会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 10. 发明申请
    • METHODS OF FORMING A GLASS WIRING BOARD SUBSTRATE
    • 形成玻璃接线板基板的方法
    • WO2012074952A1
    • 2012-06-07
    • PCT/US2011/062292
    • 2011-11-29
    • CORNING INCORPORATEDDANNOUX, Thierry Luc Alain
    • DANNOUX, Thierry Luc Alain
    • C03B21/04C03B23/26
    • C03B23/26C03B23/02H01L2224/16225H01L2224/73253H01L2924/15174H01L2924/15311H01L2924/16152H01L2924/19106
    • Disclosed is a method or process for forming a glass wiring board substrate for integrated circuit wiring boards, including providing a first molding surface (20) positioned on a first mold (22) having truncated conical pins (24) protruding therefrom, the pins (24) having a diameter at the top end (26) thereof of 150 micrometers or less, and a minimum pitch (28) of 400 micrometers or less, providing a glass sheet (30) having first and second surfaces (32,34) on opposite major sides thereof, pressing the first surface (32) of the glass sheet against the molding surface (20),heating the glass sheet (30) and the first molding surface (20) together to a temperature sufficient to soften a glass of which the glass sheet (30) is comprised, such that the pattern of the first molding (20) surface is replicated in the first surface (32) of the glass sheet (30), thereby producing a formed glass sheet (30') having an array of holes (40) therein, cooling the formed glass sheet (30') and the molding surface (20) together to a temperature below the softening point of said glass, and separating the formed glass sheet (30) from the molding surface (20). The forming may press the glass sheet using one mold surface or two mold surfaces simultaneously. For embodiments using a single mold, the holes may be blind holes after pressing, and may then be opened to form through-holes by back side lapping. Alternatively, the glass is pressed up to through-hole formation, avoiding the need of back side lapping.
    • 公开了一种用于形成用于集成电路布线板的玻璃布线板基板的方法或工艺,其包括提供位于具有从其突出的截头锥形销(24)的第一模具(22)上的第一模制表面(20),销(24 ),其顶端(26)的直径为150微米或更小,最小间距(28)为400微米或更小,提供在相对的第一表面和第二表面(32,34)上具有第一和第二表面(32,34)的玻璃板(30) 将玻璃板的第一表面(32)压靠在模制表面(20)上,将玻璃板(30)和第一模制表面(20)加热到足以软化玻璃板 包括玻璃板(30),使得第一成型体(20)表面的图案被复制在玻璃板(30)的第一表面(32)中,从而制造具有阵列的成形玻璃板(30') 的孔(40),冷却所形成的玻璃板(30')和模制件 表面(20)一起处于低于所述玻璃的软化点的温度,并将所形成的玻璃板(30)与模制表面(20)分离。 成形可以使用一个模具表面或两个模具表面同时挤压玻璃板。 对于使用单个模具的实施例,孔可以是压制后的盲孔,然后可以通过背面研磨打开以形成通孔。 或者,玻璃被压制成通孔形成,避免了背面研磨的需要。