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1. 发明申请

US20100091427A1 MULTILAYER CHIP CAPACITOR 有权
标题翻译：多层芯片电容器
公开(公告)号：US20100091427A1
公开(公告)日：2010-04-15
申请号：US12407298
申请日：2009-03-19
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232 , H01G4/385 , H01L2224/16227 , H01L2924/15311
摘要： A multilayer chip capacitor includes: a capacitor body having a plurality of dielectric layers laminated therein and comprising first and second capacitor units; and first to fourth external electrodes formed on an outer surface of the capacitor body, wherein the first capacitor unit comprises first and second internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the first and second external electrodes, and having different polarities, each pair of first and second internal electrodes being laminated one or more times to discriminate a plurality of capacitors with a certain capacitance, the second capacitor unit comprises third and fourth internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the third and fourth external electrodes, and having the same polarities as those of the first and second internal electrodes, each pair of third and fourth internal electrodes being laminated one or more times to discriminate one or more capacitors each with a certain capacitance, and at least three capacitors included in the first and second capacitor units have different capacitances or resonance frequencies.
摘要翻译：一种多层片状电容器包括：电容器主体，其具有层叠在其中的多个电介质层，并且包括第一和第二电容器单元; 以及形成在所述电容器主体的外表面上的第一至第四外部电极，其中所述第一电容器单元包括彼此面对的第一和第二内部电极，所述电介质层插入在所述第一和第二内部电极之间，连接到所述第一和第二外部电极，并且具有不同的极性每一对第一和第二内部电极层叠一次或多次以区分具有一定电容的多个电容器，第二电容器单元包括彼此面对的第三和第四内部电极，介电层插入其间，连接到第三个和第四外部电极，并且具有与第一和第二内部电极相同的极性，每对第三和第四内部电极被层叠一次或多次以区分一个或多个具有一定电容的电容器，并且至少三个电容器包括在第一和第二电容器单元ha中不同的电容或谐振频率。

2. 发明授权

US07688568B1 Multilayer chip capacitor 有权
标题翻译：多层片式电容器
公开(公告)号：US07688568B1
公开(公告)日：2010-03-30
申请号：US12407298
申请日：2009-03-19
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232 , H01G4/385 , H01L2224/16227 , H01L2924/15311
摘要： A multilayer chip capacitor includes: a capacitor body having a plurality of dielectric layers laminated therein and comprising first and second capacitor units; and first to fourth external electrodes formed on an outer surface of the capacitor body, wherein the first capacitor unit comprises first and second internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the first and second external electrodes, and having different polarities, each pair of first and second internal electrodes being laminated one or more times to discriminate a plurality of capacitors with a certain capacitance, the second capacitor unit comprises third and fourth internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the third and fourth external electrodes, and having the same polarities as those of the first and second internal electrodes, each pair of third and fourth internal electrodes being laminated one or more times to discriminate one or more capacitors each with a certain capacitance, and at least three capacitors included in the first and second capacitor units have different capacitances or resonance frequencies.
摘要翻译：一种多层片状电容器包括：电容器主体，其具有层叠在其中的多个电介质层，并且包括第一和第二电容器单元; 以及形成在所述电容器主体的外表面上的第一至第四外部电极，其中所述第一电容器单元包括彼此面对的第一和第二内部电极，所述电介质层插入在所述第一和第二内部电极之间，连接到所述第一和第二外部电极，并具有不同的极性每一对第一和第二内部电极层叠一次或多次以区分具有一定电容的多个电容器，第二电容器单元包括彼此面对的第三和第四内部电极，介电层插入其间，连接到第三个和第四外部电极，并且具有与第一和第二内部电极相同的极性，每对第三和第四内部电极被层叠一次或多次以区分一个或多个具有一定电容的电容器，并且至少三个电容器包括在第一和第二电容器单元ha中不同的电容或谐振频率。

3. 发明授权

US07567425B1 Multilayer chip capacitor 有权
标题翻译：多层片式电容器
公开(公告)号：US07567425B1
公开(公告)日：2009-07-28
申请号：US12339839
申请日：2008-12-19
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232 , H01G4/38
摘要： There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units; and first to fourth outer electrodes, wherein the first capacitor unit includes at least one pair of first and second inner electrodes, the second capacitor unit includes at least one pair of third and fourth inner electrodes, an alternate laminated portion is formed in one area within the capacitor body, the alternate laminated portion having the first to fourth inner electrodes sequentially laminated therein, and a capacitance adjusting portion is formed in another area within the capacitor body, the capacitance adjusting portion having at least one of the one pair of first and second inner electrodes and the one pair of third and fourth inner electrodes laminated repeatedly.
摘要翻译：提供了一种多层片状电容器，包括：电容器主体，包括第一和第二电容器单元; 和第一至第四外部电极，其中所述第一电容器单元包括至少一对第一和第二内部电极，所述第二电容器单元包括至少一对第三和第四内部电极，在一个区域内形成交替的层叠部分电容器主体，具有依次层叠的第一至第四内部电极的交替层叠部分和电容器体内的另一区域中形成电容调整部，电容调整部具有一对第一和第二电极中的至少一个内电极和一对第三和第四内电极重复层叠。

