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1. 发明专利

CA2184983A1 AN INTRAVASCULAR TREATMENT SYSTEM AND PERCUTANEOUS RELEASE MECHANISM THEREFOR 未知
公开(公告)号：CA2184983A1
公开(公告)日：1995-09-14
申请号：CA2184983
申请日：1995-03-08
申请人： COOK INC
发明人： HALL TODD A , PARKER FRED T
IPC分类号： A61B17/00 , A61B17/12 , A61F2/00 , A61F2/06 , A61F2/01
摘要： A percutaneous release mechanism (57) for use with an intravascular treatment device (11) in an intravascular treatment system (10). The release mechanism includes an inner member (17) having a connection mechanism (13) positioned about the distal end (14) thereof for interconnection with another connection mechanism (12) positioned on an intravascular treatment device. The release mechanism also includes an outer member tube (13) of which the inner member is positioned therein. The first and second connection mechanisms are interconnectable and positionable in the passage (16) of the tube for delivering the treatment device in a delivery state to the treatment site The release mechanism also includes a handle (37) having parts (33, 39) connected to the inner member and outer tube, whereby movement of the proximal end of the inner member is translated to the distal end thereof for extending the interconnected connection mechanisms from the passage of the outer member tube and positioning the treatment device in a treatment state. The intravascular treatment system includes the percutaneous release mechanism along with the intravascular treatment device. The treatment device includes an occlusion coil (23) and a rigid tube (36) connected to the flexible outer member tube (35) for maintaining the delivery coil in a delivery state. In another example, the treatment device includes a blood clot filter (40) in which the percutaneous delivery mechanism is adapted for connection thereto.

2. 发明专利

AU655468B2 A joint, a laminate, and a method of preparing a nickel titanium alloy member surface for bonding to another layer of metal 未知
公开(公告)号：AU655468B2
公开(公告)日：1994-12-22
申请号：AU1700592
申请日：1992-05-19
申请人： COOK INC
发明人： HALL TODD A
IPC分类号： B23K1/19 , B23K1/20 , B23K35/00 , B23K35/36
摘要： A joint and a laminate including a nickel-titanium alloy such as nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying an aluminum paste flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein along with leaching titanium from the base alloy member surface to form a nickel-rich interface surface. The activated flux also coats the nickel-rich interface layer for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the nickel-rich interface surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the nickel-rich interface surface, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.

3. 发明专利

AU8579391A GUIDE FOR LOCALIZING A NONPALPABLE BREAST LESION 未知
公开(公告)号：AU8579391A
公开(公告)日：1992-04-16
申请号：AU8579391
申请日：1991-10-11
申请人： COOK INC
发明人： MILLER RICHARD H , BATES BRIAN L , HALL TODD A , OSBORNE THOMAS A
IPC分类号： A61M25/01 , A61B17/00 , A61B19/00 , A61F2/00 , A61M25/06
摘要： A medical device (10) for localizing a nonpalpable breast lesion (20). The device includes a tubular introducer needle (11) and a wire guide (14) positioned therein for inserting into a breast (25) to the site of the lesion. The wire guide includes a distal portion (16) which is preformed into a resilient helical coil configuration for locking into position about the lesion. The distal portion includes a superelastic metallic alloy for maintaining the helical coil configuration after repeated extensions from and retractions into the needle passageway. With a visualization aid such as an X-ray film or ultrasound, a radiologist typically inserts the needle with the wire guide positioned therein into the breast to the site of the lesion and extends the distal portion of the wire guide from the needle. The distal end of the needle includes a plurality of indentations for enhancing the ultrasound visualization thereof. As the distal portion of the wire guide emerges from the needle, the acuate distal end (17) of the wire guide cuts into and scribes a helical path about the tissue distal to the lesion. The remainder of the distal portion of the wire guide follows the path scribed by the acuate distal tip and locks about the tissue distal to the lesion. Should the needle and wire guide not be appropriately positioned, the distal portion of the wire guide is retracted into the passageway of the needle to reposition the needle and guide. After desired positioning, the needle is removed with the wire guide remaining in a locked position distally about the lesion for guiding guides the surgeon to the lesion site during subsequent surgery.

4. 发明专利

DK0515078T3 未知
公开(公告)号：DK0515078T3
公开(公告)日：1998-03-16
申请号：DK92304286
申请日：1992-05-12
申请人： COOK INC
发明人： HALL TODD A
IPC分类号： B23K1/20 , B23K35/00 , B23K35/36 , B23K1/19 , B23K35/363 , B32B15/01 , C23F1/00
摘要： A joint and a laminate including a nickel-titanium alloy such as nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying an aluminum paste flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein along with leaching titanium from the base alloy member surface to form a nickel-rich interface surface. The activated flux also coats the nickel-rich interface layer for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the nickel-rich interface surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the nickel-rich interface surface, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.

