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1. 发明申请

WO2010099176A1 RESTORING WAVEGUIDE SHG AFTER PHOTODEGRADATION BY HEATING 审中-公开
标题翻译：通过加热进行光电放大后恢复波纹管
公开(公告)号：WO2010099176A1
公开(公告)日：2010-09-02
申请号：PCT/US2010/025200
申请日：2010-02-24
申请人： CORNING INCORPORATED , GOERS, Uta-Barbara , ROUSSEV, Rostislav V
发明人： GOERS, Uta-Barbara , ROUSSEV, Rostislav V
IPC分类号： G02F1/35 , G02F1/377 , H01S5/00 , H01S5/06
CPC分类号： G02F1/3525 , G02F1/3775 , H01S5/005 , H01S5/0092 , H01S5/0612 , H01S5/06213
摘要： A method for operating a frequency converted laser source comprising at least one semiconductor laser (110) and a wavelength conversion device (120) optically coupled to at least one semiconductor laser (110) may include operating the frequency converted laser source to produce a frequency converted output beam (128) from the wavelength conversion device (120) and intermittently heating the wavelength conversion device above a recovery threshold temperature T R of the wavelength conversion device. When the wavelength conversion device is heated abo.ve the recovery threshold temperature, the wavelength conversion device is held above the recovery threshold temperature T R for a period of time sufficient to restore output power lost to photo-degradation in the wavelength conversion device during operation of the frequency converted laser source. The heater (160) is controlled by a MC (150) and is for example attached to the waveguide (124) of a MgO : PPL with a recovery temperature of 70°C.
摘要翻译：一种用于操作频率转换的激光源的方法，包括至少一个半导体激光器（110）和光学耦合到至少一个半导体激光器（110）的波长转换器件（120），可以包括操作变频激光源以产生频率转换输出光束（128），并且将波长转换装置间歇地加热到波长转换装置的恢复阈值温度TR以上。当波长转换装置被加热到恢复阈值温度时，波长转换装置被保持在恢复阈值温度TR之上一段足以恢复在波长转换装置中的光劣化损失的输出功率，变频激光源。加热器（160）由MC（150）控制，并且例如以恢复温度为70℃连接到MgO：PPL的波导管（124）。

2. 发明申请

WO2018005404A1 METHOD AND SYSTEM FOR MEASURING GEOMETRIC PARAMETERS OF THROUGH HOLES 审中-公开
标题翻译：用于测量孔的几何参数的方法和系统
公开(公告)号：WO2018005404A1
公开(公告)日：2018-01-04
申请号：PCT/US2017/039360
申请日：2017-06-27
申请人： CORNING INCORPORATED
发明人： GOERS, Uta-Barbara , SHARPS, Robert Wendell
IPC分类号： G01B11/12
摘要： A method of measuring geometric parameters of through holes in a thin substrate incudes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.
摘要翻译：测量薄基板中的通孔的几何参数的方法包括使用具有深度大于基板的厚度的深度的光学系统来获取基板的选择子体积的图像。处理获取的图像以确定所需的几何参数。

3. 发明申请

WO2016176171A1 METHOD OF LASER DRILLING THROUGH HOLES IN SUBSTRATES USING AN EXIT SACRIFICIAL COVER LAYER; CORRESPONDING WORKPIECE 审中-公开
标题翻译：通过使用出口密封层在基板上通过孔激光钻孔的方法; 相关工作
公开(公告)号：WO2016176171A1
公开(公告)日：2016-11-03
申请号：PCT/US2016/029300
申请日：2016-04-26
申请人： CORNING INCORPORATED
发明人： GOERS, Uta-Barbara
IPC分类号： B23K26/18 , B23K26/0622 , B23K26/382
CPC分类号： H01L23/49827 , B23K26/0622 , B23K26/18 , B23K26/382 , H01L21/486 , H01L23/49838 , H01L23/49894 , H05K3/002 , H05K3/0029 , H05K3/4038 , H05K2203/1383
摘要： A workpiece (101) and a method of forming through holes (115) in substrate (100) are disclosed. The method of forming a through hole (115) in a substrate (100; 101) by drilling includes affixing an exit sacrificial cover layer (130) to a laser beam exit surface (112) of the substrate (100), positioning a laser beam (20) in a predetermined location relative to the substrate (100) and corresponding to a desired location for the through hole 8115), and forming the through hole 8115) by repeatedly pulsing the laser beam (20) into an entrance surface (110) of the substrate (100) and through a bulk of the substrate (100). The method further includes forming a hole (135) in the exit sacrificial cover layer (130) by repeatedly pulsing the laser beam (20) into the through hole (115) formed in the substrate (100) such that the laser beam (20) passes through the laser beam exit surface (112) of the substrate (100) and into the exit sacrificial cover layer (130).
摘要翻译：公开了一种工件（101）和在衬底（100）中形成通孔（115）的方法。通过钻孔在基板（100; 101）中形成通孔（115）的方法包括将出射牺牲覆盖层（130）附着到基板（100）的激光束出射表面（112），定位激光束（20）进入入射表面（110）中的相对于基板（100）的预定位置并且对应于通孔8115的期望位置），并且形成通孔8115）（100）的基底（100）。该方法还包括通过将激光束（20）重复地脉冲到形成在基板（100）中的通孔（115）中，使出射牺牲覆盖层（130）中的激光束（20）形成孔（135）通过基板（100）的激光束出射表面（112）并进入出射牺牲覆盖层（130）。

