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    • 3. 发明授权
    • Contact pin design for a modular jack
    • 模块插座的接触针设计
    • US06394850B1
    • 2002-05-28
    • US09528500
    • 2000-03-20
    • David OliphantThomas A. JohnsonBrent D. Madsen
    • David OliphantThomas A. JohnsonBrent D. Madsen
    • H01R1700
    • H01R12/721H01R24/64Y10S439/946
    • A communications card allows computers to be electrically connected to electronic devices and communications systems. The communications card includes a modular jack with a plurality of contact pins. The contact pins include a plug engaging portion that does not include any sections that are angled more than about 90° in order to minimize the stresses in the contact pins. The contact pins also include a connector portion that allows the contact pins to be electrically connected to a printed circuit board disposed within the communications card. Preferably, the plug engaging portion includes an elongated arm that aids in absorbing stress and deflection of the contact pins. Advantageously, the contact pins are designed to minimize the height of the modular jack such that the modular jack can be used with communications cards that comply with the PCMCIA Type III standards.
    • 通信卡允许计算机电连接到电子设备和通信系统。 通信卡包括具有多个接触针的模块化插座。 接触销包括插头接合部分,其不包括角度大于约90°的任何部分,以便使接触销中的应力最小化。 接触针还包括允许接触针电连接到布置在通信卡内的印刷电路板的连接器部分。 优选地,插头接合部分包括有助于吸收接触销的应力和偏转的细长臂。 有利地,触针被设计成使模块化插座的高度最小化,使得模块插座可以与符合PCMCIA III型标准的通信卡一起使用。
    • 4. 发明授权
    • Illuminating electrical jack system
    • 照明电气千斤顶系统
    • US06483712B1
    • 2002-11-19
    • US09528330
    • 2000-03-20
    • David OliphantBrent D. MadsenRick Giles
    • David OliphantBrent D. MadsenRick Giles
    • H05K114
    • G06F1/1656G06F1/1616G06F1/1632H01R13/6691H01R13/717H01R13/7172H01R24/64H01R2201/06H05K5/0273
    • An electrical jack system is operable with an electrical plug, such as an RJ-type plug. In one embodiment, the electrical plug is at least partially translucent. The jack system includes a housing bounding a socket. The socket is configured to receive the electrical plug. A light source is coupled with the housing so as to selectively illuminate the socket and/or the translucent electrical plug when the translucent electrical plug is received within the socket of the housing. In one embodiment, the light source is a light emitter, such as an LED, mounted on the housing so as to be at least partially exposed to the socket of the housing. In an alternative embodiment, an opening is formed on the housing in communication with the socket. A light emitter is disposed a distance from the opening on the housing. A conduit extends between the light emitter and the opening. The conduit, such as a light pipe, is configured to channel light from the light emitter to the opening on the housing.
    • 电插座系统可用诸如RJ型插头的电插头操作。 在一个实施例中,电插头至少部分是半透明的。 插座系统包括限定插座的壳体。 插座被配置为接收电插头。 当所述透光电插头被容纳在所述壳体的所述插座内时,光源与所述壳体联接以便选择性地照亮所述插座和/或所述半透明电插头。 在一个实施例中,光源是安装在壳体上的光发射器,例如LED,以便至少部分地暴露于壳体的插座。 在替代实施例中,在壳体上形成有与插座连通的开口。 光发射器与壳体上的开口相距一定距离。 导管在光发射器和开口之间延伸。 诸如光管的导管被配置成将来自发光体的光引导到壳体上的开口。
    • 6. 发明授权
    • Modular jack for type III PCMCIA cards
    • US06488543B2
    • 2002-12-03
    • US09966150
    • 2001-09-27
    • David OliphantRyan A. KunzThomas A. JohnsonSteven Lo Forte
    • David OliphantRyan A. KunzThomas A. JohnsonSteven Lo Forte
    • H01R2400
    • H01R24/64Y10S439/923
    • The modular jack allows a RJ series connector plug to be attached to a communications card that conforms to the PCMCIA requirements for a Type III card. The modular jack includes a main body portion including a top surface, a bottom outer surface and a front surface. The receptacle is disposed entirely within the front surface of the modular jack such that no portion of the plug extends through either the top surface or the bottom surface of the main body portion of the modular jack. Thus, the modular jack allows the communications card to be connected to standard RJ series plugs without deviating from the Type III PCMCIA card height requirement, even when the plug is inserted into the jack. Desirably, the main body portion has a height measured from the top surface to the bottom surface that is generally equal to or less than about 10.5 mm. Additionally, the receptacle preferably includes an upper inner surface and a lower inner surface that are separated by a distance that is generally equal to or less than about 10.1 mm. The modular jack may also include a latching area that securely holds the connector plug within the receptacle, but allows the connector plug to be removed from the receptacle without the user depressing a biased clip of the connector plug if a predetermined force is applied to a body of the connector plug.
    • 10. 发明授权
    • Chip component assembly
    • US06650546B2
    • 2003-11-18
    • US09794515
    • 2001-02-27
    • Jon A. NelsonRick GilesDavid Oliphant
    • Jon A. NelsonRick GilesDavid Oliphant
    • H05K114
    • H05K9/0039H05K1/0231H05K5/0256H05K2201/10371H05K2201/10492H05K2201/10636Y02P70/611
    • A chip component assembly is provided that includes a plurality of chip components each having respective first and second terminal elements, the first terminal elements being joined to corresponding solder pads on a printed circuit board, the solder pads being in communication with electronic circuitry of the printed circuit board, and the second terminal elements being joined together by an array ground plane of a grounding device. The grounding device additionally includes a ground path structure which physically and electrically connects the array ground plane, and thus the chip components, to a ground pad located on the printed circuit board so as to provide a ground path from the chip components. Preferably, the array ground plane additionally includes a plurality of resilient contact elements which provide for substantial and continuous contact between the array ground plane and an ancillary ground plane, such as the top cover of a PC card. The grounding device serves to foreclose electrostatic discharge or EMI by the chip components and in some applications further serves to direct undesirable noise to ground. The relatively small size of the grounding device permits the use of a relatively smaller ground pad on the printed circuit board, thereby conserving valuable printed circuit board surface area. Finally, the ground path structure is configured for automated attachment to the chip components, and the chip component assembly thus formed is well suited for installation on the printed circuit board by pick-and-place manufacturing techniques.