专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20190255849A1 LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20190255849A1
公开(公告)日：2019-08-22
申请号：US16268950
申请日：2019-02-06
申请人： CANON KABUSHIKI KAISHA
发明人： Kousuke Kubo , Koichi Omata
IPC分类号： B41J2/14
摘要： The liquid ejection head includes a plurality of element substrates including first and second element substrates and an electrical wiring substrate. The first and second element substrates each has a heating element array in which a plurality of heating elements producing heat energy for liquid ejection is arrayed, an electrically conductive protection layer covering the plurality of heating elements, an insulating layer arranged between the plurality of heating elements and the electrically conductive protection layer, and a connecting terminal for connecting to the outside. The electrical wiring substrate is electrically connected with the first and second element substrates via the connecting terminal. On the first and second element substrates, the connecting terminal includes a connecting terminal for the electrically conductive protection layer, and the electrically conductive protection layer is electrically connected to a common wiring provided on the electrical wiring substrate via the connecting terminal.

2. 发明授权

US09950525B2 Element substrate for liquid ejecting head and wafer 有权
公开(公告)号：US09950525B2
公开(公告)日：2018-04-24
申请号：US15287379
申请日：2016-10-06
申请人： CANON KABUSHIKI KAISHA
发明人： Ryoji Oohashi , Koichi Omata , Hideo Tamura , Takaaki Yamaguchi , Kousuke Kubo , Suguru Taniguchi , Yuji Tamaru , Toshio Negishi , Yohei Osuki
IPC分类号： B41J2/14
CPC分类号： B41J2/1433 , B41J2/14072 , B41J2/14088 , B41J2/14129 , B41J2/14201 , B41J2/1603 , B41J2/1631 , B41J2/1635 , B41J2/1642 , B41J2/1646 , B41J2002/14217
摘要： An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.

3. 发明申请

US20180104954A1 PRINT ELEMENT SUBSTRATE, PRINTHEAD, AND PRINTING APPARATUS 审中-公开
公开(公告)号：US20180104954A1
公开(公告)日：2018-04-19
申请号：US15692105
申请日：2017-08-31
申请人： CANON KABUSHIKI KAISHA
发明人： Yohei Osuki , Koichi Omata , Hideo Tamura , Takaaki Yamaguchi , Kousuke Kubo , Ryoji Oohashi , Yuji Tamaru , Toshio Negishi , Suguru Taniguchi
IPC分类号： B41J2/14
CPC分类号： B41J2/14072 , B41J2/14088 , B41J2/14129 , B41J2202/13
摘要： A print element substrate, comprises: a heater layer; a wiring layer that is connected to the heater layer and is for causing the heater layer to generate heat; an insulating layer arranged on the wiring layer; an anti-cavitation layer arranged on the insulating layer that is for protecting the insulating layer; and a switch that has a control terminal that is pulled-down to a ground, and causes the anti-cavitation layer and the ground to have an electrical connection when the control terminal is in a high-level state.

4. 发明申请

US20170100930A1 ELEMENT SUBSTRATE FOR LIQUID EJECTING HEAD AND WAFER 有权
公开(公告)号：US20170100930A1
公开(公告)日：2017-04-13
申请号：US15287379
申请日：2016-10-06
申请人： CANON KABUSHIKI KAISHA
发明人： Ryoji Oohashi , Koichi Omata , Hideo Tamura , Takaaki Yamaguchi , Kousuke Kubo , Suguru Taniguchi , Yuji Tamaru , Toshio Negishi , Yohei Osuki
IPC分类号： B41J2/14
CPC分类号： B41J2/1433 , B41J2/14072 , B41J2/14088 , B41J2/14129 , B41J2/14201 , B41J2/1603 , B41J2/1631 , B41J2/1635 , B41J2/1642 , B41J2/1646 , B41J2002/14217
摘要： An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.

5. 发明申请

US20230095423A1 LIQUID EJECTION HEAD SUBSTRATE, LIQUID EJECTION HEAD, AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD SUBSTRATE 有权
公开(公告)号：US20230095423A1
公开(公告)日：2023-03-30
申请号：US17892419
申请日：2022-08-22
申请人： CANON KABUSHIKI KAISHA
发明人： Takeru Yasuda , Koichi Omata , Yuzuru Ishida
IPC分类号： B41J2/14 , B41J2/16
摘要： A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.

6. 发明授权

US10889112B2 Liquid ejection head and manufacturing method thereof 有权
公开(公告)号：US10889112B2
公开(公告)日：2021-01-12
申请号：US16268950
申请日：2019-02-06
申请人： CANON KABUSHIKI KAISHA
发明人： Kousuke Kubo , Koichi Omata
IPC分类号： B41J2/14
摘要： The liquid ejection head includes a plurality of element substrates including first and second element substrates and an electrical wiring substrate. The first and second element substrates each has a heating element array in which a plurality of heating elements producing heat energy for liquid ejection is arrayed, an electrically conductive protection layer covering the plurality of heating elements, an insulating layer arranged between the plurality of heating elements and the electrically conductive protection layer, and a connecting terminal for connecting to the outside. The electrical wiring substrate is electrically connected with the first and second element substrates via the connecting terminal. On the first and second element substrates, the connecting terminal includes a connecting terminal for the electrically conductive protection layer, and the electrically conductive protection layer is electrically connected to a common wiring provided on the electrical wiring substrate via the connecting terminal.