4. 发明申请

WO2018085237A1 METHOD AND APPARATUS FOR INSPECTING DEFECTS ON TRANSPARENT SUBSTRATE AND METHOD OF EMITTING INCIDENT LIGHT 审中-公开
标题翻译：用于检查透明基板上的缺陷的方法和设备以及发射事故灯的方法
公开(公告)号：WO2018085237A1
公开(公告)日：2018-05-11
申请号：PCT/US2017/059220
申请日：2017-10-31
申请人： CORNING INCORPORATED
发明人： AN, Chong Pyung , GOERS, Uta-Barbara , HONG, En , HWANG, Sung-chan , JUNG, Ji Hwa , KEEM, Tae-ho , LEBLANC, Philip Robert , LEE, Hyeong-cheol , MLEJNEK, Michal , MOLL, Johannes , PALANISAMY, Rajeshkannan , PYO, Sung-jong , THOMAS, Amanda Kathryn , USTANIK, Correy Robert
IPC分类号： G01N21/896 , G01N21/958
摘要： A method of inspecting defects on a transparent substrate may include: selecting a gradient of an illumination optical system so that light incident on the transparent substrate has a first angle; selecting a gradient of a detection optical system so that an optical axis of the detection optical system located over the transparent substrate has a second angle, which is equal to or less than the first angle; adjusting a position of at least one of the illumination optical system, the transparent substrate, and the detection optical system so that a field-of-view of the detection optical system covers a first region where the light meets a first surface of the transparent substrate and does not cover a second region where light meets a second surface of the transparent substrate, the second surface being opposite to the first surface; illuminating the transparent substrate; and detecting light scattered from the transparent substrate.
摘要翻译：检测透明基板上的缺陷的方法可以包括：选择照明光学系统的梯度，使得入射在透明基板上的光具有第一角度; 选择检测光学系统的梯度，使得位于透明基板上方的检测光学系统的光轴具有等于或小于第一角度的第二角度; 调整所述照明光学系统，所述透明基板和所述检测光学系统中的至少一个的位置，使得所述检测光学系统的视场覆盖所述光与所述透明基板的第一表面相遇的第一区域并且不覆盖光线与透明基板的第二表面相遇的第二区域，第二表面与第一表面相对; 照亮透明基板; 并检测从透明基板散射的光。

5. 发明申请

WO2016141005A1 CONTINUOUS GLASS PROCESSING APPARATUS AND METHOD OF PROCESSING FLEXIBLE GLASS RIBBON 审中-公开
标题翻译：连续玻璃加工设备及加工柔性玻璃纤维的方法
公开(公告)号：WO2016141005A1
公开(公告)日：2016-09-09
申请号：PCT/US2016/020342
申请日：2016-03-02
申请人： CORNING INCORPORATED
发明人： GERBER, Kurt Edward , GOERS, Uta-Barbara , PANIN, Nikolay Anatolyevich , WEBB, James Ernest
IPC分类号： B65H23/32
CPC分类号： C03B13/16 , B65H23/32 , B65H2801/61 , C03B13/04
摘要： A method of selecting a radius of curvature for a conveying structure (22) of a continuous glass processing apparatus for processing a flexible glass ribbon (20) having a thickness of no more than about 0.3 mm is provided. The method includes identifying a thickness of the flexible glass ribbon (20). A predetermined bending stress level is selected that is suitable for the flexible glass ribbon (20) during the processing of the flexible glass ribbon. A radius (R) of curvature is selected for a conveying structure that is suitable for conveying the flexible glass ribbon (20) during the processing of the flexible glass ribbon through the glass processing apparatus based on the predetermined bending stress and at least one of web deflection angle and line tension. The glass processing apparatus is provided including the conveying structure.
摘要翻译：提供了选择用于处理厚度不大于约0.3mm的柔性玻璃带（20）的连续玻璃加工设备的输送结构（22）的曲率半径的方法。该方法包括识别柔性玻璃带（20）的厚度。在柔性玻璃带的加工期间选择适合于柔性玻璃带（20）的预定弯曲应力水平。对于适合于在柔性玻璃带通过玻璃加工设备基于预定弯曲应力的加工期间输送柔性玻璃带（20）的输送结构，选择曲率半径（R），并且至少一个网偏转角和线张力。玻璃加工设备包括输送结构。

