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1. 发明授权

US06541304B1 Method of dispensing a viscous material 有权
标题翻译：分配粘性物质的方法
公开(公告)号：US06541304B1
公开(公告)日：2003-04-01
申请号：US09273479
申请日：1999-03-22
申请人： Carlos E. Bouras , Duong T. La , Andre S. Gamelin , Alan R. Lewis , Mark S. Meier , Alec J. Babiarz
发明人： Carlos E. Bouras , Duong T. La , Andre S. Gamelin , Alan R. Lewis , Mark S. Meier , Alec J. Babiarz
IPC分类号： H01L2148
CPC分类号： B05C11/1042 , B05C5/0225 , B05C11/101 , B05C11/1013 , B05C11/1015 , B05C11/1018 , B05C11/1021 , H01L2224/16
摘要： A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispensing element and metering device can be moved by a positioner along a predetermined pattern adjacent a surface of a substrate. A weigh scale located adjacent the substrate receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller adjusts a speed of movement of the positioner along the predetermined pattern to cause the dispensing element to dispense a desired amount of material based on a calculated flow rate. Alternatively, the controller adjusts a rate of delivery of the metering device based on the calculated flow rate to cause the dispensing element to dispense the desired amount of material along the predetermined pattern. Closed loop temperature control may be provided for the dispensing element and/or the substrate to ensure a substantially constant viscosity and a substantially constant flow rate. A prime and purge station may be provided adjacent the substrate for sucking air bubbles from the dispensing element and metering device.
摘要翻译：一种用于将粘性材料分配到基底上的系统，其包括分配元件，粘性材料储存器和联接在储存器和分配元件之间的计量装置，用于通过分配元件计量可变量的粘性材料。分配元件和计量装置可以通过定位器沿着与基板的表面相邻的预定图案移动。位于基板附近的称重秤接收计量量的粘性材料，并产生表示在预定时间间隔内分配的材料的可变重量的信号。控制器根据预定图案来调节定位器的移动速度，以使得分配元件基于所计算的流量来分配所需量的材料。或者，控制器基于所计算的流量来调节计量装置的输送速率，以使得分配元件沿着预定模式分配期望量的材料。可以为分配元件和/或基板提供闭环温度控制，以确保基本上恒定的粘度和基本恒定的流速。可以在基板附近设置起始和吹扫站，用于从分配元件和计量装置吸入气泡。

2. 发明授权

US5906682A Flip chip underfill system and method 失效
公开(公告)号：US5906682A
公开(公告)日：1999-05-25
申请号：US963993
申请日：1997-11-04
申请人： Carlos E. Bouras , Duong T. La , Andre S. Gamelin , Alan R. Lewis , Mark S. Meier , Alec J. Babiarz
发明人： Carlos E. Bouras , Duong T. La , Andre S. Gamelin , Alan R. Lewis , Mark S. Meier , Alec J. Babiarz
IPC分类号： B05D1/26 , B05C5/00 , B05C5/02 , B05C11/10 , B05D7/00 , B67D7/08 , B67D7/18 , B67D7/82 , H01L21/56 , H05K1/18 , B05C11/00
CPC分类号： B05C11/1042 , B05C11/101 , B05C11/1013 , B05C11/1015 , B05C11/1018 , B05C11/1021 , B05C5/0225 , H01L2224/16
摘要： A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispensing element and metering device can be moved by a positioner along a predetermined pattern adjacent a surface of a substrate. A weigh scale located adjacent the substrate receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller adjusts a speed of movement of the positioner along the predetermined pattern to cause the dispensing element to dispense a desired amount of material based on a calculated flow rate. Alternatively, the controller adjusts a rate of delivery of the metering device based on the calculated flow rate to cause the dispensing element to dispense the desired amount of material along the predetermined pattern. Closed loop temperature control may be provided for the dispensing element and/or the substrate to ensure a substantially constant viscosity and a substantially constant flow rate. A prime and purge station may be provided adjacent the substrate for sucking air bubbles from the dispensing element and metering device.

