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1. 发明申请

US20230121567A1 LIQUID EJECTION HEAD AND PRODUCTION METHOD FOR PRODUCING SAME 有权
公开(公告)号：US20230121567A1
公开(公告)日：2023-04-20
申请号：US17961839
申请日：2022-10-07
申请人： CANON KABUSHIKI KAISHA
发明人： Mitsuru Chida , Junichiro Iri
IPC分类号： B41J2/14 , B41J2/16
摘要： A liquid ejection head of the present invention has: an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the ejection port, and a plurality of wiring pads lined up in a predetermined direction; a flexible wiring substrate having a plurality of leads lined up in the predetermined direction and overlaid on and connected to the plurality of wiring pads respectively, and a base film overlaid on the plurality of leads; and a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads. The base film has a plurality of covering portions that respectively cover an opposite side of the plurality of leads from the plurality of connection portions, and an opening or slit formed between the plurality of covering portions.

2. 发明申请

US20140035997A1 LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：液体喷射头及其制造方法
公开(公告)号：US20140035997A1
公开(公告)日：2014-02-06
申请号：US13951730
申请日：2013-07-26
申请人： Canon Kabushiki Kaisha
发明人： Yosuke Takagi , Yuichiro Akama , Kenji Fujii , Mitsuru Chida
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/14 , B41J2/1404 , B41J2/1637 , B41J2002/14403 , Y10T29/49401
摘要： Provided is a liquid ejection head, including: a substrate including: a supply port that is a through hole for supplying liquid; an energy generating element for generating energy to be used for ejecting the liquid; a first film that covers the energy generating element; and a second film formed on the first film; and a flow path forming member bonded to the substrate, for forming a flow path for supplying the liquid supplied from the supply port to an ejection orifice, in which when viewed from a direction perpendicular to the substrate, an end portion of the first film extends inwardly from an opening edge of the supply port, and an end portion of the second film is located between the opening edge of the supply port and the end portion of the first film.
摘要翻译：提供一种液体喷射头，包括：基板，包括：供给口，其是用于供应液体的通孔; 用于产生用于喷射液体的能量的能量产生元件; 覆盖能量产生元件的第一膜; 和形成在第一膜上的第二膜; 以及流路形成部件，其结合到所述基板，用于形成用于将从所述供给口供给的液体供给到喷射口的流路，其中，当从所述基板垂直的方向观察时，所述第一膜的端部延伸从供给口的开口边缘向内侧，第二膜的端部位于供给口的开口边缘与第一膜的端部之间。

3. 发明申请

US20140313261A1 LIQUID EJECTION HEAD 有权
标题翻译：液体喷射头
公开(公告)号：US20140313261A1
公开(公告)日：2014-10-23
申请号：US14228581
申请日：2014-03-28
申请人： CANON KABUSHIKI KAISHA
发明人： Masataka NAGAI , Yoshinori Tagawa , Jun Yamamuro , Kenji Fujii , Mitsuru Chida , Makoto Watanabe , Toshiaki Kurosu , Takanobu Manabe
IPC分类号： B41J2/145
CPC分类号： B41J2/145 , B41J2/1404 , B41J2/14145 , B41J2/1433
摘要： A liquid ejection head includes: a substrate which has an energy-generating element that generates energy to be utilized for ejecting a liquid, and a supply orifice for supplying the liquid to the energy-generating element; and an ejection orifice forming member that has a plurality of ejection orifices through which the liquid is ejected, and at least one beam-like projection which projects toward the substrate and extends along an array direction of the ejection orifices at a position corresponding to the supply orifice; wherein a sectional area perpendicular to the array direction of the ejection orifices in the central part of the beam-like projection in the array direction of the ejection orifices is larger than a sectional area in the direction perpendicular to the array direction of the ejection orifices in both ends of the beam-like projection in the array direction.
摘要翻译：液体喷射头包括：具有产生用于喷射液体的能量的能量产生元件的基板和用于将液体供应到能量产生元件的供应孔; 以及喷射口形成部件，具有多个喷射口，液体被喷射出来;以及至少一个梁状突起，该突起朝向基板突出，并且在对应于供给部的位置沿喷射孔的排列方向延伸孔; 其特征在于，与所述喷射孔的排列方向的所述束状突起的中央部的喷射孔的排列方向垂直的截面积大于与所述喷射孔的排列方向垂直的方向的截面积梁状突起的两端在阵列方向。

