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1. 发明授权

US07918015B2 Method for making a thin film resistor 有权
标题翻译：制造薄膜电阻的方法
公开(公告)号：US07918015B2
公开(公告)日：2011-04-05
申请号：US12336767
申请日：2008-12-17
申请人： Byron V. Bell , Robert W. Cornell , Yimin Guan , George K. Parish
发明人： Byron V. Bell , Robert W. Cornell , Yimin Guan , George K. Parish
IPC分类号： H01C17/00
CPC分类号： B41J2/14129 , B41J2202/03 , Y10T29/49082 , Y10T29/49098 , Y10T29/49099 , Y10T29/49163 , Y10T29/49346 , Y10T29/49401
摘要： A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.
摘要翻译：一种用于制造微流体喷射装置的流体喷射头的方法。在一个实施例中，该方法包括在衬底上沉积薄膜电阻层以提供多个薄膜加热器。薄膜电阻层包括主要由AlN，TaN和TaAl合金组成的钽 - 氮化铝材料，并且含有约30至约70原子％的钽，约10至约40原子％的铝和约5至约约30原子％的氮。

2. 发明申请

US20090094834A1 Micro-fluid Ejection Device Having High Resistance Heater Film 有权
标题翻译：具有高电阻加热膜的微流体喷射装置
公开(公告)号：US20090094834A1
公开(公告)日：2009-04-16
申请号：US12336767
申请日：2008-12-17
申请人： Byron V. Bell , Robert W. Cornell , Yimin Guan , George K. Parish
发明人： Byron V. Bell , Robert W. Cornell , Yimin Guan , George K. Parish
IPC分类号： B21D53/76 , H01C17/12
CPC分类号： B41J2/14129 , B41J2202/03 , Y10T29/49082 , Y10T29/49098 , Y10T29/49099 , Y10T29/49163 , Y10T29/49346 , Y10T29/49401
摘要： A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.
摘要翻译：一种用于制造微流体喷射装置的流体喷射头的方法。在一个实施例中，该方法包括在衬底上沉积薄膜电阻层以提供多个薄膜加热器。薄膜电阻层包括主要由AlN，TaN和TaAl合金组成的钽 - 氮化铝材料，并且含有约30至约70原子％的钽，约10至约40原子％的铝和约5至约约30原子％的氮。

3. 发明授权

US07080896B2 Micro-fluid ejection device having high resistance heater film 有权
标题翻译：具有高电阻加热膜的微流体喷射装置
公开(公告)号：US07080896B2
公开(公告)日：2006-07-25
申请号：US10760726
申请日：2004-01-20
申请人： Byron V. Bell , Robert W. Cornell , Yimin Guan , George K. Parish
发明人： Byron V. Bell , Robert W. Cornell , Yimin Guan , George K. Parish
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2202/03 , Y10T29/49082 , Y10T29/49098 , Y10T29/49099 , Y10T29/49163 , Y10T29/49346 , Y10T29/49401
摘要： A semiconductor substrate for a micro-fluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. Each of the fluid ejection actuators includes a thin heater stack comprising a thin film heater and one or more protective layers adjacent the heater. The thin film heater is made of a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys, and has a sheet resistance ranging from about 30 to about 100 ohms per square. The thin film material contains from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.
摘要翻译：一种用于微流体喷射头的半导体衬底。衬底包括设置在衬底上的多个流体喷射致动器。每个流体喷射致动器包括薄加热器堆叠，其包括薄膜加热器和与加热器相邻的一个或多个保护层。薄膜加热器由具有主要由AlN，TaN和TaAl合金组成的纳米晶体结构的钽 - 氮化铝薄膜材料制成，并且具有约30至约100欧姆/平方的薄层电阻。薄膜材料含有约30至约70原子％的钽，约10至约40原子％的铝和约5至约30原子％的氮。

4. 发明授权

US06902256B2 Ink jet printheads 有权
标题翻译：喷墨打印头
公开(公告)号：US06902256B2
公开(公告)日：2005-06-07
申请号：US10621018
申请日：2003-07-16
申请人： Frank E. Anderson , Byron V. Bell , Carl E. Sullivan , Paul A Cook , Robert W. Cornell , George K. Parish
发明人： Frank E. Anderson , Byron V. Bell , Carl E. Sullivan , Paul A Cook , Robert W. Cornell , George K. Parish
IPC分类号： B41J2/14 , B41J2/175 , B41J2/05
CPC分类号： B41J2/17556 , B41J2/14129 , B41J2/17506 , B41J2/17513 , B41J2202/03 , B41J2202/13
摘要： An ink jet printer including a printer cartridge containing a printhead attached to a cartridge carriage for translation of the cartridge across a print media. The printer also includes an off carriage ink supply, a printer microprocessor, and a combined ink fill tube and electrical connection cable connected between the cartridge and the off carriage ink supply for providing refill ink to the ink cartridge and control of the carriage and printhead. Improvements to the printer enable low cost, high quality printing to be achieved.
摘要翻译：一种喷墨打印机，包括一个打印机墨盒，该打印机墨盒包含一个连接到墨盒托架的打印头，用于使打印墨盒平移印刷介质。该打印机还包括一个卸载墨盒，一个打印机微处理器以及一个连接在墨盒和卸载墨盒之间的组合墨水填充管和电连接电缆，用于向墨盒提供再填充墨水并控制滑架和打印头。对打印机的改进使得能够实现低成本，高质量的打印。