3. 发明授权

US06955946B2 Flip chip underfill system and method 失效
标题翻译：倒装芯片底层填充系统和方法
公开(公告)号：US06955946B2
公开(公告)日：2005-10-18
申请号：US10401362
申请日：2003-03-28
申请人： Carlos E. Bouras , Duong T. La. , Alan R. Lewis , Mark S. Meier , Alec J. Babiarz
发明人： Carlos E. Bouras , Duong T. La. , Alan R. Lewis , Mark S. Meier , Alec J. Babiarz
IPC分类号： B05D1/26 , B05C5/00 , B05C5/02 , B05C11/10 , B05D7/00 , B67D7/08 , B67D7/18 , B67D7/82 , H01L21/56 , H05K1/18 , H01L21/48 , B05C11/00 , B67D5/08
CPC分类号： B05C11/1042 , B05C5/0225 , B05C11/101 , B05C11/1013 , B05C11/1015 , B05C11/1018 , B05C11/1021 , H01L2224/16
摘要： A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispensing element and metering device can be moved by a positioner along a predetermined pattern adjacent a surface of a substrate. A weigh scale located adjacent the substrate receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller adjusts a speed of movement of the positioner along the predetermined pattern to cause the dispensing element to dispense a desired amount of material based on a calculated flow rate. Alternatively, the controller adjusts a rate of delivery of the metering device based on the calculated flow rate to cause the dispensing element to dispense the desired amount of material along the predetermined pattern. Closed loop temperature control may be provided for the dispensing element and/or the substrate to ensure a substantially constant viscosity and a substantially constant flow rate. A prime and purge station may be provided adjacent the substrate for sucking air bubbles from the dispensing element and metering device.
摘要翻译：一种用于将粘性材料分配到基底上的系统，其包括分配元件，粘性材料储存器和联接在储存器和分配元件之间的计量装置，用于通过分配元件计量可变量的粘性材料。分配元件和计量装置可以通过定位器沿着与基板的表面相邻的预定图案移动。位于基板附近的称重秤接收计量量的粘性材料，并产生表示在预定时间间隔内分配的材料的可变重量的信号。控制器根据预定图案来调节定位器的移动速度，以使得分配元件基于所计算的流量来分配所需量的材料。或者，控制器基于所计算的流量来调节计量装置的输送速率，以使得分配元件沿着预定模式分配期望量的材料。可以为分配元件和/或基板提供闭环温度控制，以确保基本上恒定的粘度和基本恒定的流速。可以在基板附近设置起始和吹扫站，用于从分配元件和计量装置吸入气泡。

4. 发明授权

US5505777A Computer controlled viscous fluid dispensing system 失效
标题翻译：计算机控制粘稠流体分配系统
公开(公告)号：US5505777A
公开(公告)日：1996-04-09
申请号：US192709
申请日：1994-02-07
申请人： Robert L. Ciardella , Philip P. Maiorca , Alec J. Babiarz , Duong La , Carlos E. Bouras , Mark S. Meier , John L. Christofferson , Ronald N. Abernathy , Stanley C. Aguilar , James C. Smith
发明人： Robert L. Ciardella , Philip P. Maiorca , Alec J. Babiarz , Duong La , Carlos E. Bouras , Mark S. Meier , John L. Christofferson , Ronald N. Abernathy , Stanley C. Aguilar , James C. Smith
IPC分类号： B05B13/00 , B05B12/08 , B05C5/00 , B05C5/02 , B05C11/10 , B23K3/06 , H01L21/56 , H01L21/58 , H05K3/34 , H05K13/04 , B05C11/00 , B05B15/00 , B05B1/02
CPC分类号： B05C11/1034 , B05B12/085 , B05B17/04 , B05C5/001 , B05C5/0225 , B23K3/0607 , H01L24/83 , H05K13/0469 , H05K3/305 , B23K2201/40 , H01L21/56 , H01L2224/83 , H05K2203/013 , H05K2203/163 , H05K3/3484 , Y02P70/613
摘要： A computer controlled system for high speed surface mount adhesive placement in circuit board production includes a dot generator supported for motion along the X, Y and Z axes. The dot generator ejects a jet of viscous adhesive that breaks away from the nozzle of the dot generator as a result of its own forward momentum. The system includes an automatic circuit board conveyor with adjustable width and pneumatically operated lift and lock mechanisms. The system runs through a self-diagnostic set-up procedure and dot calibration routine. Dot size and location are monitored through a video camera and vision circuit. A computer interfaces with the vision circuit and with motion, dot generator and conveyor controllers so that the system can operate in a high volume production assembly line. Application programs are executed by the system computer typically utilizing CAD data from a disk or a computer integrated manufacturing (CIM) controller. The system automatically assigns dot sizes to specific components based on user specifications or a component library. Dot placement paths are optimized by aligning the in-line points.
摘要翻译：用于电路板生产中的高速表面贴装粘合剂的计算机控制系统包括支持沿X，Y和Z轴运动的点发生器。点状发生器由于其自身的向前动量而喷出从点发生器的喷嘴脱离的粘性粘合剂射流。该系统包括具有可调宽度的自动电路板输送机和气动操作的升降机构。系统运行自诊断设置程序和点校准程序。点尺寸和位置通过摄像机和视觉电路进行监控。计算机与视觉电路和运动点阵发生器和输送机控制器相连接，使得系统能够在大量的生产装配线中运行。应用程序由系统计算机执行，通常利用来自盘或计算机集成制造（CIM）控制器的CAD数据。系统根据用户规格或组件库自动将点大小分配给特定组件。通过对齐直线点来优化点位置路径。

