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1. 发明授权

US6126140A Monolithic bi-directional microvalve with enclosed drive electric field 失效
标题翻译：具封闭驱动电场的单片双向微型阀
公开(公告)号：US6126140A
公开(公告)日：2000-10-03
申请号：US999169
申请日：1997-12-29
申请人： Burgess R. Johnson , Daniel W. Youngner , S. Kimura
发明人： Burgess R. Johnson , Daniel W. Youngner , S. Kimura
IPC分类号： F15C5/00 , F16K99/00 , F16K31/02 , F16K7/14
CPC分类号： F16K99/0001 , F15C5/00 , F16K99/0015 , F16K99/0051 , F16K2099/0074 , F16K2099/0084 , F16K2099/0086
摘要： A monolithic, bi-directional micro device formed on a support base, for example a silicon wafer, including at least one input and output flow channels for flow of fluid. The actuator portion includes electrically conducting upper lower diaphragms (preferably formed from doped polycrystalline silicon) formed about a central electrode and mounted on the base. The diaphragms move under electrostatic force between first and second positions upon application of voltage. The upper and lower diaphragms form a sealed, enclosed cavity separated from the channels. The diaphragms are connected for mechanically transmitting electrostatically induced force from one diaphragm to the other, preferably by one or more posts passing through at least one hole formed in the central electrode. The lower diaphragm and the support base are maintained at the same electrical potential. The device is formed by depositing and patterning the electrodes and forming spaces between the electrodes by etching of sacrificial layers. One or more input flow channels and/or output flow channels are etched in the support base from either the frontside or the backside. Electrical contacts are formed by etching and metalizing pads to provide electrical paths for voltage to be selectively applied to the capacitor electrodes.
摘要翻译：形成在支撑基座（例如硅晶片）上的单片双向微型装置，其包括用于流体流动的至少一个输入和输出流动通道。致动器部分包括形成在中心电极周围并安装在基座上的导电上下隔膜（优选由掺杂多晶硅形成）。在施加电压时，隔膜在静电力之间在第一和第二位置之间移动。上隔膜和下隔膜形成与通道分离的密封的封闭空腔。连接的隔膜用于将静电感应力从一个隔膜机械地传递到另一个隔膜，优选地通过一个或多个通过中心电极中形成的至少一个孔的柱。下隔膜和支撑基座保持相同的电位。通过沉积和图案化电极并通过蚀刻牺牲层在电极之间形成空间来形成器件。一个或多个输入流动通道和/或输出流动通道在支撑底座中从前侧或后侧蚀刻。通过蚀刻和金属化焊盘形成电触点，以提供用于选择性地施加到电容器电极的电压的电路径。

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