4. 发明授权

US08149565B2 Circuit board device and integrated circuit device 有权
标题翻译：电路板装置和集成电路装置
公开(公告)号：US08149565B2
公开(公告)日：2012-04-03
申请号：US12421953
申请日：2009-04-10
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G15/00
CPC分类号： H05K1/0231 , H01G2/065 , H01G4/35 , H05K2201/09318 , H05K2201/09481 , H05K2201/10636 , H05K2201/10969 , Y02P70/611
摘要： A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.
摘要翻译：一种电路板装置，包括：电路板，包括安装区域;以及第一和第二电力线以及形成在所述安装区域上的接地焊盘;以及垂直多层片状电容器（MLCC），其包括电容器本体，多个第一和第二极性内部电极，第一外部电极和第二外部电极以及第三外部电极，其中第一和第二电力线分别设置在安装区域上，连接到第一和第二外部电极，并且仅通过垂直MLCC 并且接地焊盘设置在第一和第二电源线之间并且连接到第三外部电极。

5. 发明授权

US08184444B2 Electrode pad for mounting electronic component and structure for mounting electronic component 有权
标题翻译：用于安装电子部件的电极垫和用于安装电子部件的结构
公开(公告)号：US08184444B2
公开(公告)日：2012-05-22
申请号：US12425068
申请日：2009-04-16
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H05K7/00
CPC分类号： H05K1/111 , H05K1/0231 , H05K3/3442 , H05K2201/09381 , H05K2201/10636 , Y02P70/611
摘要： Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.
摘要翻译：提供了一种用于将电子部件安装在电路板的表面上的电极焊盘。电极焊盘包括彼此面对的第一和第二电极部分，以及彼此面对的第三和第四电极部分。第三和第四电极部分与第一和第二电极部分相邻设置，用于与第一和第二电极部分一起形成电极焊盘的拐角。第一至第四电极部件中的至少一个包括通过切割形成电极焊盘的角部的第一至第四电极部分中的至少一个的角部而形成的倒角表面。因此，当电极焊盘用于安装电子部件时，能够充分地增加电子部件的外部电极的宽度，能够容易地调整外部电极的形状或尺寸。

6. 发明申请

US20100032193A1 ELECTRODE PAD FOR MOUNTING ELECTRONIC COMPONENT AND STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT 有权
标题翻译：用于安装电子部件的电极板和用于安装电子部件的结构
公开(公告)号：US20100032193A1
公开(公告)日：2010-02-11
申请号：US12425068
申请日：2009-04-16
申请人： Byoung Hwa LEE , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa LEE , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H05K1/16 , H05K1/11
CPC分类号： H05K1/111 , H05K1/0231 , H05K3/3442 , H05K2201/09381 , H05K2201/10636 , Y02P70/611
摘要： Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.
摘要翻译：提供了一种用于将电子部件安装在电路板的表面上的电极焊盘。电极焊盘包括彼此面对的第一和第二电极部分，以及彼此面对的第三和第四电极部分。第三和第四电极部分与第一和第二电极部分相邻设置，用于与第一和第二电极部分一起形成电极焊盘的拐角。第一至第四电极部件中的至少一个包括通过切割形成电极焊盘的角部的第一至第四电极部分中的至少一个的角部而形成的倒角表面。因此，当电极焊盘用于安装电子部件时，能够充分地增加电子部件的外部电极的宽度，能够容易地调整外部电极的形状或尺寸。

7. 发明授权

US08315034B2 Multilayer chip capacitor with improved equivalent series resistance 有权
标题翻译：具有改善等效串联电阻的多层片式电容器
公开(公告)号：US08315034B2
公开(公告)日：2012-11-20
申请号：US12245856
申请日：2008-10-06
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228 , H01G4/06 , H01G4/38
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： A multilayer chip capacitor includes a capacitor body including a first capacitor part and a second capacitor part, first and second external electrodes respectively formed on first and second longer side faces of the capacitor body, and third and fourth external electrodes respectively formed on first and second shorter side faces of the capacitor body. The first capacitor part includes first and second internal electrodes of opposite polarity, and the second capacitor part includes third and fourth internal electrodes of opposite polarity. The first to fourth internal electrodes each have one lead. The first to fourth external electrodes are respectively connected to the leads of the first to fourth internal electrodes. A series resonance frequency of the first capacitor part is different from that of the second capacitor part. Equivalent series resistance (ESR1) of the first capacitor part and the equivalent series resistance (ESR2) of the second capacitor part satisfy ERS1≧20 mΩ and 0.7(ESR1)≦ESR2≦1.3(ESR1).
摘要翻译：多层片状电容器包括电容器本体，其包括第一电容器部分和第二电容器部分，分别形成在电容器主体的第一和第二长侧面上的第一和第二外部电极，以及分别形成在第一和第二电极部分上的第三和第四外部电极电容器主体的较短侧面。第一电容器部分包括具有相反极性的第一和第二内部电极，并且第二电容器部分包括具有相反极性的第三和第四内部电极。第一至第四内部电极各有一个引线。第一至第四外部电极分别连接到第一至第四内部电极的引线。第一电容器部分的串联谐振频率与第二电容器部分的串联谐振频率不同。第一电容器部分的等效串联电阻（ESR1）和第二电容器部分的等效串联电阻（ESR2）满足ERS1≥20m＆OHgr; 和0.7（ESR1）＆nlE; ESR2＆N1; 1.3（ESR1）。

