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1. 发明申请

US20110051793A1 SYSTEM AND METHOD FOR EVALUATING PERFORMANCE OF A MIMO ANTENNA SYSTEM 失效
标题翻译：用于评估MIMO天线系统性能的系统和方法
公开(公告)号：US20110051793A1
公开(公告)日：2011-03-03
申请号：US12633895
申请日：2009-12-09
申请人： PO-CHUAN HSIEH , CHUN-JEN CHEN , CHIEN-HUNG LIU , YU-CHANG PAI , SHOU-KUO HSU
发明人： PO-CHUAN HSIEH , CHUN-JEN CHEN , CHIEN-HUNG LIU , YU-CHANG PAI , SHOU-KUO HSU
IPC分类号： H04B17/00
CPC分类号： H04B17/0085 , H04B17/21 , H04B17/23 , H04B17/327 , H04L1/0668
摘要： A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system.
摘要翻译：用于多输入多输出（MIMO）天线系统的性能评估系统从输入设备接收模拟参数，并相应地模拟MIMO天线系统。还提供了一种方法，当通过MIMO天线系统传输一系列射频（RF）信号时，进一步评估模拟MIMO天线系统的性能，并且在用于评估的显示装置上显示MIMO天线系统的性能分析结果的模拟MIMO天线系统的性能。

2. 发明申请

US20090107716A1 PRINTED CIRCUIT BOARD 失效
标题翻译：印刷电路板
公开(公告)号：US20090107716A1
公开(公告)日：2009-04-30
申请号：US11967017
申请日：2007-12-29
申请人： YU-CHANG PAI , SHOU-KUO HSU , CHIEN-HUNG LIU
发明人： YU-CHANG PAI , SHOU-KUO HSU , CHIEN-HUNG LIU
IPC分类号： H05K1/11
CPC分类号： H05K1/0245 , H05K1/0228 , H05K1/0251 , H05K1/115 , H05K2201/09636 , H05K2201/097
摘要： A printed circuit board (PCB) includes a differential pair having a first differential trace and a second differential trace, a first via having an upper cap and a lower cap, and a second via having an upper cap and a lower cap. The first differential trace includes a first segment and a second segment, the second differential trace includes a third segment and a fourth segment. The first and the third segments are electrically coupled to the upper caps of the first and the second vias respectively. The second and the fourth segments are electrically coupled to the lower caps of the first and the second vias respectively. The first and the third segments extend from corresponding upper caps in different directions, the second and the fourth segments extend from corresponding lower caps in different directions.
摘要翻译：印刷电路板（PCB）包括具有第一差分迹线和第二差分迹线的差分对，具有上盖和下盖的第一通孔以及具有上盖和下盖的第二通孔。第一差分迹线包括第一段和第二段，第二差分迹线包括第三段和第四段。第一和第三段分别电耦合到第一和第二通孔的上盖。第二和第四段分别电耦合到第一和第二通孔的下盖。第一和第三段从相应的上盖在不同的方向上延伸，第二和第四段从相应的下盖在不同的方向延伸。

3. 发明申请

US20110266046A1 ENCLOSURE OF ELECTRONIC DEVICE 有权
标题翻译：电子设备外壳
公开(公告)号：US20110266046A1
公开(公告)日：2011-11-03
申请号：US12841125
申请日：2010-07-21
申请人： PO-CHUAN HSIEH , YU-CHANG PAI , CHIEN-HUNG LIU , SHOU-KUO HSU
发明人： PO-CHUAN HSIEH , YU-CHANG PAI , CHIEN-HUNG LIU , SHOU-KUO HSU
IPC分类号： H05K9/00
CPC分类号： H05K9/0041 , H05K9/0024
摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.
摘要翻译：电子设备的外壳包括板。该板限定了多个通孔。多个屏蔽件从对应于通孔的板延伸。每个护罩从板的外表面向外延伸，围绕并部分覆盖相应的通孔。带屏蔽的外壳可以屏蔽电子设备免受EMI影响。

