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1. 发明申请

WO2004064132A8 METHOD OF PRODUCING A COMPLEX STRUCTURE BY ASSEMBLING STRESSED STRUCTURES 审中-公开
标题翻译：通过组装受压结构生产复杂结构的方法
公开(公告)号：WO2004064132A8
公开(公告)日：2004-09-16
申请号：PCT/FR0303590
申请日：2003-12-04
申请人： COMMISSARIAT ENERGIE ATOMIQUE , FOURNEL FRANCK , MORICEAU HUBERT , MONTMAYEUL PHILIPPE
发明人： FOURNEL FRANCK , MORICEAU HUBERT , MONTMAYEUL PHILIPPE
IPC分类号： H01L21/18 , H01L21/20 , H01L21/68 , H01L21/762 , H01L21/58
CPC分类号： H01L21/6835 , H01L21/187 , H01L21/2007 , H01L21/67092 , H01L21/76251 , H01L24/75 , H01L2221/68363 , H01L2924/01029 , H01L2924/10253 , H01L2924/3511 , Y10S148/012 , Y10S148/135 , Y10S148/159 , H01L2924/00
摘要： The invention relates to a method of producing a complex microelectronic structure, in which two basic microelectronic structures (1, 3) are assembled at the two respective connecting faces (3) thereof. The invention is characterised in that, before assembly, a difference is created in the tangential stress state between the two faces to be assembled, said difference being selected such as to produce a pre-determined stress state within the assembled structure under given conditions in relation to the assembly conditions.
摘要翻译：本发明涉及一种复合微电子结构的制造方法，其中两个基本微电子结构（1,3）组装在其两个相应连接面（3）处。本发明的特征在于，在组装之前，在要组装的两个面之间的切向应力状态产生差异，所述差异被选择为在给定的条件下在组装结构内产生预定的应力状态到装配条件。

2. 发明专利

FR2796491A1 未知
公开(公告)号：FR2796491A1
公开(公告)日：2001-01-19
申请号：FR9909007
申请日：1999-07-12
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： RAYSSAC OLIVIER , MORICEAU HUBERT , ASPAR BERNARD , MONTMAYEUL PHILIPPE
IPC分类号： H01L21/683 , H01L21/00 , H01L21/02 , H01L27/12 , H01L21/30 , H01L23/13
摘要： A process and device for separating two semi-conductor substrate wafers along an interface. The process includes forming a cavity, and initiating separation by applying force to the interface through the cavity. The device utilizes fluid or gas, and pressure chambers, to subject adherent faces of the interface to at least one of chemical or mechanical action.

3. 发明专利

FR2683395B1 未知
公开(公告)号：FR2683395B1
公开(公告)日：1995-04-28
申请号：FR9113686
申请日：1991-11-06
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： CLAUDE RICHARD , DAVIET JEAN-FRANCOIS , MONTMAYEUL PHILIPPE , PECCOUD LOUISE
IPC分类号： C23C16/458 , H01J37/32 , H01L21/683 , H01R13/24 , H01R3/00 , C23C4/00 , H01J37/20 , H01J37/248

4. 发明专利

DE602007005836D1 未知
公开(公告)号：DE602007005836D1
公开(公告)日：2010-05-20
申请号：DE602007005836
申请日：2007-10-04
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： MORICEAU HUBERT , SARTORI SYLVIE , MONTMAYEUL PHILIPPE , MORALES CHRISTOPHE
IPC分类号： B28D5/00 , H01L21/00

5. 发明专利

AT463331T 未知
公开(公告)号：AT463331T
公开(公告)日：2010-04-15
申请号：AT07820925
申请日：2007-10-04
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： MORICEAU HUBERT , SARTORI SYLVIE , MONTMAYEUL PHILIPPE , MORALES CHRISTOPHE
IPC分类号： B28D5/00 , H01L21/00