5. 发明授权

US07673973B2 Micro-fluid ejecting device having embedded memory devices 有权
标题翻译：具有嵌入式存储器件的微流体喷射装置
公开(公告)号：US07673973B2
公开(公告)日：2010-03-09
申请号：US11752551
申请日：2007-05-23
申请人： John G. Edelen , George K. Parish , Kristi M. Rowe
发明人： John G. Edelen , George K. Parish , Kristi M. Rowe
IPC分类号： B41J2/05
CPC分类号： B41J2/14016 , B41J2/04541 , B41J2/0458 , B41J2/04581 , B41J2/14201 , B41J2202/13 , B41J2202/17
摘要： A micro-fluid ejecting device includes a semiconductor substrate, a plurality of fluid ejection elements formed on the semiconductor substrate, and a plurality of nonvolatile programmable memory devices for storing information related to the operation of the micro-fluid ejecting device. The programmable memory devices, which are at least partially embedded in the semiconductor substrate, each include a source region and a drain region formed in the semiconductor substrate. The source and drain regions have a conductivity type which is opposite the conductivity type of the semiconductor substrate. An insulative layer is formed on the semiconductor substrate over the source region and drain region. A floating gate region is formed on the insulative layer and is spatially disposed between the source region and drain region. The floating gate region is electrically insulated from the source and drain regions by the insulative layer. Electrical contacts are connected to the source region and the drain region. The programmable memory devices collectively provide a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.
摘要翻译：微流体喷射装置包括半导体衬底，形成在半导体衬底上的多个流体喷射元件和用于存储与微流体喷射装置的操作有关的信息的多个非易失性可编程存储器件。至少部分地嵌入在半导体衬底中的可编程存储器件各自包括形成在半导体衬底中的源极区域和漏极区域。源区和漏区具有与半导体衬底的导电类型相反的导电类型。在源极区域和漏极区域上的半导体衬底上形成绝缘层。在绝缘层上形成浮栅区域，并且空间地设置在源极区域和漏极区域之间。浮置栅极区域通过绝缘层与源极和漏极区域电绝缘。电触点连接到源区和漏区。可编程存储器装置共同提供嵌入在衬底上的高密度存储器位，用于存储关于微流体喷射装置的信息。

6. 发明授权

US07635174B2 Heater chip test circuit and methods for using the same 有权
标题翻译：加热芯片测试电路及其使用方法
公开(公告)号：US07635174B2
公开(公告)日：2009-12-22
申请号：US11208682
申请日：2005-08-22
申请人： Steven W. Bergstedt , John G. Edelen , Paul W. Graf , David G. King , Robert E. Miller, Jr. , George K. Parish , Kristi M. Rowe
发明人： Steven W. Bergstedt , John G. Edelen , Paul W. Graf , David G. King , Robert E. Miller, Jr. , George K. Parish , Kristi M. Rowe
IPC分类号： B41J29/38
CPC分类号： B41J29/393 , B41J2/0451 , B41J2/04541 , B41J2/04548 , B41J2/0458
摘要： Test circuits on heater chips for testing a heater circuit having a heater element and a first power device. The test circuit can include a second power device, a test device configured to hold the first power device off and the second power device on for a selected heater circuit when the test device receives a signal to activate the test circuit, and a common test output to transmit a signal indicative of a state of the selected heater circuit. Methods for using the same are also provided.
摘要翻译：用于测试具有加热元件和第一功率器件的加热器电路的加热器芯片上的测试电路。测试电路可以包括第二电源设备，被配置为当测试设备接收到启动测试电路的信号时，关闭第一电源设备并使第二电源设备接通所选择的加热器电路的测试设备，以及公共测试输出以发送指示所选择的加热器电路的状态的信号。还提供了使用它们的方法。