4. 发明申请

US20090294168A1 PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板
公开(公告)号：US20090294168A1
公开(公告)日：2009-12-03
申请号：US12272797
申请日：2008-11-18
申请人： YU-CHANG PAI , SHOU-KUO HSU , CHIEN-HUNG LIU , YING-TSO LAI
发明人： YU-CHANG PAI , SHOU-KUO HSU , CHIEN-HUNG LIU , YING-TSO LAI
IPC分类号： H05K1/11
CPC分类号： H05K1/116 , H05K1/0245 , H05K1/0251 , H05K1/165 , H05K3/429 , H05K2201/09236 , H05K2201/09281 , H05K2201/09636
摘要： A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer has a third signal line and a fourth signal line, each of which also has a curved first portion. The curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line are coupled to the first via and the second via. In this case, the curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line cooperatively generate spiral inductance characteristic.
摘要翻译：印刷电路板包括第一布局层，第二布局层，铜箔层，第一通孔和第二通孔。第一布局层具有第一信号线和第二信号线，每条信号线都具有弯曲的第一部分。第二布局层具有第三信号线和第四信号线，每条信号线还具有弯曲的第一部分。第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分耦合到第一通孔和第二通孔。在这种情况下，第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分协同地产生螺旋电感特性。

5. 发明申请

US20090065241A1 PRINTED CIRCUIT BOARD 失效
标题翻译：印刷电路板
公开(公告)号：US20090065241A1
公开(公告)日：2009-03-12
申请号：US11957419
申请日：2007-12-15
申请人： CHIEN-HUNG LIU , SHOU-KUO HSU , YU-CHANG PAI
发明人： CHIEN-HUNG LIU , SHOU-KUO HSU , YU-CHANG PAI
IPC分类号： H05K1/02
CPC分类号： H05K1/0245 , H05K1/0219 , H05K2201/09336 , H05K2201/09672
摘要： A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces.
摘要翻译：印刷电路板（PCB）包括夹在其间的电介质层的第一和第二信号层，以及分别设置在第一和第二信号层内的差分对。两个接地部分分别布置在两个差分迹线中的每一个的相对侧。

6. 发明申请

US20120000700A1 PRINTED CIRCUIT BOARD 失效
标题翻译：印刷电路板
公开(公告)号：US20120000700A1
公开(公告)日：2012-01-05
申请号：US12837487
申请日：2010-07-15
申请人： CHIEN-HUNG LIU , PO-CHUAN HSIEH , YU-CHANG PAI , SHOU-KUO HSU
发明人： CHIEN-HUNG LIU , PO-CHUAN HSIEH , YU-CHANG PAI , SHOU-KUO HSU
IPC分类号： H05K1/11
CPC分类号： H05K1/162 , H05K1/0239 , H05K2201/0397 , H05K2201/10015 , H05K2201/1034
摘要： A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.
摘要翻译：印刷电路板包括第一信号层，第二信号层和夹在第一信号层和第二信号层之间的电介质层。第一信号层包括两个焊盘。第二信号层包括连接到两个信号迹线的两个导电片。垫的形状和材料与导电片的形状和材料相同。第二信号层上的焊盘的突起与导电片重叠。

7. 发明申请

US20100271149A1 HIGH-FREQUECY MODULE FOR WIRELESS COMMUNICATIONS 审中-公开
标题翻译：用于无线通信的高频模块
公开(公告)号：US20100271149A1
公开(公告)日：2010-10-28
申请号：US12471339
申请日：2009-05-22
申请人： PO-CHUAN HSIEH , SHOU-KUO HSU , YU-CHANG PAI , CHIEN-HUNG LIU
发明人： PO-CHUAN HSIEH , SHOU-KUO HSU , YU-CHANG PAI , CHIEN-HUNG LIU
IPC分类号： H03H7/38
CPC分类号： H04B1/0458 , H01P3/003
摘要： A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer.
摘要翻译：高频模块包括天线，阻抗匹配电路和传输线。传输线连接在天线和阻抗匹配电路之间。传输线包括电介质层，信号层和两个接地层。信号层和接地层位于电介质层上。接地层分别位于信号层的相对侧。在信号和每个接地层之间形成空间。

