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1. 发明申请

US20110320237A1 Meeting Calendar Optimization 审中-公开
标题翻译：会议日历优化
公开(公告)号：US20110320237A1
公开(公告)日：2011-12-29
申请号：US12821755
申请日：2010-06-23
申请人： Brian S. Beaman , Mark K. Hoffmeyer , Joseph C. Diepenbrock , John L. Colbert , Roger S. Krabbenhoft , Sandra J. Shirk/Heath , William L. Brodsky
发明人： Brian S. Beaman , Mark K. Hoffmeyer , Joseph C. Diepenbrock , John L. Colbert , Roger S. Krabbenhoft , Sandra J. Shirk/Heath , William L. Brodsky
IPC分类号： G06Q10/00
CPC分类号： G06Q10/06314
摘要： A method, a computer program product, and an apparatus is provided for scheduling meetings which includes (1) evaluating a set of proposed meetings, (2) creating a number of calendars, each calendar containing schedule date for the proposed meetings, (3) ranking each calendar according to a calendar evaluation criteria and providing the ranking data with the calendar, and (4) displaying several of the calendars and their respective ranking data.
摘要翻译：提供了一种方法，计算机程序产品和装置，用于安排会议，其包括（1）评估一组拟议的会议，（2）创建多个日历，每个日历包含所提出的会议的日程安排日期;（3）根据日历评估标准对每个日历进行排序，并将日历的排名数据提供给日历，以及（4）显示若干个日历及其各自的排名数据。

2. 发明授权

US08267701B2 Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing 失效
标题翻译：对准结构具有框架结构和桥接连接以联接和对准插座壳体的段
公开(公告)号：US08267701B2
公开(公告)日：2012-09-18
申请号：US12783451
申请日：2010-05-19
申请人： Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
发明人： Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , H01L23/4006 , H01L23/49811 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is disclosed for aligning socket housing segments for an area array device. Each socket housing segment includes at least a first surface and a second surface, with the second surface opposite the first surface. The second surface of each socket housing segment provides electrical connections for a portion of the area array device. Socket contact pads are disposed on the first surfaces of the plurality of socket housing segments. The socket contact pads correspond to substrate contact pads disposed on a substrate. One or more alignment structures are disposed at a space between the socket housing segments. Each alignment structure is coupled to at least two of the socket housing segments. The one or more alignment structures maintain a predetermined alignment of each socket housing segment so that the socket contact pads align with the substrate contact pads during a surface mount connection process.
摘要翻译：公开了一种用于对准用于区域阵列装置的插座壳体段的装置。每个插座壳体段至少包括第一表面和第二表面，其中第二表面与第一表面相对。每个插座壳体段的第二表面为区域阵列器件的一部分提供电连接。插座接触垫设置在多个插座壳体段的第一表面上。插座接触焊盘对应于设置在衬底上的衬底接触焊盘。一个或多个对准结构设置在插座壳体段之间的空间处。每个对准结构联接到插座壳体段中的至少两个。一个或多个对准结构保持每个插座壳体段的预定对准，使得在表面安装连接过程期间，插座接触垫与衬底接触垫对准。

3. 发明申请

US20110287638A1 LARGE SCALE HYBRID SOCKET FOR AN AREA ARRAY DEVICE 失效
标题翻译：用于区域阵列设备的大规模混合插座
公开(公告)号：US20110287638A1
公开(公告)日：2011-11-24
申请号：US12783451
申请日：2010-05-19
申请人： Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
发明人： Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
IPC分类号： H01R12/16
CPC分类号： H05K7/1069 , H01L23/4006 , H01L23/49811 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is disclosed for aligning socket housing segments for an area array device. Each socket housing segment includes at least a first surface and a second surface, with the second surface opposite the first surface. The second surface of each socket housing segment provides electrical connections for a portion of the area array device. Socket contact pads are disposed on the first surfaces of the plurality of socket housing segments. The socket contact pads correspond to substrate contact pads disposed on a substrate. One or more alignment structures are disposed at a space between the socket housing segments. Each alignment structure is coupled to at least two of the socket housing segments. The one or more alignment structures maintain a predetermined alignment of each socket housing segment so that the socket contact pads align with the substrate contact pads during a surface mount connection process.
摘要翻译：公开了一种用于对准用于区域阵列装置的插座壳体段的装置。每个插座壳体段至少包括第一表面和第二表面，其中第二表面与第一表面相对。每个插座壳体段的第二表面为区域阵列器件的一部分提供电连接。插座接触垫设置在多个插座壳体段的第一表面上。插座接触焊盘对应于设置在衬底上的衬底接触焊盘。一个或多个对准结构设置在插座壳体段之间的空间处。每个对准结构联接到插座壳体段中的至少两个。一个或多个对准结构保持每个插座壳体段的预定对准，使得在表面安装连接过程期间，插座接触垫与衬底接触垫对准。

