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    • 10. 发明授权
    • Testing communication during implantation
    • 测量植入过程中的沟通
    • US08983619B2
    • 2015-03-17
    • US12732403
    • 2010-03-26
    • Can CinbisH. Toby Markowitz
    • Can CinbisH. Toby Markowitz
    • A61N1/08A61B5/00A61N1/372A61B19/00A61N1/375
    • A61B5/0028A61B5/0031A61B2034/2053A61B2560/0271A61N1/37205A61N1/37217A61N1/37241A61N1/3756
    • A system and method are described for testing communication through a patient during implantation using telemetry coupling electrodes on a delivery catheter. In one example, at least two telemetry coupling electrodes may be placed on or within a delivery catheter to test conductive communication with external body electrodes during implantation. In some instances, the telemetry coupling electrodes of the delivery catheter may approximate the spacing of telemetry electrodes on an IMD. In this manner, testing conductively coupled communication with telemetry coupling electrodes of the catheter may be used to mimic the telemetry electrodes on the IMD and determine a target position and/or orientation of an electrode or electrodes of the IMD for successful conductive communication through the body.
    • 描述了一种系统和方法,用于在植入期间通过患者使用传送导管上的遥测耦合电极来测试通信。 在一个示例中,至少两个遥测耦合电极可以放置在输送导管上或内部,以在植入期间测试与外部身体电极的导电连通。 在一些情况下,输送导管的遥测耦合电极可以接近IMD上遥测电极的间距。 以这种方式,测试与导管的遥测耦合电极的导电耦合通信可以用于模拟IMD上的遥测电极,并且确定IMD的电极或电极的目标位置和/或取向以便通过身体成功地导电连通 。