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1. 发明申请

WO2010059898A2 METHOD OF WELDBONDING AND A DEVICE COMPRISING WELDBONDED COMPONENTS 审中-公开
标题翻译：焊接方法和包括焊接部件的装置
公开(公告)号：WO2010059898A2
公开(公告)日：2010-05-27
申请号：PCT/US2009/065258
申请日：2009-11-20
申请人： CORNING INCORPORATED , BHAGAVATULA, Venkata, A. , BOURCIER, Roy, J. , CHAPARALA, Satish, C. , HIMMELREICH, John
发明人： BHAGAVATULA, Venkata, A. , BOURCIER, Roy, J. , CHAPARALA, Satish, C. , HIMMELREICH, John
IPC分类号： B23K26/20 , H01L33/48
CPC分类号： G02B6/2551 , B29C65/1406 , B29C65/16 , B29C65/1616 , B29C65/1619 , B29C65/4815 , B29C65/4835 , B29C65/484 , B29C65/4845 , B29C65/72 , B29C66/21 , B29C66/3452 , B29C2035/0822 , B29C2035/0827 , G02B6/3801 , G02B6/4237 , G02B6/4239 , Y10T428/269 , Y10T428/31551 , Y10T428/31663 , Y10T428/31721
摘要： A method of assembling optoelectronic and/or photonic components, said method comprising: (i) providing at least two optoelectronic and/or photonic components; (ii) aligning and situating these components relative to one another and in close proximity with one another so as to: (a) provide optical coupling between these components; and (b) maintain the distance d between the adjacent parts of these components, where d is 0 to 100 µm; (iii) adhering these components to one another with while maintaining optical coupling therebetween; and (iv) laser welding these components together while maintaining optical coupling therebetween.
摘要翻译：一种组装光电子和/或光子部件的方法，所述方法包括：（i）提供至少两个光电子和/或光子部件; （ii）将这些部件相对于彼此对准并定位并彼此靠近以便：（a）提供这些部件之间的光耦合; 和（b）保持这些部件的相邻部分之间的距离d，其中d为0至100微米; （iii）将这些部件彼此粘合，同时保持它们之间的光耦合; 和（iv）将这些部件激光焊接在一起，同时保持它们之间的光耦合。

2. 发明申请

WO2010138481A2 EDGE BONDED OPTICAL PACKAGES 审中-公开
标题翻译：边缘粘合光学包装
公开(公告)号：WO2010138481A2
公开(公告)日：2010-12-02
申请号：PCT/US2010/036021
申请日：2010-05-25
申请人： CORNING INCORPORATED , BHAGAVATULA, Venkata, A. , CHAPARALA, Satish, C. , HIMMELREICH, John , HUGHES, Lawrence, C., Jr.
发明人： BHAGAVATULA, Venkata, A. , CHAPARALA, Satish, C. , HIMMELREICH, John , HUGHES, Lawrence, C., Jr.
IPC分类号： H01S5/022
CPC分类号： G02B6/4245 , G02B6/4207 , G02B6/4228 , G02B6/4244 , G02B6/4265 , G02F1/37 , H01S5/0092 , H01S5/02216 , H01S5/02252
摘要： Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed.
摘要翻译：本公开的特定实施例使得SHG晶体或其它类型的波长转换装置与激光源紧密相邻以消除对光耦合的需要，减少封装部件的数量并减小封装体积。根据本公开的一个实施例，提供了一种光学封装，其包括激光源子组件，其包括激光基座和包括转换器基座的波长转换器件子组件。激光器基座的接合界面与转换器基座的互补接合界面结合，使得激光输出面可以以预定的界面间距x接近耦合到转换器输入面。公开并要求保护附加实施例。

3. 发明申请

WO2009151558A1 SEMICONDUCTOR LASER PACKAGES 审中-公开
标题翻译：半导体激光器包
公开(公告)号：WO2009151558A1
公开(公告)日：2009-12-17
申请号：PCT/US2009/003415
申请日：2009-06-05
申请人： CORNING INCORPORATED , CHAPARALA, Satish, C. , HUGHES, Lawrence, C., Jr.
发明人： CHAPARALA, Satish, C. , HUGHES, Lawrence, C., Jr.
IPC分类号： H01L29/167
CPC分类号： H01S5/02216 , H01S5/005 , H01S5/0092 , H01S5/02469 , H01S5/02492
摘要： A laser package may include a metallic platform, a laser diode mounting insert, a liquid crystal polymer header, an electrical interconnect, a laser diode, an optical crystal, and coupling optics. The laser diode mounting insert, coupling optics and optical crystal are coupled to the metallic platform. The electrical interconnect may have conductive pads positioned on an internal portion of the electrical interconnect and conductive traces originating from the conductive pads and running across an external portion of the electrical interconnect. The internal portion may be coupled to the metallic platform. The laser diode may be mounted to the laser diode mounting insert. The coupling optics may be configured to redirect the output beam toward the optical crystal. The liquid crystal polymer at least partially encloses the metallic platform. The liquid crystal polymer may be coupled to the metallic platform and electrical interconnect via an adhesive promoter.
摘要翻译：激光器封装可以包括金属平台，激光二极管安装插件，液晶聚合物集管，电互连，激光二极管，光学晶体和耦合光学器件。激光二极管安装插件，耦合光学器件和光学晶体耦合到金属平台。电互连可以具有定位在电互连的内部部分上的导电焊盘和源自导电焊盘并穿过电互连的外部部分的导电迹线。内部部分可以联接到金属平台。激光二极管可以安装到激光二极管安装插件。耦合光学器件可以被配置为将输出光束重定向到光学晶体。液晶聚合物至少部分地包围金属平台。液晶聚合物可以通过粘合促进剂偶联到金属平台和电互连。

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