4. 发明授权

US09039143B2 Ink jet recording head and method for manufacturing the same 有权
标题翻译：喷墨记录头及其制造方法
公开(公告)号：US09039143B2
公开(公告)日：2015-05-26
申请号：US14231502
申请日：2014-03-31
申请人： CANON KABUSHIKI KAISHA
发明人： Mitsuru Chida , Kenji Fujii , Makoto Watanabe , Toshiaki Kurosu , Masataka Nagai , Takanobu Manabe
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1643 , B41J2/1645 , B41J2/1646 , B41J2002/14387 , Y10T29/49162
摘要： An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.
摘要翻译：一种喷墨记录头，包括具有多个排出能量产生元件并具有供墨口的基板，设置在该基板上并构造成保护与排出能量产生元件连接的布线的保护膜，以及一个喷墨口形成件其特征在于，所述保护膜具有突出部，所述喷墨口形成部件具有梁状突起，所述梁状突起具有加强肋，在所述突出部的部分形成有含金的分离膜，部分和加强筋彼此紧密接触。

5. 发明授权

US08991975B2 Liquid ejection head having structural modifications to film layers and method of manufacturing the same 有权
标题翻译：具有对膜层的结构修改的液体喷射头及其制造方法
公开(公告)号：US08991975B2
公开(公告)日：2015-03-31
申请号：US13951730
申请日：2013-07-26
申请人： Canon Kabushiki Kaisha
发明人： Yosuke Takagi , Yuichiro Akama , Kenji Fujii , Mitsuru Chida
IPC分类号： B41J2/135 , B41J2/14 , B41J2/16
CPC分类号： B41J2/14 , B41J2/1404 , B41J2/1637 , B41J2002/14403 , Y10T29/49401
摘要： A liquid ejection head includes a substrate having a supply port that is a through-hole for supplying liquid; an energy generating element for generating energy to be used for ejecting the liquid; a first film that covers the energy generating element; a second film formed on the first film; and a flow path forming member bonded to the substrate, for forming a flow path for supplying the liquid supplied from the supply port to an ejection orifice. When viewed from a direction perpendicular to the substrate, an end portion of the first film extends inwardly from an opening edge of the supply port, and an end portion of the second film is located between the opening edge of the supply port and the end portion of the first film.
摘要翻译：液体喷射头包括具有作为供给液体的通孔的供给口的基板，用于产生用于喷射液体的能量的能量产生元件; 覆盖能量产生元件的第一膜; 形成在第一胶片上的第二胶片; 以及流路形成部件，其结合到所述基板，用于形成用于将从所述供给口供给的液体供给到喷射口的流路。当从垂直于基板的方向观察时，第一膜的端部从供给口的开口边缘向内延伸，并且第二膜的端部位于供给口的开口边缘和端部之间的第一部电影。

6. 发明申请

US20190263124A1 LIQUID EJECTION HEAD SUBSTRATE AND METHOD FOR PRODUCING LIQUID EJECTION HEAD SUBSTRATE 审中-公开
公开(公告)号：US20190263124A1
公开(公告)日：2019-08-29
申请号：US16280493
申请日：2019-02-20
申请人： CANON KABUSHIKI KAISHA
发明人： Kenji Takahashi , Mitsuru Chida , Mitsunori Toshishige , Shiro Sujaku , Kenji Kumamaru , Noriyasu Ozaki , Makoto Terui , Seiko Minami
IPC分类号： B41J2/16
摘要： A liquid ejection head substrate that includes a nozzle plate provided with an ejection orifice adapted to eject liquid droplets, in which a projection/depression pattern is provided on a liquid droplet ejection surface of the nozzle plate, the projection/depression pattern being made up of a plurality of projections and depressions, the projections being separated by depressions 1 μm or less in depth and disposed at predetermined spacing 10 μm or less in length; and the projection/depression pattern includes a part having water repellency due to lotus effect.

7. 发明申请

US20140292937A1 INK JET RECORDING HEAD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：喷墨记录头及其制造方法
公开(公告)号：US20140292937A1
公开(公告)日：2014-10-02
申请号：US14231502
申请日：2014-03-31
申请人： Canon Kabushiki Kaisha
发明人： Mitsuru Chida , Kenji Fujii , Makoto Watanabe , Toshiaki Kurosu , Masataka Nagai , Takanobu Manabe
IPC分类号： B41J2/04 , B41J2/16
CPC分类号： B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1643 , B41J2/1645 , B41J2/1646 , B41J2002/14387 , Y10T29/49162
摘要： An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.
摘要翻译：一种喷墨记录头，包括具有多个排出能量产生元件并具有供墨口的基板，设置在该基板上并构造成保护与排出能量产生元件连接的布线的保护膜，以及一个喷墨口形成件其特征在于，所述保护膜具有突出部，所述喷墨口形成部件具有梁状突起，所述梁状突起具有加强肋，在所述突出部的部分形成有含金的分离膜，部分和加强筋彼此紧密接触。

