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1. 发明申请

US20080023221A1 VIA STRUCTURE OF PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板的结构
公开(公告)号：US20080023221A1
公开(公告)日：2008-01-31
申请号：US11565651
申请日：2006-12-01
申请人： SHOU-KUO HSU , YU-CHANG PAI , CHENG-HONG LIU
发明人： SHOU-KUO HSU , YU-CHANG PAI , CHENG-HONG LIU
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： H05K1/116 , H05K1/0245 , H05K1/0251 , H05K3/429 , H05K2201/09309 , H05K2201/09636 , H05K2201/09718
摘要： An exemplary printed circuit board includes at least a pair of differential vias defined therein, each of the differential vias has an annular ring formed on the PCB, a conductive hole defined in the PCB, and a clearance hole defined in at least one inner layer of the PCB. Each of the clearance holes of the differential vias is oval shaped thus providing a greater area for the clearance holes and needed clearance between vias without creating a superposition zone.
摘要翻译：示例性印刷电路板包括限定在其中的至少一对差分通孔，每个差分通孔具有形成在PCB上的环形圈，限定在PCB中的导电孔，以及限定在至少一个内层中的间隙孔 PCB。差动通孔的每个间隙孔都是椭圆形的，从而为间隙孔提供了更大的面积，并且在通道之间需要间隙而不产生叠加区域。

2. 发明申请

US20070090512A1 SIGNAL TRANSMISSION LINE 有权
标题翻译：信号传输线
公开(公告)号：US20070090512A1
公开(公告)日：2007-04-26
申请号：US11309279
申请日：2006-07-21
申请人： CHENG-HONG LIU , SHOU-KUO HSU , YU-CHANG PAI
发明人： CHENG-HONG LIU , SHOU-KUO HSU , YU-CHANG PAI
IPC分类号： H01L23/053
CPC分类号： H05K1/0248 , H05K1/0268 , H05K2201/09236 , H05K2201/09263
摘要： A signal transmission line used in a printed circuit board (PCB), the signal transmission line comprises a driving terminal for driving a signal, a contact portion, the signal line connected with the driving terminal and the contact portion to transmit the signal wherein a length of the signal line is so arranged that a time for the signal transmitted from the driving terminal to the contact portion is not less than half of a time for the transmitted signal to reach a receiving terminal.
摘要翻译：在印刷电路板（PCB）中使用的信号传输线，信号传输线包括用于驱动信号的驱动端子，接触部分，与驱动端子连接的信号线和接触部分，以传输信号，其中长度信号线的布置使得从驱动端子到接触部分发送的信号的时间不小于发送信号到达接收端子的时间的一半。

3. 发明申请

US20080002337A1 PRINTED CIRCUIT BOARD ABLE TO SUPPRESS SIMULTANEOUS SWITCHING NOISE 有权
标题翻译：印刷电路板可同时抑制同时开关噪音
公开(公告)号：US20080002337A1
公开(公告)日：2008-01-03
申请号：US11563158
申请日：2006-11-25
申请人： SHOU-KUO HSU , CHENG-HONG LIU
发明人： SHOU-KUO HSU , CHENG-HONG LIU
IPC分类号： H02B1/00
CPC分类号： H05K1/0216 , H05K2201/093 , H05K2201/09309 , H05K2201/09345 , H05K2201/09663
摘要： A printed circuit board includes a first layer including a first power portion and a first ground portion isolated from each other, and a second layer including a second power portion and a second ground portion isolated from each other. The second layer is spaced from the first layer. The second ground portion is arranged below the first power portion. The second power portion is arranged below the first ground portion. One portion of the first power portion overlaps one portion of the second power portion, and one portion of the first ground portion overlaps one portion of the second ground portion to provide a zero-intensity electric field between the first layer and the second layer. The first power portion is coupled to the second power portion via a first via. The first ground portion is coupled to the second ground portion via a second via.
摘要翻译：印刷电路板包括第一层，第一层包括彼此隔离的第一电力部分和第一接地部分，以及包括彼此隔离的第二电力部分和第二接地部分的第二层。第二层与第一层间隔开。第二接地部分布置在第一电力部分的下方。第二动力部分布置在第一接地部分的下方。第一功率部分的一部分与第二功率部分的一部分重叠，并且第一接地部分的一部分与第二接地部分的一部分重叠，以在第一层和第二层之间提供零强度电场。第一功率部分经由第一通孔耦合到第二功率部分。第一接地部分经由第二通孔耦合到第二接地部分。

4. 发明申请

US20070018751A1 METHOD FOR IMPEDANCE MATCHING BETWEEN DIFFERENTIAL VIAS AND TRANSMISSION LINES 失效
标题翻译：差分线与传输线之间的阻抗匹配方法
公开(公告)号：US20070018751A1
公开(公告)日：2007-01-25
申请号：US11308690
申请日：2006-04-22
申请人： SHOU-KUO HSU , CHENG-HONG LIU
发明人： SHOU-KUO HSU , CHENG-HONG LIU
IPC分类号： H03H7/38
CPC分类号： H01P5/02 , H01L2924/0002 , H01L2924/00
摘要： A method for impedance matching between differential vias and associated transmission lines is provided. The method includes: deducing a relationship of a space between the differential vias, and a radius of the differential vias while a characteristic impedance of the differential vias matches a characteristic impedance of the differential transmission lines; and determining the space and the radius according to the relationship between the space and the radius.
摘要翻译：提供了差分通孔和相关传输线之间的阻抗匹配方法。该方法包括：当差分通孔的特性阻抗与差动传输线的特征阻抗匹配时，推断出差分通孔之间的空间与差动通路的半径之间的关系; 并根据空间和半径之间的关系确定空间和半径。

5. 发明申请

US20070222537A1 PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板
公开(公告)号：US20070222537A1
公开(公告)日：2007-09-27
申请号：US11309638
申请日：2006-09-01
申请人： SHOU-KUO HSU , CHENG-HONG LIU
发明人： SHOU-KUO HSU , CHENG-HONG LIU
IPC分类号： H03H7/38
CPC分类号： H05K1/0219 , H05K1/0237 , H05K2201/09236 , H05K2201/09618
摘要： A printed circuit board (PCB) includes at least one signal layer, a ground layer, at least two signal lines, and at least one grounded line. The signal lines are arranged on the signal layer for transmitting signals. The grounded line is arranged on the signal layer and between the signal lines. A plurality of vias are defined in the grounded line, and the vias are connected to the ground layer. A distance between each two adjacent vias is so arranged that a resonant frequency of an electromagnetic wave transmitted on the grounded line must greater than a highest frequency of the signals transmitted on the signal lines. A related method for designing the PCB is also provided.
摘要翻译：印刷电路板（PCB）包括至少一个信号层，接地层，至少两条信号线和至少一条接地线。信号线布置在用于发送信号的信号层上。接地线设置在信号层和信号线之间。在接地线中限定多个通孔，并且通孔连接到接地层。每两个相邻通孔之间的距离被布置成使得在接地线上传输的电磁波的谐振频率必须大于在信号线上传输的信号的最高频率。还提供了一种用于设计PCB的相关方法。

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