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    • 3. 发明申请
    • METHOD TO IMPROVE TRANSMITTANCE OF AN ENCAPSULATING FILM
    • 改进封装膜传输的方法
    • WO2007040798A3
    • 2009-05-07
    • PCT/US2006030304
    • 2006-08-02
    • APPLIED MATERIALS INCWON TAE KYUNGYADAV SANJAY
    • WON TAE KYUNGYADAV SANJAY
    • H01L21/20
    • C23C16/26C23C8/36C23C16/345C23C28/00C23C28/046C23C28/42H01L51/5256
    • A method for depositing a carbon-containing material layer onto a substrate includes delivering a mixture of precursors for the carbon-containing material layer into a process chamber, doping the carbon-containing material layer with silicon, and depositing the carbon-containing material layer at low temperature. In one aspect, improved light transmittance of the carbon-containing material layer at all wavelengths of a visible light spectrum is obtained. In addition, a method for depositing an encapsulating layer is provided for various display applications which require low temperature deposition process due to thermal instability of underlying materials used. The encapsulating layer may include one or more barrier layer material layers and one or more amorphous carbon material layers. The amorphous carbon material can be used to reduce thermal stress and prevent the deposited thin film from peeling off the substrate.
    • 将含碳材料层沉积在基材上的方法包括将含碳材料层的前体的混合物输送到处理室中,用硅掺杂含碳材料层,并将含碳材料层沉积在 低温。 在一个方面,获得了在可见光谱的所有波长处的含碳材料层的改进的透光率。 此外,由于所使用的下层材料的热不稳定性,提供了用于沉积封装层的方法用于需要低温沉积工艺的各种显示应用。 封装层可以包括一个或多个阻挡层材料层和一个或多个无定形碳材料层。 无定形碳材料可用于降低热应力并防止沉积的薄膜从基底上剥离。
    • 5. 发明申请
    • IMPROVING WATER-BARRIER PERFORMANCE OF AN ENCAPSULATING FILM
    • 改善封隔膜的水障碍性能
    • WO2006007313A2
    • 2006-01-19
    • PCT/US2005020079
    • 2005-06-06
    • APPLIED MATERIALS INCWON TAE KYUNGYADAV SANJAY
    • WON TAE KYUNGYADAV SANJAY
    • C23C16/00
    • C23C16/345C23C8/36C23C28/00C23C28/04C23C28/42H01L51/5256
    • A method and apparatus for depositing a material layer onto a substrate at low temperature is described. The material layer can be used as an encapsulating layer for low temperature processes required in various display applications due to thermal instability of underlying materials. The encapsulating layer includes one or more material layers (multilayer) having one or more barrier layer materials and one or more low-dielectric constant materials to reduce surface roughness, improve water-barrier performance, reduce thermal stress, and provide good step coverage for many substrate types and many substrate sizes. Accordingly, the encapsulating layer thus deposited provides good device lifetime for various display devices, such as OLED devices. In addition, a method of depositing an amorphous carbon material on a substrate at low temperature is provided. The amorphous carbon material can be used to reduce thermal stress and prevent the deposited thin film from peeling off the substrate.
    • 描述了一种用于在低温下将材料层沉积到衬底上的方法和装置。 由于下层材料的热不稳定性,材料层可用作各种显示应用中所需的低温工艺的封装层。 封装层包括具有一个或多个阻挡层材料和一种或多种低介电常数材料的一种或多种材料层(多层),以降低表面粗糙度,改善防水性能,降低热应力,并为许多材料提供良好的阶梯覆盖 衬底类型和许多衬底尺寸。 因此,如此沉积的封装层为诸如OLED器件的各种显示器件提供了良好的器件寿命。 此外,提供了一种在低温下在基板上沉积无定形碳材料的方法。 无定形碳材料可用于降低热应力并防止沉积的薄膜从基底上剥离。