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    • 1. 发明授权
    • Method for fabricating a vertical-cavity surface-emitting laser diode
    • 用于制造垂直腔表面发射激光二极管的方法
    • US5661076A
    • 1997-08-26
    • US623817
    • 1996-03-29
    • Byeung-Su YooHyo-Hoon ParkHye-Yong ChuMin-Soo Park
    • Byeung-Su YooHyo-Hoon ParkHye-Yong ChuMin-Soo Park
    • H01S5/183H01S5/42H01L21/20
    • H01S5/18347H01S2301/166H01S5/2218H01S5/423
    • A method for non-active processing of an etched surface in a vertical-cavity surface-emitting laser diode is provided. In order to obtain a stable single fundamental transverse mode, at a low temperature of 100 to 300 degrees, an amorphous GaAs is deposited on a surface of an etched active layer and an etched cavity. Also, a bottom emitting laser is provided which is formed by, with the metal electrode as a mask, etching the top mirror layer and the active layer, depositing the amorphous GaAs onto the etched portion and planarizing the deposited GaAs layer and depositing p-type metal pad over the amorphous GaAs around the formed laser device. Also, a top emission type laser is provided which is formed by, with a photoresist as a mask, etching the top mirror layer and the active layer, planarizing the GaAs layer and depositing p-type metal pad containing a window for light emission which is made smaller than laser area over the amorphous GaAs around the formed laser device. Thus, a more stable single fundamental transverse mode than in the conventional device can be obtained.
    • 提供了一种在垂直腔表面发射激光二极管中非侵蚀性处理蚀刻表面的方法。 为了获得稳定的单个基本横模,在100至300度的低温下,非晶GaAs沉积在蚀刻的有源层和蚀刻腔的表面上。 另外,提供了以金属电极为掩模形成的底部发射激光器,蚀刻上镜面层和有源层,将非晶GaAs沉积到蚀刻部分上并使沉积的GaAs层平坦化并沉积p型 在形成的激光器件周围的非晶GaAs上的金属焊盘。 另外,提供了以光致抗蚀剂为掩模形成的顶部发射型激光器,蚀刻上镜面层和有源层,使GaAs层平坦化并沉积含有用于发光的窗口的p型金属焊盘, 在形成的激光器件周围的非晶GaAs周围比激光区域小。 因此,可以获得比常规装置更稳定的单根横向模式。
    • 3. 发明授权
    • Compact optical logic operator array
    • 紧凑型光逻辑运算器阵列
    • US5770851A
    • 1998-06-23
    • US713535
    • 1996-09-13
    • Hyo-Hoon ParkKwang-Joon KimKyung-Sook HyunO-Kyun KwonSeok-Ho SongByueng-Su YooHye-Yong Chu
    • Hyo-Hoon ParkKwang-Joon KimKyung-Sook HyunO-Kyun KwonSeok-Ho SongByueng-Su YooHye-Yong Chu
    • G02B6/43G02F3/02H01J40/14
    • G02F3/028G02B6/43
    • An improved parallel optical logic operator provides a path for light to pass through substrates in which a light source and an optical logic device are arranged. An optical logic device operates by transmission of light forwarded to a predetermined direction. This increases integration efficiency of the system by eliminating optical parts for changing the light path. A unit chip includes a laser array for generating a predetermined light in accordance with an electrical signal for a logic process, a laser array substrate on which via holes are formed for passing light, a microlens array for converting the light beam emitted from each laser device of the laser array into a parallel light beam for passing through the via hole, and an optical logic circuit array formed with a combination of an S-SEED which performs a logic function by transmission of the light signal through an optical window in S-SEED. A plurality of unit chips are laminated so that the light emitted from the laser device of one of the unit chips passes through an optical logic circuit of a corresponding unit chip and can be made incident on the optical logic circuit in the next unit chip through a via hole.
    • 改进的并行光逻辑运算器提供光通过其中布置光源和光逻辑器件的衬底的路径。 光逻辑器件通过传输转发到预定方向的光来操作。 这通过消除用于改变光路的光学部件来提高系统的集成效率。 单元芯片包括用于根据用于逻辑处理的电信号产生预定光的激光阵列,其上形成有用于通过光的通孔的激光阵列基板,用于转换从每个激光装置发射的光束的微透镜阵列 的激光器阵列的平行光束通过通孔;以及光学逻辑电路阵列,其形成有S-SEED的组合,S-SEED通过S-SEED中的光学窗口传输光信号来执行逻辑功能 。 多个单位芯片被层叠,使得从单个芯片之一的激光装置发射的光通过相应的单元芯片的光学逻辑电路,并且可以通过一个单元芯片入射到下一个单元芯片中的光学逻辑电路上 通孔。