4. 发明授权

US07985095B2 Implementing enhanced connector guide block structures for robust SMT assembly 失效
标题翻译：实现强大的SMT组装的增强连接器导块结构
公开(公告)号：US07985095B2
公开(公告)日：2011-07-26
申请号：US12499913
申请日：2009-07-09
申请人： William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer
发明人： William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer
IPC分类号： H01R13/58
CPC分类号： H05K3/305 , H01R12/7041 , H01R12/7047 , H05K3/301 , H05K2201/09781 , H05K2201/10189 , H05K2201/10409 , H05K2201/2027 , H05K2203/167 , Y02P70/613 , Y10S439/947
摘要： A method and enhanced connector guide block structures implement robust connector assembly including robust Surface Mount Technology (SMT) connector assembly. A connector guide block includes a printed wiring board (PWB) mating face including at least one mounting screw hole provided within a mounting portion for receiving a mounting screw. The connector guide block is assembled with a printed wiring board (PWB) by inserting a respective non-bonding screw through an aligned opening in the PWB into guide block mounting hole and a gap is defined from an upper surface of the PWB below the guide block mounting portion. The gap is filled with an electrically nonconductive underfill material and cured. Another connector guide block structure includes an upper connector guide block portion and a lower connector guide block portion with a gap between the guide block portions filled with a selected electrically nonconductive underfill material and cured.
摘要翻译：一种方法和增强的连接器引导块结构实现坚固的连接器组件，其包括坚固的表面贴装技术（SMT）连接器组件。连接器引导块包括印刷线路板（PWB）配合面，其包括设置在用于接收安装螺钉的安装部分内的至少一个安装螺钉孔。连接器引导块通过将相应的非接合螺钉穿过PWB中的对准的开口插入到引导块安装孔中而与印刷线路板（PWB）组装，并且在引导块下面的PWB的上表面限定间隙安装部分。间隙填充有非导电底层填充材料并固化。另一个连接器引导块结构包括上连接器引导块部分和下连接器引导块部分，在引导块部分之间填充有选定的非导电底部填充材料并固化的间隙。

5. 发明申请

US20110008994A1 IMPLEMENTING ENHANCED CONNECTOR GUIDE BLOCK STRUCTURES FOR ROBUST SMT ASSEMBLY 失效
标题翻译：实现强化SMT组装的增强连接器指南块结构
公开(公告)号：US20110008994A1
公开(公告)日：2011-01-13
申请号：US12499913
申请日：2009-07-09
申请人： William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer
发明人： William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer
IPC分类号： H01R13/58 , H05K3/00
CPC分类号： H05K3/305 , H01R12/7041 , H01R12/7047 , H05K3/301 , H05K2201/09781 , H05K2201/10189 , H05K2201/10409 , H05K2201/2027 , H05K2203/167 , Y02P70/613 , Y10S439/947
摘要： A method and enhanced connector guide block structures implement robust connector assembly including robust Surface Mount Technology (SMT) connector assembly. A connector guide block includes a printed wiring board (PWB) mating face including at least one mounting screw hole provided within a mounting portion for receiving a mounting screw. The connector guide block is assembled with a printed wiring board (PWB) by inserting a respective non-bonding screw through an aligned opening in the PWB into guide block mounting hole and a gap is defined from an upper surface of the PWB below the guide block mounting portion. The gap is filled with an electrically nonconductive underfill material and cured. Another connector guide block structure includes an upper connector guide block portion and a lower connector guide block portion with a gap between the guide block portions filled with a selected electrically nonconductive underfill material and cured.
摘要翻译：一种方法和增强的连接器引导块结构实现坚固的连接器组件，其包括坚固的表面贴装技术（SMT）连接器组件。连接器引导块包括印刷线路板（PWB）配合面，其包括设置在用于接收安装螺钉的安装部分内的至少一个安装螺钉孔。连接器引导块通过将相应的非接合螺钉穿过PWB中的对准的开口插入到引导块安装孔中而与印刷线路板（PWB）组装，并且在引导块下方的PWB的上表面限定间隙安装部分。间隙填充有非导电底层填充材料并固化。另一个连接器引导块结构包括上连接器引导块部分和下连接器引导块部分，在引导块部分之间填充有选定的非导电底部填充材料并固化的间隙。

6. 发明授权

US08747122B2 Implementing connection of two large electronic boards utilizing LGA interconnect 失效
标题翻译：实现利用LGA互连的两个大型电子板的连接
公开(公告)号：US08747122B2
公开(公告)日：2014-06-10
申请号：US12821312
申请日：2010-06-23
申请人： Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
发明人： Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
IPC分类号： H01R12/00
CPC分类号： H05K3/36 , H01R43/205 , H05K1/141 , H05K3/301 , H05K3/368 , Y10T29/49126
摘要： A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.
摘要翻译：提供一种方法和装置，用于通过多个离散的陆地网格阵列（LGA）实现两个大电路卡的电连接。每个电路卡包括多个LGA位置。第一电路卡包括在第一电路卡的相应LGA位置局部排列的多个LGA插入器。将第二电路卡连接到第一电路卡的板对板连接硬件组件包括细长载体，其限定了容纳耦合到相关联的轴承座的多个负载弹簧的空腔，用于加载和保持LGA位置的平坦度。