5. 发明专利

DE69423405T2 未知
公开(公告)号：DE69423405T2
公开(公告)日：2000-09-07
申请号：DE69423405
申请日：1994-08-24
申请人： COOK INC
发明人： HALL TODD A
IPC分类号： B23K1/19 , B23K1/20 , B23K35/00 , B23K35/34 , B23K35/36 , B23K35/363
摘要： A joint and a laminate including a nickel-titanium alloy such as Nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying a halogen containing flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein and deposits a metal from the halogen containing flux on the oxidation free surface. The activated flux also coats the member surface for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the tinned surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the metal from the halogen containing flux, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.

6. 发明专利

DE69423405D1 未知
公开(公告)号：DE69423405D1
公开(公告)日：2000-04-20
申请号：DE69423405
申请日：1994-08-24
申请人： COOK INC
发明人： HALL TODD A
IPC分类号： B23K1/19 , B23K1/20 , B23K35/00 , B23K35/34 , B23K35/36 , B23K35/363
摘要： A joint and a laminate including a nickel-titanium alloy such as Nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying a halogen containing flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein and deposits a metal from the halogen containing flux on the oxidation free surface. The activated flux also coats the member surface for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the tinned surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the metal from the halogen containing flux, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.

7. 发明专利

DE69223343T2 未知
公开(公告)号：DE69223343T2
公开(公告)日：1998-03-26
申请号：DE69223343
申请日：1992-05-12
申请人： COOK INC
发明人： HALL TODD A
IPC分类号： B23K1/19 , B23K1/20 , B23K35/00 , B23K35/36 , B23K35/363 , B32B15/01 , C23F1/00
摘要： A joint and a laminate including a nickel-titanium alloy such as nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying an aluminum paste flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein along with leaching titanium from the base alloy member surface to form a nickel-rich interface surface. The activated flux also coats the nickel-rich interface layer for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the nickel-rich interface surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the nickel-rich interface surface, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.

8. 发明专利

DE69223343D1 未知
公开(公告)号：DE69223343D1
公开(公告)日：1998-01-15
申请号：DE69223343
申请日：1992-05-12
申请人： COOK INC
发明人： HALL TODD A
IPC分类号： B23K1/19 , B23K1/20 , B23K35/00 , B23K35/36 , B23K35/363 , B32B15/01 , C23F1/00
摘要： A joint and a laminate including a nickel-titanium alloy such as nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying an aluminum paste flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein along with leaching titanium from the base alloy member surface to form a nickel-rich interface surface. The activated flux also coats the nickel-rich interface layer for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the nickel-rich interface surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the nickel-rich interface surface, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.

9. 发明专利

AT160717T 未知
公开(公告)号：AT160717T
公开(公告)日：1997-12-15
申请号：AT92304286
申请日：1992-05-12
申请人： COOK INC
发明人： HALL TODD A
IPC分类号： B23K1/19 , B23K1/20 , B23K35/00 , B23K35/36 , B23K35/363 , B32B15/01 , C23F1/00
摘要： A joint and a laminate including a nickel-titanium alloy such as nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying an aluminum paste flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein along with leaching titanium from the base alloy member surface to form a nickel-rich interface surface. The activated flux also coats the nickel-rich interface layer for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the nickel-rich interface surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the nickel-rich interface surface, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetween.

10. 发明专利

AU2117395A An intravascular treatment system and percutaneous release mechanism therefor 未知
公开(公告)号：AU2117395A
公开(公告)日：1995-09-25
申请号：AU2117395
申请日：1995-03-08
申请人： COOK INC
发明人： HALL TODD A , PARKER FRED T
IPC分类号： A61B17/00 , A61B17/12 , A61F2/00 , A61F2/06 , A61F2/01
摘要： A percutaneous release mechanism (57) for use with an intravascular treatment device (11) in an intravascular treatment system (10). The release mechanism includes an inner member (17) having a connection mechanism (18) positioned about the distal end (14) thereof for interconnection with another connection mechanism (12) positioned on an intravascular treatment device. The release mechanism also includes an outer member tube (13) of which the inner member is positioned therein. The first and second connection mechanisms are interconnectable and positionable in the passage (16) of the tube for delivering the treatment device in a delivery state to the treatment site. The release mechanism also includes a handle (37) having parts (38, 39) connected to the inner member and outer tube, whereby movement of the proximal end of the inner member is translated to the distal end thereof for extending the interconnected connection mechanisms from the passage of the outer member tube and positioning the treatment device in a treatment state. The intravascular treatment system includes the percutaneous release mechanism along with the intravascular treatment device. The treatment device includes an occlusion coil (23) and a rigid tube (36) connected to the flexible outer member tube (35) for maintaining the delivery coil in a delivery state. In another example, the treatment device includes a blood clot filter (40) in which the percutaneous delivery mechanism is adapted for connection thereto.

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