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    • 2. 发明授权
    • High strength and high conductivity copper alloy pipe, rod, or wire
    • 高强度高导电铜合金管,棒或线
    • US09163300B2
    • 2015-10-20
    • US12808564
    • 2009-02-23
    • Keiichiro Oishi
    • Keiichiro Oishi
    • C22C9/00C22C9/02C22C9/06C22F1/08H01B1/02
    • C22C9/02C22C9/06C22F1/08H01B1/026
    • A high strength and high conductivity copper alloy pipe, rod, or wire is composed of an alloy composition containing 0.13 to 0.33 mass % of Co, 0.044 to 0.097 mass % of P, 0.005 to 0.80 mass % of Sn, and 0.00005 to 0.0050 mass % of O, wherein a content [Co] mass % of Co and a content [P] mass % of P satisfy a relationship of 2.9≦([Co]−0.007)/([P]−0.008)≦6.1, and the remainder includes Cu and inevitable impurities. The high strength and high conductivity copper alloy pipe, rod, or wire is produced by a process including a hot extruding process. Strength and conductivity of the high strength and high conductivity copper pipe, rod, or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn.
    • 高强度,高导电性的铜合金管,棒或线由Co含量为0.13〜0.33质量%,P为0.044〜0.097质量%,Sn 0.005〜0.80质量%,0.00005〜0.0050质量%的合金组成 %,其中Co的含量[Co]质量%,P的含量[P]质量%满足2.9≦̸([Co] -0.007)/([P] -0.008)< 余量包括Cu和不可避免的杂质。 高强度高导电铜合金管,棒或线通过包括热挤压工艺在内的工艺生产。 通过Co和P的化合物和Sn的固溶体的均匀沉淀,改善了高强度和高导电性铜管,棒或线的强度和导电性。
    • 4. 发明申请
    • HEAT RESISTANCE COPPER ALLOY MATERIALS
    • 耐热铜合金材料
    • US20090320964A1
    • 2009-12-31
    • US12555990
    • 2009-09-09
    • Keiichiro Oishi
    • Keiichiro Oishi
    • C22C9/02
    • C22C9/06B23K35/302B23K2101/14B23K2103/12C21D9/50C22C9/02C22C9/04C22F1/08F28F21/085
    • The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4≦([Co]−0.02)/[P]≦5.2 and 0.20≦[Co]+0.5 [P]+0.9 [Sn]+0.1 [Zn]≦0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes.
    • 本发明公开了一种耐热铜合金材料,其特征在于,所述铜合金材料包含Co:0.15〜0.33质量%,P:0.041〜0.089质量%,Sn:0.02〜0.25质量%,Zn:0.01〜0.40质量% Co,P,Sn和Zn的各种含量满足2.4 <=([Co] -0.02)/ [P] <= 5.2和0.20 <= [Co] +0.5的关系的Cu和不可避免的杂质的剩余质量百分比 [P] +0.9 [Sn] +0.1 [Zn] <= 0.54,其中[Co],[P],[Sn]和[Zn]分别是Co,P,Sn和Zn含量的质量百分比; 并且所述铜合金材料是通过将所述管,板,棒或线材加工成预定形状而获得的管,板,棒,线或加工材料。
    • 6. 发明授权
    • Silver-white copper alloy and method of producing silver-white copper alloy
    • 银白铜合金和银白铜合金的制造方法
    • US09512507B2
    • 2016-12-06
    • US14115062
    • 2012-06-27
    • Shinji TanakaKeiichiro OishiHiroharu Ogawa
    • Shinji TanakaKeiichiro OishiHiroharu Ogawa
    • C22C9/04C22F1/08
    • C22C9/04C22F1/08
    • Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%.
    • 提供具有优异的机械性能如热加工性,冷加工性或冲压性,耐色牢度,杀菌和抗菌性能以及耐镍过敏性的银白铜合金。 以及制造这种银白铜合金的方法。 银白色铜合金含有Cu:51.0质量%〜58.0质量% 9.0质量%〜12.5质量%的Ni; 0.0003质量%〜0.010质量% 0.0005质量%至0.030质量%的Pb; 并且在Cu [Cu](质量%)的含量与Ni [Ni](含量)的含量之间满足65.5≤[Cu] + 1.2×[Ni]≤70.0的关系的Zn和不可避免的杂质的平衡 质量%)。 在其金属结构中,分散在α相基体中的β相的面积比为0〜0.9%。
    • 7. 发明授权
    • High strength and high conductivity copper alloy rod or wire
    • 高强度高导电铜合金棒或线
    • US09512506B2
    • 2016-12-06
    • US12919206
    • 2009-02-23
    • Keiichiro OishiKazumasa Hori
    • Keiichiro OishiKazumasa Hori
    • C22C9/02C22F1/08H01B1/02C22C9/06
    • H01B1/026C22C9/02C22C9/06C22F1/08H01B7/0045H01B13/0016H01B13/01209Y10T428/2913
    • A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.
