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    • 1. 发明授权
    • Method of manufacturing dual orientation wafers
    • 制造双取向晶圆的方法
    • US07344962B2
    • 2008-03-18
    • US11160365
    • 2005-06-21
    • Brent A. AndersonJohn J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • Brent A. AndersonJohn J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • H01L21/36
    • H01L21/823807H01L21/823878H01L21/8252
    • Disclosed is a method of manufacturing dual orientation wafers. A trench is formed in a multi-layer wafer to a silicon substrate with a first crystalline orientation. The trench is filled with a silicon material (e.g., amorphous silicon or polysilicon trench). Isolation structures are formed to isolate the silicon material in the trench from a semiconductor layer with a second crystalline orientation. Additional isolation structures are formed within the silicon material in the trench and within the semiconductor layer. A patterned amorphization process is performed on the silicon material in the trench and followed by a recrystallization anneal such that the silicon material in the trench recrystallizes with the same crystalline orientation as the silicon substrate. The resulting structure is a semiconductor wafer with isolated semiconductor areas on the same plane having different crystalline orientations as well as isolated sections within each semiconductor area for device formation.
    • 公开了制造双取向晶片的方法。 在多层晶片中形成具有第一晶体取向的硅衬底的沟槽。 沟槽填充有硅材料(例如,非晶硅或多晶硅沟槽)。 形成隔离结构以将沟槽中的硅材料与具有第二晶体取向的半导体层隔离。 另外的隔离结构形成在沟槽内和半导体层内的硅材料内。 对沟槽中的硅材料进行图案化非晶化处理,然后进行再结晶退火,使得沟槽中的硅材料以与硅衬底相同的结晶取向重结晶。 所得到的结构是在具有不同晶体取向的同一平面上的隔离半导体区域以及用于器件形成的每个半导体区域内的隔离部分的半导体晶片。
    • 2. 发明授权
    • Method of manufacturing dual orientation wafers
    • 制造双取向晶圆的方法
    • US07799609B2
    • 2010-09-21
    • US11955436
    • 2007-12-13
    • Brent A. AndersonJohn J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • Brent A. AndersonJohn J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • H01L21/00H01L29/04
    • H01L21/823807H01L21/823878H01L21/8252
    • Disclosed is a method of manufacturing dual orientation wafers. A trench is formed in a multi-layer wafer to a silicon substrate with a first crystalline orientation. The trench is filled with a silicon material (e.g., amorphous silicon or polysilicon trench). Isolation structures are formed to isolate the silicon material in the trench from a semiconductor layer with a second crystalline orientation. Additional isolation structures are formed within the silicon material in the trench and within the semiconductor layer. A patterned amorphization process is performed on the silicon material in the trench and followed by a recrystallization anneal such that the silicon material in the trench recrystallizes with the same crystalline orientation as the silicon substrate. The resulting structure is a semiconductor wafer with isolated semiconductor areas on the same plane having different crystalline orientations as well as isolated sections within each semiconductor area for device formation.
    • 公开了制造双取向晶片的方法。 在多层晶片中形成具有第一晶体取向的硅衬底的沟槽。 沟槽填充有硅材料(例如,非晶硅或多晶硅沟槽)。 形成隔离结构以将沟槽中的硅材料与具有第二晶体取向的半导体层隔离。 另外的隔离结构形成在沟槽内和半导体层内的硅材料内。 对沟槽中的硅材料进行图案化非晶化处理,然后进行再结晶退火,使得沟槽中的硅材料以与硅衬底相同的结晶取向重结晶。 所得到的结构是在具有不同晶体取向的同一平面上的隔离半导体区域以及用于器件形成的每个半导体区域内的隔离部分的半导体晶片。
    • 3. 发明授权
    • High dynamic range imaging cell with electronic shutter extensions
    • 具有电子快门延伸功能的高动态范围成像单元
    • US07948535B2
    • 2011-05-24
    • US11948463
    • 2007-11-30
    • John J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • John J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • H04N3/14H04N5/335
    • H04N5/37452H04N5/35527H04N5/3559
    • A pixel sensor cell of improved dynamic range and a design structure including the pixel sensor cell embodied in a machine readable medium are provided. The pixel cell comprises a coupling transistor that couples a capacitor device to a photosensing region (e.g., photodiode) of the pixel cell, the photodiode being coupled to a transfer gate and one terminal of the coupling transistor. In operation, the additional capacitance is coupled to the pixel cell photodiode when the voltage on the photodiode is drawn down to the substrate potential. Thus, the added capacitance is only connected to the imager cell when the cell is nearing its charge capacity. Otherwise, the cell has a low capacitance and low leakage. In an additional embodiment, a terminal of the capacitor is coupled to a “pulsed” supply voltage signal that enables substantially full depletion of stored charge from the capacitor to the photosensing region during a read out operation of the pixel sensor cell. In various embodiments, the locations of the added capacitance and photodiode may be interchanged with respect to the coupling transistor. In addition, the added capacitor of the pixel sensor cell allows for a global shutter operation.