5. 发明授权

US5711989A Computer controlled method for dispensing viscous fluid 失效
标题翻译：用于分配粘性流体的计算机控制方法
公开(公告)号：US5711989A
公开(公告)日：1998-01-27
申请号：US612179
申请日：1996-03-07
申请人： Robert L. Ciardella , Philip P. Maiorca , Alec J. Babiarz , Duong La , Carlos E. Bouras , Mark S. Meier , John L. Christofferson , Ronald N. Abernathy , Stanley C. Aguilar , James C. Smith
发明人： Robert L. Ciardella , Philip P. Maiorca , Alec J. Babiarz , Duong La , Carlos E. Bouras , Mark S. Meier , John L. Christofferson , Ronald N. Abernathy , Stanley C. Aguilar , James C. Smith
IPC分类号： B05B13/00 , B05B12/08 , B05C5/00 , B05C5/02 , B05C11/10 , B23K3/06 , H01L21/56 , H01L21/58 , H05K3/34 , H05K13/04 , B05D5/12
CPC分类号： B05C11/1034 , B05B12/085 , B05B17/04 , B05C5/001 , B05C5/0225 , B23K3/0607 , H01L24/83 , H05K13/0469 , H05K3/305 , B23K2201/40 , H01L21/56 , H01L2224/83 , H05K2203/013 , H05K2203/163 , H05K3/3484 , Y02P70/613
摘要： A computer controlled method for high speed viscous fluid dispensing includes the steps of providing a dot generator and moving the dot generator along at least X and Y axes. The dot generator is controlled to repeatedly eject jets of viscous fluid that break away from the dot generator as a result of their forward momentum and fly to the surface of an adjacent substrate to create dots. The method may further comprise the step of monitoring the size and location of the dots through a vision system. The method may further comprise the steps of assigning dot sizes to specific components based on user specifications or a component library. The method may further comprise the step of optimizing the dot placement paths by aligning the in-line points of dot formation.
摘要翻译：用于高速粘性流体分配的计算机控制方法包括提供点发生器并沿着至少X轴和Y轴移动点发生器的步骤。控制点发生器重复地喷射由于其向前的动量而远离点发生器的粘性流体射流，并且飞溅到相邻衬底的表面以产生点。该方法还可以包括通过视觉系统监视点的尺寸和位置的步骤。该方法还可以包括基于用户规范或组件库将点大小分配给特定组件的步骤。该方法还可以包括通过对齐点形成的直线点来优化点放置路径的步骤。

6. 发明授权

US5913455A Apparatus for rapid dispensing of minute quantities of viscous material 失效
标题翻译：用于快速分配微量粘性物质的装置
公开(公告)号：US5913455A
公开(公告)日：1999-06-22
申请号：US803531
申请日：1997-02-20
申请人： Duong La , Robert L. Ciardella , Alec J. Babiarz , Carlos E. Bouras
发明人： Duong La , Robert L. Ciardella , Alec J. Babiarz , Carlos E. Bouras
IPC分类号： B05B13/00 , B05B12/08 , B05C5/00 , B05C5/02 , B05C11/10 , B23K3/06 , H01L21/56 , H01L21/58 , H05K3/34 , H05K13/04 , G01F11/02
CPC分类号： B05C11/1034 , B05B12/085 , B05B17/04 , B05C5/001 , B05C5/0225 , B23K3/0607 , H01L24/83 , H05K13/0469 , H05K3/305 , B23K2201/40 , H01L21/56 , H01L2224/83 , H05K2203/013 , H05K2203/163 , H05K3/3484 , Y02P70/613
摘要： A chamber that communicates with a viscous material reservoir has a flexible resilient diaphragm which forms an exterior wall thereof. An impact mechanism, which may comprise a solenoid actuated hammer, applies a predetermined momentum to the diaphragm for rapidly metering a predetermined minute blob of the viscous material from the chamber through a nozzle. The reservoir is pressurized with gas to force the viscous material into the chamber to refill the same. The chamber is heated to control the viscosity of the material. Dispensing rates in excess of four blobs per second can be achieved. Variations in the height of the nozzle from the surface of the workpiece are not critical to uniform rapid dispensing. An alternate embodiment eliminates the diaphragm and instead rapidly retracts a nozzle relative to a fluid feed conduit to eject very small blobs of viscous material. A strain gauge detects refill of the chamber inside the nozzle and sends a signal to control refill logic circuitry. A fiber optic droplet detector is utilized to correct dispensing defects.
摘要翻译：与粘性材料储存器连通的室具有形成其外壁的柔性弹性膜片。可以包括螺线管致动锤的冲击机构将预定的动量施加到隔膜上，以通过喷嘴快速计量来自腔室的粘性材料的预定的微小块。储存器用气体加压以迫使粘性物质进入腔室以再填充。加热室以控制材料的粘度。可以实现超过每秒4个点的分配速率。喷嘴从工件表面的高度变化对均匀快速分配并不重要。替代实施例消除了隔膜，相反地相对于流体供给管道使喷嘴快速缩回，以喷射非常小的粘性物质。应变仪检测喷嘴内的腔室的再填充，并将信号发送到控制补充逻辑电路。利用光纤液滴检测器来校正分配缺陷。