6. 发明专利

FR2848337A1 Pre-stressed substrate manufacturing method for use in microelectronics involves bonding sequence of layers to meet pre-determined constraints 未知
公开(公告)号：FR2848337A1
公开(公告)日：2004-06-11
申请号：FR0215552
申请日：2002-12-09
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： FOURNEL FRANCK , MORICEAU HUBERT , MONTMAYEUL PHILIPPE
IPC分类号： H01L21/18 , H01L21/20 , H01L21/68 , H01L21/762 , H01L21/304
摘要： The method for making pre-stressed substrate by bonding structures (1,3) once the creation of a difference in the state of tangential constraints between the two faces to be assembled is achieved. The difference is chosen so to obtain a predetermined state of stress within the assembled structure in given conditions with respect to assembling conditions, in particular to reduce a jump in stresses at higher temperatures. The difference in the state of tangential constraints is obtained by curving or bending the two elementary structures to assemble, so to make the faces concave and convex, complementary, in particular spherically concave and spherically convex. The curvature of the two structures is obtained by the application of mechanical forces, in particular by deforming the two structures (1,3) between two preforms (2,4) of profiles chosen as a function of the two faces to assemble. The application of mechanical forces results in the creation of a pressure difference between the two faces, where the pressure difference is obtained by suction on a concave preform (2) or inside a cavity with a peripheral joint. The preform (2) is with a suction channel (5) for maintaining the structure (1) curved even when the preform (4) is lifted. The preform is a mould, a porous mould, or a deformable membrane. The assembling of the two structures is by molecular bonding, and the faces to assemble are treated to facilitate the bonding. The assembling of the two structures is by molecular bonding, and the faces to assemble are treated to facilitate the bonding. The assembling of substrates is by direct contact, and the substrates are adjusted so to avoid air trapping between the surfaces. At least one substrate is with an opening, which is at its center. At least one substrate comprises a channel opening up at the substrate edge. The assembling is implemented by a layer of material which becomes fluid at a higher temperature. The assembling is carried out at a temperature higher than the ambient temperature, and the substrates are heated by contact with heated preforms, possibly at different temperatures. The method includes a technological step of changing the temperature, and the difference in the state of tangential constraints is chosen so that the stresses inside the assembled structure remain below a predetermined threshold. The method also includes, after assembling the two structures, a step of thinning one of the structures, and the thin film can be assembled with another elementary structure. The method includes a step of epitaxial growth to obtain an epitaxial film on the external face of the complex structure. The lattice parameter of the thin film is chosen compatible with the epitaxial growth of additional material.

7. 发明专利

DE69217187D1 未知
公开(公告)号：DE69217187D1
公开(公告)日：1997-03-13
申请号：DE69217187
申请日：1992-11-04
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： CLAUDE RICHARD , DAVIET JEAN-FRANCOIS , MONTMAYEUL PHILIPPE , PECCOUD LOUISE
IPC分类号： C23C16/458 , H01J37/32 , H01L21/683 , H01R13/24

8. 发明专利

FR2988474B1 SYSTEME DE MESURE DE LA PROPAGATION D'UNE ZONE D'ECARTEMENT DANS UN SUBSTRAT 未知
公开(公告)号：FR2988474B1
公开(公告)日：2015-02-06
申请号：FR1252507
申请日：2012-03-21
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： MAZEN FREDERIC , RIEUTORD FRANCOIS , MONTMAYEUL PHILIPPE , PENOT JEAN LUC
IPC分类号： G01N21/88 , G01B11/14