    • 提供了改进的动态范围的像素传感器单元和包括体现在机器可读介质中的像素传感器单元的设计结构。 像素单元包括将电容器器件耦合到像素单元的光敏区域(例如,光电二极管)的耦合晶体管,光电二极管耦合到传输栅极和耦合晶体管的一个端子。 在操作中,当光电二极管上的电压向下拉到衬底电位时,附加电容耦合到像素单元光电二极管。 因此,当电池接近其充电容量时,所添加的电容仅连接到成像器单元。 否则,电池具有低电容和低泄漏。 在另外的实施例中,电容器的端子耦合到“脉冲”电源电压信号,其在像素传感器单元的读出操作期间使存储的电荷从电容器到光敏区域基本上完全耗尽。 在各种实施例中,增加的电容和光电二极管的位置可以相对于耦合晶体管互换。 此外,像素传感器单元的附加电容允许全局快门操作。
    • 4. 发明授权
    • High dynamic range imaging cell with electronic shutter extensions
    • 具有电子快门扩展功能的高动态范围成像单元
    • US07719590B2
    • 2010-05-18
    • US11687245
    • 2007-03-16
    • John J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • John J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • H04N5/232
    • H01L27/14609H01L27/14643H01L27/14689H04N5/3559H04N5/37452
    • A pixel sensor cell of improved dynamic range comprises a coupling transistor that couples a capacitor device to a photosensing region (e.g., photodiode) of the pixel cell, the photodiode being coupled to a transfer gate and one terminal of the coupling transistor. In operation, the additional capacitance is coupled to the pixel cell photodiode when the voltage on the photodiode is drawn down to the substrate potential. Thus, the added capacitance is only connected to the imager cell when the cell is nearing its charge capacity. Otherwise, the cell has a low capacitance and low leakage. In an additional embodiment, a terminal of the capacitor is coupled to a “pulsed” supply voltage signal that enables substantially full depletion of stored charge from the capacitor to the photosensing region during a read out operation of the pixel sensor cell. In various embodiments, the locations of the added capacitance and photodiode may be interchanged with respect to the coupling transistor. In addition, the added capacitor of the pixel sensor cell allows for a global shutter operation.
    • 改进的动态范围的像素传感器单元包括将电容器器件耦合到像素单元的光敏区域(例如光电二极管)的耦合晶体管,光电二极管耦合到传输门和耦合晶体管的一个端子。 在操作中,当光电二极管上的电压向下拉到衬底电位时,附加电容耦合到像素单元光电二极管。 因此,当电池接近其充电容量时,所添加的电容仅连接到成像器单元。 否则,电池具有低电容和低泄漏。 在另外的实施例中,电容器的端子耦合到“脉冲”电源电压信号,其在像素传感器单元的读出操作期间使存储的电荷从电容器充分耗尽。 在各种实施例中,增加的电容和光电二极管的位置可以相对于耦合晶体管互换。 此外,像素传感器单元的附加电容允许全局快门操作。
    • 5. 发明申请
    • HIGH DYNAMIC RANGE IMAGING CELL WITH ELECTRONIC SHUTTER EXTENSIONS
    • 高动态范围成像电池与电子切换器扩展
    • US20090141155A1
    • 2009-06-04
    • US11948463
    • 2007-11-30
    • John J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • John J. Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • H04N3/14
    • H04N5/37452H04N5/35527H04N5/3559
    • A pixel sensor cell of improved dynamic range and a design structure including the pixel sensor cell embodied in a machine readable medium are provided. The pixel cell comprises a coupling transistor that couples a capacitor device to a photosensing region (e.g., photodiode) of the pixel cell, the photodiode being coupled to a transfer gate and one terminal of the coupling transistor. In operation, the additional capacitance is coupled to the pixel cell photodiode when the voltage on the photodiode is drawn down to the substrate potential. Thus, the added capacitance is only connected to the imager cell when the cell is nearing its charge capacity. Otherwise, the cell has a low capacitance and low leakage. In an additional embodiment, a terminal of the capacitor is coupled to a “pulsed” supply voltage signal that enables substantially full depletion of stored charge from the capacitor to the photosensing region during a read out operation of the pixel sensor cell. In various embodiments, the locations of the added capacitance and photodiode may be interchanged with respect to the coupling transistor. In addition, the added capacitor of the pixel sensor cell allows for a global shutter operation.