8. 发明申请

US20140212998A1 PROCESS FOR PRODUCING A SEMICONDUCTOR CHIP 有权
标题翻译：制造半导体芯片的工艺
公开(公告)号：US20140212998A1
公开(公告)日：2014-07-31
申请号：US14152272
申请日：2014-01-10
申请人： Canon Kabushiki Kaisha
发明人： Kenji Fujii , Mitsuru Chida , Makoto Watanabe , Toshiaki Kurosu , Masataka Nagai , Takanobu Manabe
IPC分类号： B41J2/16
CPC分类号： B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1643 , B41J2/1645
摘要： A process for producing a semiconductor chip having a substrate and a bump formed on the substrate including (1) forming, on a substrate, a conductor gold for plating to be a base of plating growth; (2) forming a mask for plating on the conductor gold for plating; (3) performing plating using the mask for plating to form the bump and a dummy pattern; (4) removing the mask for plating; (5) etching the conductor gold for plating; and (6) applying a shock to at least the dummy pattern. The amount of side etching of the conductor gold for plating is grasped from a state of separation of the dummy pattern due to the shock in the step (6).
摘要翻译：一种制造半导体芯片的方法，该半导体芯片具有在该基板上形成的基板和凸点，该方法包括：（1）在基板上形成作为电镀生长基底的电镀导体金; （2）在导体金上形成用于电镀的掩模; （3）使用电镀掩模进行电镀以形成凸块和虚设图案; （4）去除电镀掩模; （5）蚀刻导体金进行电镀; 和（6）至少对虚拟图案施加冲击。由于在步骤（6）中由于冲击而从虚拟图案的分离状态中掌握用于电镀的导体金的侧蚀刻量。

9. 发明授权

US09266330B2 Process for producing a semiconductor chip 有权
标题翻译：半导体芯片的制造方法
公开(公告)号：US09266330B2
公开(公告)日：2016-02-23
申请号：US14152272
申请日：2014-01-10
申请人： CANON KABUSHIKI KAISHA
发明人： Kenji Fujii , Mitsuru Chida , Makoto Watanabe , Toshiaki Kurosu , Masataka Nagai , Takanobu Manabe
IPC分类号： H01L21/44 , B41J2/16
CPC分类号： B41J2/1603 , B41J2/1626 , B41J2/1631 , B41J2/1643 , B41J2/1645
摘要： A process for producing a semiconductor chip having a substrate and a bump formed on the substrate including (1) forming, on a substrate, a conductor gold for plating to be a base of plating growth; (2) forming a mask for plating on the conductor gold for plating; (3) performing plating using the mask for plating to form the bump and a dummy pattern; (4) removing the mask for plating; (5) etching the conductor gold for plating; and (6) applying a shock to at least the dummy pattern. The amount of side etching of the conductor gold for plating is grasped from a state of separation of the dummy pattern due to the shock in the step (6).
摘要翻译：一种制造半导体芯片的方法，该半导体芯片具有在该基板上形成的基板和凸点，该方法包括：（1）在基板上形成作为电镀生长基底的电镀导体金; （2）在导体金上形成用于电镀的掩模; （3）使用电镀掩模进行电镀以形成凸块和虚设图案; （4）去除电镀掩模; （5）蚀刻导体金进行电镀; 和（6）至少对虚拟图案施加冲击。由于在步骤（6）中由于冲击而从虚拟图案的分离状态中掌握用于电镀的导体金的侧蚀刻量。

10. 发明申请

US20150325460A1 ETCHING CHAMBER AND METHOD OF MANUFACTURING SUBSTRATE 审中-公开
标题翻译：蚀刻室和制造基板的方法
公开(公告)号：US20150325460A1
公开(公告)日：2015-11-12
申请号：US14706836
申请日：2015-05-07
申请人： CANON KABUSHIKI KAISHA
发明人： Kenta Furusawa , Shuji Koyama , Mitsuru Chida , Ryotaro Murakami
IPC分类号： H01L21/67 , H01L21/683 , H01L21/306
CPC分类号： H01L21/306 , H01L21/30604 , H01L21/67075 , H01L21/67126 , H01L21/6719 , H01L21/6838
摘要： An etching chamber includes a chamber body including a flow channel and an opening mounted the substrate to be etched and the opening communicating with the flow channel and a sealing member provided in the periphery of the opening and configured to close a gap between the substrate and the chamber body when the substrate is mounted in the opening, wherein the sealing member includes a first groove provided on an upper surface of the sealing member which comes into abutment with the substrate when the substrate is mounted in the opening, a second groove provided on a sealing member bottom surface on a side opposite from the upper surface of the sealing member, and at least one communicating hole communicating with the first groove and the second groove.
摘要翻译：蚀刻室包括：腔主体，其包括流动通道和安装待蚀刻的基板的开口以及与流动通道连通的开口;以及密封构件，其设置在开口的周边，并且构造成封闭基板与当所述基板安装在所述开口中时，所述密封构件包括设置在所述密封构件的上表面上的第一槽，当所述基板安装在所述开口中时，所述第一凹槽与所述基板邻接，密封构件底表面与密封构件的上表面相对的一侧，以及与第一凹槽和第二凹槽连通的至少一个连通孔。

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