    • 高强度高导电性铜棒或线材的Co为0.12〜0.32质量%,P为0.042〜0.095质量%,Sn为0.005〜0.70质量%,O为0.00005〜0.0050质量%。 Co的含量[Co]质量%和P的含量[P]质量%满足3.0≤([Co] -0.007)/([P] -0.008)≤6.2的关系。其余包括Cu和 不可避免的杂质,通过包括连续铸造和轧制过程的工艺生产棒或线。 通过均匀沉淀Co和P的化合物和Sn的固溶体,可以提高高强度和高导电性铜棒或导线的强度和导电性。 高强度,高导电性的铜棒或丝线通过连续铸造和轧制加工生产,从而降低生产成本。
    • 8. 发明授权
    • High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
    • 高强度高导电铜合金轧制板及其制造方法
    • US09455058B2
    • 2016-09-27
    • US13144057
    • 2009-12-25
    • Keiichiro Oishi
    • Keiichiro Oishi
    • C22C9/02C22F1/08H01B1/02C22C9/06
    • H01B1/026C22C9/02C22C9/06C22F1/08
    • In a high-strength and high-electrical conductivity copper alloy rolled sheet, 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn are contained, [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9, a total cold rolling ratio is equal to or greater than 70%, a recrystallization ratio is equal to or less than 45% a an average grain size of recrystallized grains is in the range of 0.7 to 7 μm, an average grain diameter of precipitates is in the range of 2.0 to 11 nm, and an average grain size of fine crystals is in the range of 0.3 to 4 μm. By the precipitates of Co and P, the solid solution of Sn, and fine crystals, the strength, conductivity and ductility of the copper alloy rolled sheet are improved.
    • 在高强度高导电性铜合金轧制板中,Co:0.14〜0.34质量%,P:0.046〜0.098质量%,Sn:0.005〜1.4质量%,[Co]质量%表示Co含量 和[P]质量%满足3.0≤([Co] -0.007)/([P] -0.009)≤5.9的关系,总冷轧比等于或大于70%,再结晶 比例等于或小于45%,再结晶晶粒的平均晶粒尺寸在0.7〜7μm的范围内,析出物的平均粒径在2.0〜11nm的范围内,平均粒径微细 晶体在0.3〜4μm的范围内。 通过Co和P的析出,提高了Sn,和细晶体的固溶体对铜合金轧制板的强度,导电性和延展性。
    • 9. 发明申请
    • COPPER ALLOY SHEET AND METHOD FOR MANUFACTURING COPPER ALLOY SHEET
    • 铜合金板和制造铜合金板的方法
    • US20140255248A1
    • 2014-09-11
    • US14234964
    • 2012-09-14
    • Keiichiro OishiKouichi Suzaki
    • Keiichiro OishiKouichi Suzaki
    • C22C21/10
    • C22C21/10B21B1/22B21B3/00C22C9/04C22C13/00C22F1/00C22F1/08H01B1/026
    • An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70% or more.
    • 铜合金板的一方面,含有5.0质量%〜12.0质量%的Zn,Sn:1.1质量%〜2.5质量%,P:0.01质量%〜0.09质量%,Ni:0.6质量%〜1.5质量% 的Cu和不可避免的杂质,满足20&nlE; [Zn] + 7×[Sn] + 15×[P] + 4.5×[Ni]&nlE; 32的关系。 铜合金板的方面是使用冷轧精轧方法制造的,其中铜合金材料被冷轧,铜合金材料的平均晶粒直径为1.2μm至5.0μm,圆形或椭圆形 析出物存在于铜合金材料中,析出物的平均粒径为4.0nm〜25.0nm,析出物的粒径为4.0nm〜25.0nm的析出物的比例为70%以上。