    • 提供了改进的动态范围的像素传感器单元和包括体现在机器可读介质中的像素传感器单元的设计结构。 像素单元包括将电容器器件耦合到像素单元的光敏区域(例如,光电二极管)的耦合晶体管,光电二极管耦合到传输栅极和耦合晶体管的一个端子。 在操作中,当光电二极管上的电压向下拉到衬底电位时,附加电容耦合到像素单元光电二极管。 因此,当电池接近其充电容量时,所添加的电容仅连接到成像器单元。 否则,电池具有低电容和低泄漏。 在另外的实施例中,电容器的端子耦合到“脉冲”电源电压信号,其在像素传感器单元的读出操作期间使存储的电荷从电容器到光敏区域基本上完全耗尽。 在各种实施例中,增加的电容和光电二极管的位置可以相对于耦合晶体管互换。 此外,像素传感器单元的附加电容允许全局快门操作。
    • 6. 发明申请
    • High Dynamic Range Imaging Cell With Electronic Shutter Extensions
    • 高动态范围成像电池与电子快门扩展
    • US20080224186A1
    • 2008-09-18
    • US11687245
    • 2007-03-16
    • John J Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • John J Ellis-MonaghanAlain LoiseauKirk D. Peterson
    • H01L31/113
    • H01L27/14609H01L27/14643H01L27/14689H04N5/3559H04N5/37452
    • A pixel sensor cell of improved dynamic range comprises a coupling transistor that couples a capacitor device to a photosensing region (e.g., photodiode) of the pixel cell, the photodiode being coupled to a transfer gate and one terminal of the coupling transistor. In operation, the additional capacitance is coupled to the pixel cell photodiode when the voltage on the photodiode is drawn down to the substrate potential. Thus, the added capacitance is only connected to the imager cell when the cell is nearing its charge capacity. Otherwise, the cell has a low capacitance and low leakage. In an additional embodiment, a terminal of the capacitor is coupled to a “pulsed” supply voltage signal that enables substantially full depletion of stored charge from the capacitor to the photosensing region during a read out operation of the pixel sensor cell. In various embodiments, the locations of the added capacitance and photodiode may be interchanged with respect to the coupling transistor. In addition, the added capacitor of the pixel sensor cell allows for a global shutter operation.
    • 改进的动态范围的像素传感器单元包括将电容器器件耦合到像素单元的光敏区域(例如光电二极管)的耦合晶体管,光电二极管耦合到传输门和耦合晶体管的一个端子。 在操作中,当光电二极管上的电压向下拉到衬底电位时,附加电容耦合到像素单元光电二极管。 因此,当电池接近其充电容量时,所添加的电容仅连接到成像器单元。 否则,电池具有低电容和低泄漏。 在另外的实施例中,电容器的端子耦合到“脉冲”电源电压信号,其在像素传感器单元的读出操作期间使存储的电荷从电容器充分耗尽。 在各种实施例中,增加的电容和光电二极管的位置可以相对于耦合晶体管互换。 此外,像素传感器单元的附加电容允许全局快门操作。
    • 9. 发明申请
    • Variable Focus Point Lens
    • 可变焦点镜头
    • US20110208482A1
    • 2011-08-25
    • US12708561
    • 2010-02-19
    • John J. Ellis-MonaghanJeffrey P. GambinoKirk D. PetersonJed H. Rankin
    • John J. Ellis-MonaghanJeffrey P. GambinoKirk D. PetersonJed H. Rankin
    • G06F17/50G02B3/12
    • G02B3/14
    • A variable focal point lens includes a transparent tank, which comprises a transparent enclosure containing a transparent flexible membrane separating the inner volume of the transparent tank into an upper tank portion and a lower tank portion. The upper tank portion and the lower tank portion contain liquids having different indices of refraction. The transparent flexible membrane is electrostatically displaced to change the thicknesses of the first tank portion and the second tank portion in the path of the light, thereby shifting the focal point of the lens axially and/or laterally. The electrostatic displacement of the membrane may be effected by a fixed charge in the membrane and an array of enclosure-side conductive structures on the transparent enclosure, or an array of membrane-side conductive structures on the transparent membrane and an array of enclosure-side conductive structures.
    • 可变焦点透镜包括透明容器,透明容器包括透明的外壳,该透明外壳包含将透明容器的内部容积分隔成上部容器部分和下部容器部分的透明柔性膜。 上罐部分和下罐部分含有不同折射率的液体。 透明柔性膜被静电移位以改变光路中的第一罐部分和第二罐部分的厚度,从而轴向和/或横向地移动透镜的焦点。 膜的静电位移可以通过膜中的固定电荷和透明外壳上的封闭侧导电结构阵列,或透明膜上的膜侧导电结构阵列和外壳侧阵列 导电结构。