6. 发明公开

EP3265414A1 CONTINUOUS GLASS PROCESSING APPARATUS AND METHOD OF PROCESSING FLEXIBLE GLASS RIBBON 审中-公开
标题翻译：连续玻璃加工设备和加工柔性玻璃丝带的方法
公开(公告)号：EP3265414A1
公开(公告)日：2018-01-10
申请号：EP16710880.2
申请日：2016-03-02
申请人： Corning Incorporated
发明人： GERBER, Kurt Edward , GOERS, Uta-Barbara , PANIN, Nikolay Anatolyevich , WEBB, James Ernest
IPC分类号： B65H23/32
CPC分类号： C03B13/16 , B65H23/32 , B65H2801/61 , C03B13/04
摘要： A method of selecting a radius of curvature for a conveying structure (22) of a continuous glass processing apparatus for processing a flexible glass ribbon (20) having a thickness of no more than about 0.3 mm is provided. The method includes identifying a thickness of the flexible glass ribbon (20). A predetermined bending stress level is selected that is suitable for the flexible glass ribbon (20) during the processing of the flexible glass ribbon. A radius (R) of curvature is selected for a conveying structure that is suitable for conveying the flexible glass ribbon (20) during the processing of the flexible glass ribbon through the glass processing apparatus based on the predetermined bending stress and at least one of web deflection angle and line tension. The glass processing apparatus is provided including the conveying structure.

7. 发明申请

WO2018085233A1 METHOD AND APPARATUS FOR INSPECTING DEFECTS ON TRANSPARENT SUBSTRATE 审中-公开
标题翻译：用于检查透明衬底上的缺陷的方法和设备
公开(公告)号：WO2018085233A1
公开(公告)日：2018-05-11
申请号：PCT/US2017/059213
申请日：2017-10-31
申请人： CORNING INCORPORATED
发明人： GOERS, Uta-Barbara , HONG, En , HWANG, Sung-chan , JUNG, Ji Hwa , KEEM, Tae-ho , LEBLANC, Philip Robert , PALANISAMY, Rajeshkannan , PYO, Sung-jong , USTANIK, Correy Robert
IPC分类号： G01N21/88 , G01B11/24 , G01N21/956 , G02B21/10 , G02B21/18 , H01L21/66
摘要： A method of inspecting defects of a transparent substrate may include: illuminating a transparent substrate; calculating an incidence angle range of light so that a first region where the light meets a first surface of the transparent substrate and a second region where light meets a second surface being opposite the first surface of the transparent substrate do not overlap each other; adjusting an incidence angle according to the incidence angle range; adjusting a position of a first detector so that a first field-of-view of the first detector covers the first region and does not cover the second region; adjusting a position of a second detector so that a second field-of-view of the second detector covers the second region and does not cover the first region; and obtaining a first image of the first region and a second image of the second region from the first and second detector, respectively.
摘要翻译：检测透明基板的缺陷的方法可以包括：照射透明基板; 计算光的入射角范围，使得光与所述透明基板的第一表面相遇的第一区域和光与所述透明基板的第一表面相对的第二表面相遇的第二区域不相互重叠; 根据入射角范围调整入射角; 调整第一检测器的位置，使得第一检测器的第一视场覆盖第一区域并且不覆盖第二区域; 调整第二检测器的位置，使得第二检测器的第二视场覆盖第二区域并且不覆盖第一区域; 以及分别从第一和第二检测器获得第一区域的第一图像和第二区域的第二图像。

8. 发明申请

WO2015031566A1 METHODS FOR FORMING VIAS IN GLASS SUBSTRATES 审中-公开
标题翻译：玻璃基材中形成VIAS的方法
公开(公告)号：WO2015031566A1
公开(公告)日：2015-03-05
申请号：PCT/US2014/053066
申请日：2014-08-28
申请人： CORNING INCORPORATED
发明人： BURKET, Robert Carl , GOERS, Uta-Barbara , OWUSU, Samuel Odei , PETRIWSKY, Tammy Lynn
IPC分类号： B23K26/36
CPC分类号： C03C15/00 , B23K26/006 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K2203/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
摘要： Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
摘要翻译：公开了通过激光钻孔和酸蚀刻在玻璃基板中形成通孔的方法。在一个实施例中，在玻璃基板中形成通孔的方法包括从玻璃基板的入射表面激光穿过玻璃基板的厚度的至少一部分。该方法还包括在蚀刻持续时间的至少一部分期间蚀刻玻璃基板以蚀刻持续时间以增加通孔的入射开口的直径并向玻璃基板施加超声波能量。所应用的超声波能量的频率在40 kHz到192 kHz之间。

