
申请人： Chan Hyo Park , Sang Woo Kim , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
发明人： Chan Hyo Park , Sang Woo Kim , Kyung Jun Kim , Hye Ran Seong , Se Jin Shin , Dong Hyun Oh
IPC分类号： C08G73/10 , G03F7/004 , C08G77/26
CPC分类号： G03F7/0233 , C08G73/1039 , C08G73/1042 , C08G73/1064 , C08L79/08 , G03F7/0045 , Y10S430/107
摘要： Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.
摘要翻译：提供了聚酰亚胺基聚合物及其共聚物。还提供了包含作为粘合剂树脂的至少一种聚酰亚胺基聚合物及其共聚物的正型光致抗蚀剂组合物。光致抗蚀剂组合物显示出形成半导体缓冲涂层所需的高分辨率，高灵敏度，优异的膜特性和改进的机械性能。

10. 发明申请

US20100055401A1 MANUFACTURING METHOD OF FILM HAVING MICRO-PATTERN THEREON AND FILM MANUFACTURED THEREBY 审中-公开
标题翻译：具有微型薄膜和薄膜制造薄膜的制造方法
公开(公告)号：US20100055401A1
公开(公告)日：2010-03-04
申请号：US12312860
申请日：2008-03-28
申请人： Hyun Seok Choi , Yeon Keun Lee , Chan Hyo Park , Bo Yun Choi , Kwang Joo Lee
发明人： Hyun Seok Choi , Yeon Keun Lee , Chan Hyo Park , Bo Yun Choi , Kwang Joo Lee
IPC分类号： B32B3/00 , G03F7/20
CPC分类号： G03F7/2032 , G02B6/0053 , G02B6/0065 , G03F7/2022 , Y10T428/24479
摘要： A method of efficiently manufacturing a film having micro-patterns and an optical film manufactured using the same are used for various optical purposes. The method includes forming a first micro-pattern on one face of the film, and forming a second micro-pattern, which has a geometry equal to that of the first micro-pattern, on the other face of the film by a photo-lithography method using the first micro-pattern formed on one face of the film as a photomask.
摘要翻译：使用有效制造具有微图形的膜的方法和使用其制造的光学膜用于各种光学目的。该方法包括在膜的一个面上形成第一微图案，并且通过光刻法在膜的另一个表面上形成具有与第一微图案的几何相等的几何形状的第二微图案使用在膜的一个面上形成的第一微图案作为光掩模。

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