7. 发明授权

US07419231B2 Power sensing circuit 有权
标题翻译：功率检测电路
公开(公告)号：US07419231B2
公开(公告)日：2008-09-02
申请号：US11136832
申请日：2005-05-25
申请人： George K. Parish , Kristi M. Rowe
发明人： George K. Parish , Kristi M. Rowe
IPC分类号： B41J29/38
CPC分类号： B41J29/393 , B41J2/17546
摘要： A heater chip that includes a circuit element, and a bus that can be used to power the circuit element. The heater chip also includes a feedback circuit that is coupled to the power bus. Particularly, the feedback circuit can be configured to indicate if the bus is powered the circuit element.
摘要翻译：一种加热器芯片，其包括电路元件和可用于为电路元件供电的总线。加热器芯片还包括耦合到电源总线的反馈电路。特别地，反馈电路可以被配置为指示总线是否为电路元件供电。

8. 发明授权

US07097280B2 Printheads having improved heater chip construction 有权
标题翻译：具有改进的加热器芯片结构的打印头
公开(公告)号：US07097280B2
公开(公告)日：2006-08-29
申请号：US10777813
申请日：2004-02-12
申请人： Rick L. Hubert , George K. Parish , Kristi M Rowe , John G. Edelen , Paul W. Graf , Carl Sullivan
发明人： Rick L. Hubert , George K. Parish , Kristi M Rowe , John G. Edelen , Paul W. Graf , Carl Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2/14129
摘要： An improved heater chip for an ink jet print head, the chip including an active heater array and an inactive heater array located adjacent to and extending away from the end of the active heater array. The inactive heater array provides a region adjacent the end of the active heater array that is substantially planar, and also provides a plurality of current paths which reduces energy differences between heater resistors adjacent the end of the active heater array and other heater resistors in the heater array.
摘要翻译：一种用于喷墨打印头的改进的加热器芯片，该芯片包括活动加热器阵列和位于主动加热器阵列的端部附近并远离主动加热器阵列的非活动加热器阵列。非活动加热器阵列提供邻近主动加热器阵列的端部的区域，该区域基本上是平面的，并且还提供多个电流路径，其减少邻近有源加热器阵列端部的加热器电阻器与加热器中的其它加热电阻器之间的能量差数组。

9. 发明授权

US07594708B2 Methods and apparatuses for sensing temperature of multi-via heater chips 有权
标题翻译：用于感测多通道加热器芯片温度的方法和装置
公开(公告)号：US07594708B2
公开(公告)日：2009-09-29
申请号：US11323809
申请日：2005-12-30
申请人： Lucas David Barkley , Bruce David Gibson , Eric Spencer Hall , David G. King , George K. Parish
发明人： Lucas David Barkley , Bruce David Gibson , Eric Spencer Hall , David G. King , George K. Parish
IPC分类号： B41J29/38
CPC分类号： B41J2/195 , B41J2/04563 , B41J2/0458
摘要： Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.
摘要翻译：用于与打印装置一起使用的加热器芯片，例如包括基本上邻近第一通孔定位的第一加热器阵列的加热器芯片和基本上邻近第二通孔定位的第二加热器阵列。加热器芯片还可以包括位于第一加热器阵列和第二加热器阵列之间的区域，以及温度感测元件，其可操作以感测区域的温度，其中温度感测元件相对于该区域基本上居中设置。根据本发明的一个实施例，温度感测元件包括温度感测电阻器。

10. 发明授权

US07163272B2 Inkjet print head 有权
标题翻译：喷墨打印头
公开(公告)号：US07163272B2
公开(公告)日：2007-01-16
申请号：US10865655
申请日：2004-06-10
申请人： George K. Parish , Kristi M. Rowe
发明人： George K. Parish , Kristi M. Rowe
IPC分类号： B41J29/38
CPC分类号： B41J2/14153 , B41J2/04563 , B41J2/0458 , B41J2/04581
摘要： Some embodiments of the present invention provide an inkjet print head having a housing defining an ink reservoir, a nozzle portion including a nozzle plate defining an ink chamber in fluid communication with the ink reservoir, and forming a fluid flow path between the ink chamber and the ink reservoir, and a substrate coupled to the nozzle plate and having a surface substantially positioned over the nozzle plate. At least one heating element can be coupled to the substrate, and can be positioned adjacent the surface to heat a portion of the ink chamber. In some embodiments, the inkjet print head comprises a control circuit coupled to the at least one heating element for controlling the heating element, and a temperature sense element positioned substantially between the at least one heating element and the control circuit or in at least partially overlapping relationship with the heating element.
摘要翻译：本发明的一些实施例提供了一种喷墨打印头，其具有限定油墨储存器的壳体，喷嘴部分包括限定与油墨储存器流体连通的油墨室的喷嘴板，以及在油墨室和油墨室之间形成流体流动路径墨水储存器和连接到喷嘴板并具有基本上位于喷嘴板上方的表面的基板。至少一个加热元件可以联接到基底，并且可以邻近表面定位以加热墨水腔的一部分。在一些实施例中，喷墨打印头包括耦合到至少一个加热元件以控制加热元件的控制电路和基本上位于至少一个加热元件和控制电路之间或至少部分重叠的温度感测元件与加热元件的关系。

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