7. 发明授权

US5320250A Method for rapid dispensing of minute quantities of viscous material 失效
标题翻译：快速分配微量粘性物质的方法
公开(公告)号：US5320250A
公开(公告)日：1994-06-14
申请号：US978783
申请日：1992-11-19
申请人： Duong La , Robert L. Ciardella , Alec J. Babiarz , Carlos E. Bouras
发明人： Duong La , Robert L. Ciardella , Alec J. Babiarz , Carlos E. Bouras
IPC分类号： B05B13/00 , B05B12/08 , B05C5/00 , B05C5/02 , B05C11/10 , B23K3/06 , H01L21/56 , H01L21/58 , H05K3/34 , H05K13/04 , G01F11/06 , G01F11/08
CPC分类号： B05C11/1034 , B05B12/085 , B05B17/04 , B05C5/001 , B05C5/0225 , B23K3/0607 , H01L24/83 , H05K13/0469 , H05K3/305 , B23K2201/40 , H01L21/56 , H01L2224/83 , H05K2203/013 , H05K2203/163 , H05K3/3484 , Y02P70/613
摘要： A chamber that communicates with a viscous material reservoir has a flexible resilient diaphragm which forms an exterior wall thereof. An impact mechanism, which may comprise a solenoid actuated hammer, applies a predetermined momentum to the diaphragm for rapidly metering a predetermined minute blob of the viscous material from the chamber through a nozzle. The reservoir is pressurized with gas to force the viscous material into the chamber to refill the same. The chamber is heated to control the viscosity of the material. Dispensing rates in excess of four blobs per second can be achieved. Variations in the height of the nozzle from the surface of the workpiece are not critical to uniform rapid dispensing. An alternate embodiment eliminates the diaphragm and instead rapidly retracts a nozzle relative to a fluid feed conduit to eject very small blobs of viscous material. A strain gauge detects refill of the chamber inside the nozzle and sends a signal to control refill logic circuitry. A fiber optic droplet detector is utilized to correct dispensing defects.
摘要翻译：与粘性材料储存器连通的室具有形成其外壁的柔性弹性膜片。可以包括螺线管致动锤的冲击机构将预定的动量施加到隔膜上，以通过喷嘴快速计量来自腔室的粘性材料的预定的微小块。储存器用气体加压以迫使粘性物质进入腔室以再填充。加热室以控制材料的粘度。可以实现超过每秒4个点的分配速率。喷嘴从工件表面的高度变化对均匀快速分配并不重要。替代实施例消除了隔膜，相反地相对于流体供给管道使喷嘴快速缩回，以喷射非常小的粘性物质。应变仪检测喷嘴内的腔室的再填充，并将信号发送到控制补充逻辑电路。利用光纤液滴检测器来校正分配缺陷。