7. 发明授权

US10500851B2 Print element substrate, printhead, and printing apparatus 有权
公开(公告)号：US10500851B2
公开(公告)日：2019-12-10
申请号：US15692105
申请日：2017-08-31
申请人： CANON KABUSHIKI KAISHA
发明人： Yohei Osuki , Koichi Omata , Hideo Tamura , Takaaki Yamaguchi , Kousuke Kubo , Ryoji Oohashi , Yuji Tamaru , Toshio Negishi , Suguru Taniguchi
IPC分类号： B41J2/14
CPC分类号： B41J2/14072 , B41J2/14088
摘要： A print element substrate, comprises: a heater layer; a wiring layer that is connected to the heater layer and is for causing the heater layer to generate heat; an insulating layer arranged on the wiring layer; an anti-cavitation layer arranged on the insulating layer that is for protecting the insulating layer; and a switch that has a control terminal that is pulled-down to a ground, and causes the anti-cavitation layer and the ground to have an electrical connection when the control terminal is in a high-level state.

8. 发明申请

US20170173953A1 RECORDING-ELEMENT SUBSTRATE, RECORDING HEAD, AND RECORDING APPARATUS 有权
公开(公告)号：US20170173953A1
公开(公告)日：2017-06-22
申请号：US15382079
申请日：2016-12-16
申请人： CANON KABUSHIKI KAISHA
发明人： Suguru Taniguchi , Koichi Omata , Hideo Tamura , Takaaki Yamaguchi , Kousuke Kubo , Ryoji Oohashi , Yuji Tamaru , Toshio Negishi , Yohei Osuki
IPC分类号： B41J2/14
CPC分类号： B41J2/14145 , B41J2/1404 , B41J2/14072 , B41J2/14112 , B41J2/14129
摘要： A recording-element substrate includes a substrate including a base member, a pair of electrodes, a heating element formed of a thermal resistor layer between the electrodes, a surface on which an electroconductive film coating the heating element has been formed, and an insulating film between the heating element and the electroconductive film and a flow-path-forming member including walls forming a liquid flow path toward the heating element while being disposed on the substrate's surface side. The substrate includes an electric connecting portion in contact with the electroconductive film to connect the electroconductive film with the base member. The shortest distance between the electric connecting portion and a portion where an angle formed by the walls is 120 degrees or smaller when viewed from a direction orthogonal to the surface is smaller than that between a boundary between the electrodes and the heating element and the portion.

9. 发明授权

US10889113B2 Recording element board, liquid ejection apparatus and method of manufacturing recording element board 有权
公开(公告)号：US10889113B2
公开(公告)日：2021-01-12
申请号：US16505512
申请日：2019-07-08
申请人： CANON KABUSHIKI KAISHA
发明人： Ryoji Oohashi , Tsubasa Funabashi , Koichi Omata , Hideo Tamura , Kousuke Kubo , Yohei Osuki
IPC分类号： B41J2/16 , B41J2/14
摘要： A recording element board has a plurality of heat-generating resistor elements arranged in a row and each of the plurality of heat-generating resistor elements comprises a heat-generating resistor layer and first and second pairs of electrodes connected to the heat-generating resistor layer. The first and second pairs of electrodes contact the heat-generating resistor layer at the opposite surfaces thereof to each other. The first pair of electrodes is formed as vias, while each surface of the second pair of electrodes is inclined so as to gradually reduce the thickness thereof toward the end thereof.

10. 发明申请

US20200016896A1 RECORDING ELEMENT BOARD, LIQUID EJECTION APPARATUS AND METHOD OF MANUFACTURING RECORDING ELEMENT BOARD 审中-公开
公开(公告)号：US20200016896A1
公开(公告)日：2020-01-16
申请号：US16505512
申请日：2019-07-08
申请人： CANON KABUSHIKI KAISHA
发明人： Ryoji Oohashi , Tsubasa Funabashi , Koichi Omata , Hideo Tamura , Kousuke Kubo , Yohei Osuki
IPC分类号： B41J2/14 , B41J2/16
摘要： A recording element board has a plurality of heat-generating resistor elements arranged in a row and each of the plurality of heat-generating resistor elements comprises a heat-generating resistor layer and first and second pairs of electrodes connected to the heat-generating resistor layer. The first and second pairs of electrodes contact the heat-generating resistor layer at the opposite surfaces thereof to each other. The first pair of electrodes is formed as vias, while each surface of the second pair of electrodes is inclined so as to gradually reduce the thickness thereof toward the end thereof.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式