9. 发明专利

AU2003298413A1 METHOD OF PRODUCING A COMPLEX STRUCTURE BY ASSEMBLING STRESSED STRUCTURES 未知
公开(公告)号：AU2003298413A1
公开(公告)日：2004-08-10
申请号：AU2003298413
申请日：2003-12-04
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： MORICEAU HUBERT , MONTMAYEUL PHILIPPE , FOURNEL FRANCK
IPC分类号： H01L21/18 , H01L21/20 , H01L21/68 , H01L21/762 , H01L21/58
摘要： The method for making pre-stressed substrate by bonding structures (1,3) once the creation of a difference in the state of tangential constraints between the two faces to be assembled is achieved. The difference is chosen so to obtain a predetermined state of stress within the assembled structure in given conditions with respect to assembling conditions, in particular to reduce a jump in stresses at higher temperatures. The difference in the state of tangential constraints is obtained by curving or bending the two elementary structures to assemble, so to make the faces concave and convex, complementary, in particular spherically concave and spherically convex. The curvature of the two structures is obtained by the application of mechanical forces, in particular by deforming the two structures (1,3) between two preforms (2,4) of profiles chosen as a function of the two faces to assemble. The application of mechanical forces results in the creation of a pressure difference between the two faces, where the pressure difference is obtained by suction on a concave preform (2) or inside a cavity with a peripheral joint. The preform (2) is with a suction channel (5) for maintaining the structure (1) curved even when the preform (4) is lifted. The preform is a mould, a porous mould, or a deformable membrane. The assembling of the two structures is by molecular bonding, and the faces to assemble are treated to facilitate the bonding. The assembling of the two structures is by molecular bonding, and the faces to assemble are treated to facilitate the bonding. The assembling of substrates is by direct contact, and the substrates are adjusted so to avoid air trapping between the surfaces. At least one substrate is with an opening, which is at its center. At least one substrate comprises a channel opening up at the substrate edge. The assembling is implemented by a layer of material which becomes fluid at a higher temperature. The assembling is carried out at a temperature higher than the ambient temperature, and the substrates are heated by contact with heated preforms, possibly at different temperatures. The method includes a technological step of changing the temperature, and the difference in the state of tangential constraints is chosen so that the stresses inside the assembled structure remain below a predetermined threshold. The method also includes, after assembling the two structures, a step of thinning one of the structures, and the thin film can be assembled with another elementary structure. The method includes a step of epitaxial growth to obtain an epitaxial film on the external face of the complex structure. The lattice parameter of the thin film is chosen compatible with the epitaxial growth of additional material.

10. 发明专利

FR2832655A1 Device for extracting gas from a chamber, comprises a duct matching the chamber opening and connected to a suction system, for higher efficiency of extraction 未知
公开(公告)号：FR2832655A1
公开(公告)日：2003-05-30
申请号：FR0115263
申请日：2001-11-26
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： LYAN PHILIPPE , MONTMAYEUL PHILIPPE , FERRET PIERRE
IPC分类号： B08B15/00 , B08B15/02 , A62B29/00 , B08B5/04
摘要： The device for extracting a gas from a chamber (20), in particular in the production of semiconductor devices, having at least one opening (21) through which the gas can escape, comprises at least one duct (26) movable on a rail (29-1) of a guiding system (29) so to connect with the chamber opening. The duct (26) defines a central passage (25) and has a connecting part (33) which fits the chamber opening (21). The duct comprises openings (27) in the central passage which are connected by a flexible pipe (28) to a suction system so that when the duct is in the connect position the gas from the chamber entering the duct is removed by the suction system thus preventing the pollution of the premises with possibly toxic gas. The contour of the central passage (25) is substantially of the same dimensions as the chamber opening (21). The duct (26) is made of a metal, for example the stainless steel, or a plastic, for example PVC. The duct (26) has no openings in the vicinity of the connection with the evacuation pipe (28) to allow for a more uniform suction distribution. The connecting part (33) comprises a skirting (33-1) along the central passage and a sealing ring (33-2). The guiding system (29) comprises a rail (29-1) and a sliding part (29-2) so that the duct (26) can be moved by translation to and from the chamber (20). In other embodiments of the invention, the evacuation pipe is with a valve, the motion of the duct with respect to the chamber is of type rotation with the guiding system comprising a mechanism with a prop having the role of a rail, or a telescopic connection, the chamber is in the form of a protective cover of the apparatus with two openings cooperating with two ducts for the gas extraction, and the extraction duct is adjoined with a duct for input of a gas such as nitrogen to create a gaseous barrier between the extraction duct and the chamber opening.

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