8. 发明授权

US06173864B1 Viscous material dispensing system and method with feedback control 有权
标题翻译：粘性材料分配系统和方法与反馈控制
公开(公告)号：US06173864B1
公开(公告)日：2001-01-16
申请号：US09298325
申请日：1999-04-23
申请人： Michael A. Reighard , John P. Byers , Rick Zakrajsek , Alec J. Babiarz , Alan R. Lewis , Floriana Suriawidjaja
发明人： Michael A. Reighard , John P. Byers , Rick Zakrajsek , Alec J. Babiarz , Alan R. Lewis , Floriana Suriawidjaja
IPC分类号： B67D508
CPC分类号： G01F25/0092
摘要： A system for accurately dispensing controlled amounts of viscous material. The system includes a pressurized supply of the viscous material, a dispenser connected with the pressurized supply and a feedback control for ensuring that a discrete dispensed amount corresponds closely to the desired dispensed amount for a particular application. The different methods of feedback control include changing pressure of the pressurized supply after measuring a dispensed amount and comparing the dispensed amount with a stored value representing the desired amount. Another manner of feedback control includes changing an air operating pressure associated with the dispenser. A third type of feedback control includes adjusting the duration that the dispenser is maintained on to dispense the viscous material. Each of these types of feedback control are preferably used in succession, as necessary, to ensure that the desired amount of viscous material is discharged from the dispenser. Methods of controlling an amount of viscous material discharged from a dispenser further include using one or more of the feedback controls described above.
摘要翻译：用于精确分配受控量的粘性材料的系统。该系统包括加压供应的粘性材料，与加压供应器连接的分配器和用于确保离散分配量与特定应用的期望分配量紧密相对应的反馈控制。反馈控制的不同方法包括在测量分配量之后改变加压供应的压力，并将分配量与表示期望量的存储值进行比较。反馈控制的另一种方式包括改变与分配器相关联的空气操作压力。第三类反馈控制包括调整分配器维持的持续时间以分配粘性材料。根据需要，这些类型的反馈控制中的每一种优选连续使用以确保从分配器中排出所需量的粘性材料。控制从分配器排出的粘性物质的量的方法还包括使用上述一个或多个反馈控制。

9. 发明授权

US06352423B1 Apparatus for underfilling semiconductor devices 失效
标题翻译：用于底部填充半导体器件的设备
公开(公告)号：US06352423B1
公开(公告)日：2002-03-05
申请号：US09567165
申请日：2000-05-08
申请人： Alec J. Babiarz , Carlos Edward Bouras , Drusilla Bertone Cursi , Alan Ray Lewis , Jason Thomas Vint
发明人： Alec J. Babiarz , Carlos Edward Bouras , Drusilla Bertone Cursi , Alan Ray Lewis , Jason Thomas Vint
IPC分类号： H01L2144
CPC分类号： H01L21/67126 , H01L21/563 , H01L24/743 , H01L2224/16225 , H01L2224/73203 , H01L2924/01077 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00
摘要： A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.
摘要翻译：一种在多面半导体器件与具有粘性底部填充材料的衬底之间填充间隙的方法和装置。将粘性底部填充材料移动到间隙中以封装形成在半导体器件和衬底之间的多个电互连。在半导体器件和衬底之间提供密封件，以沿着器件的多个边缘密封间隙，同时间隙沿着器件的至少一侧被开封以允许与间隙的流体连通。粘性底部填充材料邻近装置的至少一侧被分配，沿间隙开口封闭，并且在底部填充材料之间产生压差，以将底部填充材料拉入间隙中，从而封装电气互连。

10. 发明授权

US06255142B1 Method for underfilling semiconductor devices 有权
标题翻译：底部填充半导体器件的方法
公开(公告)号：US06255142B1
公开(公告)日：2001-07-03
申请号：US09430408
申请日：1999-10-29
申请人： Alec J. Babiarz , Carlos Edward Bouras , Drusilla Bertone Cursi , Alan Ray Lewis , Jason Thomas Vint
发明人： Alec J. Babiarz , Carlos Edward Bouras , Drusilla Bertone Cursi , Alan Ray Lewis , Jason Thomas Vint
IPC分类号： H01L2144
CPC分类号： H01L21/67126 , H01L21/563 , H01L24/743 , H01L2224/16225 , H01L2224/73203 , H01L2924/01077 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00
摘要： A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.
摘要翻译：一种在多面半导体器件与具有粘性底部填充材料的衬底之间填充间隙的方法和装置。将粘性底部填充材料移动到间隙中以封装形成在半导体器件和衬底之间的多个电互连。在半导体器件和衬底之间提供密封件，以沿着器件的多个边缘密封间隙，同时间隙沿着器件的至少一侧被开封以允许与间隙的流体连通。粘性底部填充材料邻近装置的至少一侧被分配，沿间隙开口封闭，并且在底部填充材料之间产生压差，以将底部填充材料拉入间隙中，从而封装电气互连。

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