9. 发明申请

WO2010099076A1 METHOD FOR DETERMINING WHEN TO REGENERATE EXHAUST GAS PARTICULATE FILTERS 审中-公开
标题翻译：用于确定再生气体颗粒过滤器的方法
公开(公告)号：WO2010099076A1
公开(公告)日：2010-09-02
申请号：PCT/US2010/024972
申请日：2010-02-23
申请人： CORNING INCORPORATED , GEORGE, Jacob , GOERS, Uta-Barbara , GUNASEKARAN, Natarajan , SQUIER, Gary, G.
发明人： GEORGE, Jacob , GOERS, Uta-Barbara , GUNASEKARAN, Natarajan , SQUIER, Gary, G.
IPC分类号： F01N9/00 , G01N22/00
CPC分类号： F01N9/002 , Y02T10/47
摘要： Methods for determining when to regenerate an exhaust gas particulate filter (10), for regenerating, and for calibrating a pressure drop across such filters are disclosed. An example method involves reducing a first amount of particulates (52) accumulated in the filter to a residual amount RA DP . The method also includes measuring the residual amount RA DP by exciting the microwave resonant cavity (126) in which the filter resides with microwave radiation (182) and then monitoring the microwave cavity response. The method also includes using the measured value of RA DP to calibrate a pressure drop threshold ΔP TH so that it is representative of a limit (T DP ) of particulate accumulation in the filter. The methods may also include regenerating the filter a number of times and each time re-setting the pressure drop threshold ΔP TH based on measurements of RA DP taken after each filter regeneration.
摘要翻译：公开了用于确定何时再生废气微粒过滤器（10），用于再生和用于校准跨过这些过滤器的压降的方法。示例性方法包括将累积在过滤器中的第一量的微粒（52）减少到剩余量RADP。该方法还包括通过激发微波谐振腔（126）来测量剩余量RADP，其中滤波器驻留有微波辐射（182），然后监测微波腔响应。该方法还包括使用RADP的测量值来校准压降阈值ΔPTH，使其代表过滤器中颗粒物积聚的极限（TDP）。这些方法还可以包括重复过滤器多次，并且每次基于每个过滤器再生之后获取的RADP的测量值重新设置压降阈值ΔPTH。

10. 发明申请

WO2010053819A2 IN-SITU CONTAMINANT REMOVAL IN OPTICAL PACKAGES 审中-公开
标题翻译：光学包装中的原位污染物去除
公开(公告)号：WO2010053819A2
公开(公告)日：2010-05-14
申请号：PCT/US2009/062458
申请日：2009-10-29
申请人： CORNING INCORPORATED , GOERS, Uta-Barbara
发明人： GOERS, Uta-Barbara
IPC分类号： H01S5/06
CPC分类号： H01S5/0092 , H01S5/005 , H01S5/0071
摘要： A method of controlling an optical package is provided where the average power density of the output beam of the semiconductor laser on the input facet of the wavelength conversion device in a relatively high power wavelength conversion mode exceeds the power density of the output beam of the semiconductor laser on the input facet of the wavelength conversion device in a relatively low power contaminant removal mode. In the relatively high power wavelength conversion mode, the adjustable optical components are utilized to correlate an optimum intensity value of a wavelength-converted output of the wavelength conversion device with optimum coordinates representing the position of the output beam of the semiconductor laser on the waveguide portion of the input facet of the wavelength conversion device. In the relatively low power contaminant removal mode, the adjustable optical components are utilized to scan the output beam of the semiconductor laser across the waveguide portion of the input facet of the wavelength conversion device while maintaining the power density of the output beam on the input facet of the wavelength conversion device below the average power density of the output beam in the relatively high power wavelength conversion mode. Additional embodiments are disclosed and claimed.
摘要翻译：提供了一种控制光学组件的方法，其中在相对较高功率的波长转换模式中在波长转换装置的输入小平面上的半导体激光器的输出光束的平均功率密度超过功率在相对低功率的污染物去除模式下，在波长转换装置的输入面上的半导体激光器的输出光束的密度。在相对较高的功率波长转换模式中，可调整的光学部件用于将波长转换装置的波长转换输出的最佳强度值与表示半导体激光器的输出光束在波导部分上的位置的最佳坐标相关联的波长转换装置的输入端面。在相对较低功率的污染物去除模式中，可调整的光学部件被用来扫描半导体激光器的输出光束穿过波长转换器件的输入面的波导部分，同时保持输出面上的输出光束的功率密度在相对高功率波长转换模式下低于输出光束的平均功率密度。另外的实施例被公开和要求保护。

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