8. 发明申请

US20090260860A1 FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开
标题翻译：柔性印刷电路板
公开(公告)号：US20090260860A1
公开(公告)日：2009-10-22
申请号：US12211057
申请日：2008-09-15
申请人： YU-CHANG PAI , SHOU-KUO HSU , CHIEN-HUNG LIU
发明人： YU-CHANG PAI , SHOU-KUO HSU , CHIEN-HUNG LIU
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/0245 , H05K1/0224 , H05K1/0253 , H05K1/0393 , H05K2201/09236 , H05K2201/09336 , H05K2201/0969 , Y10T29/49156
摘要： An exemplary FPCB includes two or more dielectric layers. Each dielectric layer is located between a signal layer and a ground layer. A differential pair including two transmission lines is arranged in each signal layer. Each ground layer includes one or more voids defined therein. Each void is opposite and adjacent to a differential pair.
摘要翻译：示例性FPCB包括两个或更多个电介质层。每个电介质层位于信号层和接地层之间。在每个信号层中布置包括两条传输线的差分对。每个接地层包括其中限定的一个或多个空隙。每个空隙与差分对相反并相邻。

9. 发明申请

US20110266047A1 ENCLOSURE OF ELECTRONIC DEVICE 失效
标题翻译：电子设备外壳
公开(公告)号：US20110266047A1
公开(公告)日：2011-11-03
申请号：US12849939
申请日：2010-08-04
申请人： YU-CHANG PAI , CHIEN-HUNG LIU , PO-CHUAN HSIEH , SHOU-KUO HSU
发明人： YU-CHANG PAI , CHIEN-HUNG LIU , PO-CHUAN HSIEH , SHOU-KUO HSU
IPC分类号： H05K9/00
CPC分类号： H05K9/0024 , H05K9/0041
摘要： An enclosure includes a plate. The plate defines a number of through holes. A first shield extends from an edge bounding each through hole. A second shield extends from the edge bounding each through hole, opposite to the first shields. Each through hole is partially covered by a corresponding first shield and a corresponding second shield. The enclosure with the shields can shield the electronic device from electromagnetic interference.
摘要翻译：外壳包括一个板。该板限定了多个通孔。第一个屏蔽从每个通孔的边缘延伸。第二个屏蔽件从边界与每个通孔的边缘相延伸，与第一个屏蔽件相对。每个通孔被相应的第一屏蔽和对应的第二屏蔽部分地覆盖。带屏蔽的外壳可以屏蔽电子设备免受电磁干扰。

10. 发明申请

US20110094786A1 PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板
公开(公告)号：US20110094786A1
公开(公告)日：2011-04-28
申请号：US12646888
申请日：2009-12-23
申请人： CHIEN-HUNG LIU , SHOU-KUO HSU , YU-CHANG PAI , PO-CHUAN HSIEH
发明人： CHIEN-HUNG LIU , SHOU-KUO HSU , YU-CHANG PAI , PO-CHUAN HSIEH
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K1/0222 , H05K3/429 , H05K2201/09309 , H05K2201/09636
摘要： A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.
摘要翻译：印刷电路板包括多个信号层，多个接地层，第一传输线，第二传输线，第一通孔和第二通孔。第一个传输位于多个信号层之一上。第二传输线位于多个信号层的另一个上。第一和第二通孔穿过印刷电路板。第一通孔电耦合到第一和第二传输线，并且与接地层的数量隔离。第二通孔电耦合到多个接地层中的一个或多个，并与多个接地层中的另一个隔离，以增加电感，从而补偿开路短路的电容特性并提高信号完整性。

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