8. 发明授权

US08184425B2 Multilayer capacitor 有权
标题翻译：多层电容器
公开(公告)号：US08184425B2
公开(公告)日：2012-05-22
申请号：US12238796
申请日：2008-09-26
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228 , H01G4/005 , H01G4/20
CPC分类号： H01G4/228
摘要： There is provided a multilayer capacitor including: a capacitor body where a plurality of dielectric layers are laminated, the capacitor body including first and second surfaces opposing each other in a laminated direction, wherein the first surface provides a mounting surface; a plurality of first and second inner electrodes; an inner connecting conductor; and a plurality of first and second outer electrodes formed on an outer surface of the body, wherein a corresponding one of the outer electrodes having identical polarity to the inner connecting conductor includes at least one outer terminal formed on the first surface of the body to connect to the inner connecting conductor, and at least one outer connecting conductor formed on the second surface of the body to connect a corresponding one of the inner electrodes of identical polarity to the inner connecting conductor.
摘要翻译：提供了一种层叠电容器，其包括：层叠多个电介质层的电容器体，所述电容器主体包括在层叠方向上彼此相对的第一和第二表面，其中所述第一表面提供安装表面; 多个第一和第二内部电极; 内连接导体; 以及形成在所述主体的外表面上的多个第一外部电极和第二外部电极，其中与所述内部连接导体具有相同极性的相应的外部电极包括形成在所述主体的所述第一表面上的至少一个外部端子，以连接内部连接导体和形成在主体的第二表面上的至少一个外部连接导体，以将相当极性的相应的一个内部电极与内部连接导体相连接。

9. 发明授权

US07817007B2 Laminated inductor 有权
标题翻译：层压电感
公开(公告)号：US07817007B2
公开(公告)日：2010-10-19
申请号：US12194935
申请日：2008-08-20
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hyeog Soo Shin , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hyeog Soo Shin , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F3/14 , H01F17/04
摘要： There is provided a laminated inductor including: a body where a plurality of magnetic layers are laminated; a coil part formed on the magnetic layers, the coil part including a plurality of conductor patterns and a plurality of conductive vias; first and second external electrodes formed on an outer surface of the body to connect to both ends of the coil part, respectively; and a non-magnetic conductor formed on at least one of the magnetic layers so as to relax magnetic saturation caused by direct current flowing through the coil part. The laminated inductor employs the non-magnetic conductor as a non-magnetic gap to be simplified in a manufacturing process and effectively improved in DC superposition characteristics.
摘要翻译：提供一种层叠电感器，包括：层叠有多个磁性层的主体; 形成在所述磁性层上的线圈部分，所述线圈部分包括多个导体图案和多个导电通孔; 第一外部电极和第二外部电极分别形成在主体的外表面上以连接到线圈部分的两端; 以及形成在至少一个磁性层上的非磁性导体，以便缓和由直流电流流过线圈部分的磁饱和。层叠电感器在制造工艺中使用非磁性导体作为非磁性间隙进行简化，并有效地改善了DC叠加特性。

10. 发明申请

US20100254070A1 MULTILAYER CHIP CAPACITOR 有权
标题翻译：多层芯片电容器
公开(公告)号：US20100254070A1
公开(公告)日：2010-10-07
申请号：US12817046
申请日：2010-06-16
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： A multilayer chip capacitor includes: a capacitor body having first and second side surfaces and a bottom surface; a plurality of first and second internal electrodes in the capacitor body; first and second external electrodes having a first polarity and formed on the first and second side surfaces, respectively, to cover a respective lower edge of the side surfaces and to partially extend to the bottom surface; and a third external electrode having a second polarity and formed on the bottom surface. The internal electrodes are disposed in perpendicular to the bottom surface. Each of the first internal electrodes has a first lead drawn to the first side and bottom surfaces and a second lead drawn to the second side and bottom surfaces. Each of the second internal electrodes has a third lead drawn to the bottom surface.
摘要翻译：一种多层片状电容器包括：具有第一和第二侧表面和底表面的电容器本体; 电容器主体中的多个第一和第二内部电极; 第一和第二外部电极分别具有第一极性并形成在第一和第二侧表面上，以覆盖侧表面的相应下边缘并部分地延伸到底面; 和具有第二极性并形成在底面上的第三外部电极。内部电极垂直于底面设置。每个第一内部电极具有被引导到第一侧面和底部表面的第一引线和被引导到第二侧面和底部表面的第二引线。每个第二内部电极具有被引导到底面的第三引线。

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