7. 发明申请

US20140127915A1 IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LGA INTERCONNECT 失效
标题翻译：利用LGA互连实现两大电子板的连接
公开(公告)号：US20140127915A1
公开(公告)日：2014-05-08
申请号：US12821312
申请日：2010-06-23
申请人： Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
发明人： Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
IPC分类号： H01R12/52 , H05K3/36 , H01R43/20
CPC分类号： H05K3/36 , H01R43/205 , H05K1/141 , H05K3/301 , H05K3/368 , Y10T29/49126
摘要： A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.
摘要翻译：提供一种方法和装置，用于通过多个离散的陆地网格阵列（LGA）实现两个大电路卡的电连接。每个电路卡包括多个LGA位置。第一电路卡包括在第一电路卡的相应LGA位置局部排列的多个LGA插入器。将第二电路卡连接到第一电路卡的板对板连接硬件组件包括细长载体，其限定了容纳耦合到相关联的轴承座的多个负载弹簧的空腔，用于加载和保持LGA位置的平坦度。

8. 发明申请

US20090083972A1 Electronic Assembly and Techniques for Installing a Heatsink in an Electronic Assembly 有权
标题翻译：电子组装中安装散热器的电子组装和技术
公开(公告)号：US20090083972A1
公开(公告)日：2009-04-02
申请号：US11862848
申请日：2007-09-27
申请人： John L. Colbert , John S. Corbin, JR. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
发明人： John L. Colbert , John S. Corbin, JR. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
IPC分类号： B23P15/26 , H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
摘要翻译：用于在电子组件中安装散热器的技术包括同时向多个紧固件组件施加力，每个紧固件组件将相应的紧固件保持在散热器的主体中。然后通过致动紧固件将散热器附接到电子组件，同时力同时施加到多个紧固件组件。

9. 发明授权

US07701720B2 Electronic assembly and techniques for installing a heatsink in an electronic assembly 有权
标题翻译：用于在散热器中安装电子组件的电子装配和技术
公开(公告)号：US07701720B2
公开(公告)日：2010-04-20
申请号：US11862848
申请日：2007-09-27
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
摘要翻译：用于在电子组件中安装散热器的技术包括同时向多个紧固件组件施加力，每个紧固件组件将相应的紧固件保持在散热器的主体中。然后通过致动紧固件将散热器附接到电子组件，同时力同时施加到多个紧固件组件。

10. 发明申请

US20130055192A1 Motherboard Assembly for Interconnecting and Distributing Signals and Power 审中-公开
标题翻译：用于互连和分配信号和电源的主板组件
公开(公告)号：US20130055192A1
公开(公告)日：2013-02-28
申请号：US13611609
申请日：2012-09-12
申请人： John L. Colbert , Arvind K. Sinha , Roger D. Weekly
发明人： John L. Colbert , Arvind K. Sinha , Roger D. Weekly
IPC分类号： G06F17/50
CPC分类号： H05K1/144 , G11C5/025 , H05K1/113 , H05K1/114 , H05K1/141 , H05K3/0058 , H05K3/325 , H05K2201/044 , H05K2201/10378 , H05K2201/10545 , H05K2201/10719 , H05K2201/2009
摘要： Mechanisms for interconnecting and distributing signals and power between PCBs are provided. A first PCB having land grid arrays (LGAs) and a first wiring layer designed for interconnect components on the first PCB, and a second wiring layer for connecting the components to a second PCB, are provided. The second PCB has opposed parallel first and second surfaces, the first surface having a LGA. A wiring layer designed to interconnect components on the second PCB, and a layer for interconnecting the components on the second PCB with the components on the first PCB, are provided. A first interposer couples to a LGA of a first surface of the first PCB and connects a component to the first PCB. A second interposer is sandwiched between and couples to a LGA of a second surface of the first PCB and to the LGA of the first surface of the second PCB.
摘要翻译：提供了在PCB之间互连和分配信号和电源的机制。提供了具有地面栅格阵列（LGAs）的第一PCB和为第一PCB上的互连部件设计的第一布线层以及用于将部件连接到第二PCB的第二布线层。第二PCB具有相对的平行的第一和第二表面，第一表面具有LGA。设置用于互连第二PCB上的组件的布线层和用于将第二PCB上的组件与第一PCB上的组件互连的层。第一插入器耦合到第一PCB的第一表面的LGA并将部件连接到第一PCB。第二插入件夹在第一PCB的第二表面的LGA和第二PCB的第一表面的LGA之间并耦合到第二PCB的第二表面的LGA。

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