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1. 发明申请

US20060048932A1 Configurable heat sink 审中-公开
标题翻译：可配置散热器
公开(公告)号：US20060048932A1
公开(公告)日：2006-03-09
申请号：US10937567
申请日：2004-09-09
申请人： Brandon Rubenstein , Stephan Barsun , Christian Belady , Gregory Huff , Christopher Malone , Roy Zeighami
发明人： Brandon Rubenstein , Stephan Barsun , Christian Belady , Gregory Huff , Christopher Malone , Roy Zeighami
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Systems, methodologies, media, and other embodiments associated with a configurable heat sink are described. One exemplary system embodiment includes a base portion of a heat sink to which different accessories may be removably attached. The example system may include a first accessory like a cover that forms an assembly with the base portion of the heat sink and causes the assembly to operate in a first manner.
摘要翻译：描述了与可配置散热器相关联的系统，方法，介质和其他实施例。一个示例性系统实施例包括散热器的基座部分，不同的附件可以可移除地附接到散热器。示例性系统可以包括类似于盖的第一附件，其形成具有散热器的基部的组件，并使组件以第一方式操作。

2. 发明申请

US20050207115A1 Heat dissipating arrangement 审中-公开
标题翻译：散热布置
公开(公告)号：US20050207115A1
公开(公告)日：2005-09-22
申请号：US10803399
申请日：2004-03-18
申请人： Stephan Barsun , Christian Belady , Roy Zeighami , Christopher Malone
发明人： Stephan Barsun , Christian Belady , Roy Zeighami , Christopher Malone
IPC分类号： G06F1/20 , H01L23/367 , H01L23/427
CPC分类号： H05K7/20727 , G06F1/20 , H01L23/367 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating arrangement includes a first heat emitting device, a second heat emitting device, and a heat sink thermally coupled to the first heat emitting device and extending on opposite sides of the second heat emitting device.
摘要翻译：散热装置包括第一发热装置，第二发热装置和热耦合到第一发热装置并在第二发热装置的相对侧上延伸的散热器。

3. 发明申请

US20060169438A1 Thermally conductive cover directly attached to heat producing component 审中-公开
标题翻译：导热盖直接连接在发热部件上
公开(公告)号：US20060169438A1
公开(公告)日：2006-08-03
申请号：US11046616
申请日：2005-01-28
申请人： Christopher Malone , Stephan Barsun
发明人： Christopher Malone , Stephan Barsun
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the apparatus may have: thermally conductive cover coupled to the heat producing component via a single interface; and cooling liquid in direct contact with the thermally conductive cover. One embodiment of the method may have the steps of: coupling a thermally conductive cover to the component via a single interface; and applying a cooling liquid to the thermally conductive cover to cool the component
摘要翻译：该装置的一个实施例可以具有：导热罩，其经由单个接口耦合到发热部件; 以及与导热盖直接接触的冷却液。该方法的一个实施例可以具有以下步骤：通过单个界面将导热盖耦合到部件; 以及将冷却液施加到所述导热盖以冷却所述部件

4. 发明申请

US20050243517A1 High serviceability liquid cooling loop using tubing hinge 失效
标题翻译：使用管道铰链的高维修性液体冷却回路
公开(公告)号：US20050243517A1
公开(公告)日：2005-11-03
申请号：US10835961
申请日：2004-04-29
申请人： Christopher Malone , Glenn Simon , Stephan Barsun
发明人： Christopher Malone , Glenn Simon , Stephan Barsun
IPC分类号： G06F1/20 , F16L27/08 , H01L23/473 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： A cylindrical tubing hinge extends around and couples two segments of rigid or semi-rigid tubing and enables rotational motion of one segment relative to the other.
摘要翻译：圆柱形管铰链围绕并连接两段刚性或半刚性管道并且使一个段相对于另一段能够旋转运动。

5. 发明申请

US20050239314A1 Shroud for pin and socket connection 失效
标题翻译：针脚和插座连接的护罩
公开(公告)号：US20050239314A1
公开(公告)日：2005-10-27
申请号：US10832673
申请日：2004-04-27
申请人： Christopher Malone , Stephan Barsun
发明人： Christopher Malone , Stephan Barsun
IPC分类号： H01R33/76 , H01R4/50 , H01R12/16 , H01R13/631 , H01R31/06
CPC分类号： H01R12/7076 , H01R31/06
摘要： A shroud for interacting with a circuit component defining a component surface having an array of pins extending from the component surface. The shroud includes a planar member defining an array of apertures complimenting the array of the pins. The planar member is configured to interact with the circuit component to maintain uniform contact between the pins and a corresponding socket.
摘要翻译：用于与限定具有从部件表面延伸的销阵列的部件表面的电路部件相互作用的护罩。护罩包括限定孔的阵列的平面构件，所述孔的阵列与销的阵列相匹配。平面构件被配置为与电路部件相互作用以保持销和相应插座之间的均匀接触。

6. 发明申请

US20050241799A1 High serviceability liquid cooling loop using flexible bellows 有权
标题翻译：高可维修性液体冷却回路采用柔性波纹管
公开(公告)号：US20050241799A1
公开(公告)日：2005-11-03
申请号：US10837459
申请日：2004-04-29
申请人： Christopher Malone , Glenn Simon , Stephan Barsun
发明人： Christopher Malone , Glenn Simon , Stephan Barsun
IPC分类号： F25D17/02 , F25B21/02 , F25D9/00 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： H05K7/20727 , G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one flexible bellows coupled to the tubing and flexibly enabling movement of the moveable cold plate.
摘要翻译：液体循环冷却装置包括封闭冷却流体可在其中循环的内孔或内腔的管道，刚性地联接到管道的可移动冷板以及耦合到管道的至少一个柔性波纹管，并且能够灵活地实现可移动冷板的移动。

7. 发明申请

US20080011459A1 Thermally conductive cover directly attached to heat producing component 审中-公开
标题翻译：导热盖直接连接在发热部件上
公开(公告)号：US20080011459A1
公开(公告)日：2008-01-17
申请号：US11880651
申请日：2007-07-23
申请人： Christopher Malone , Stephan Barsun
发明人： Christopher Malone , Stephan Barsun
IPC分类号： H05K7/20 , F28D1/04
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the apparatus may have: thermally conductive cover coupled to the heat producing component via a single interface; and cooling liquid in direct contact with the thermally conductive cover. One embodiment of the method may have the steps of: coupling a thermally conductive cover to the component via a single interface; and applying a cooling liquid to the thermally conductive cover to cool the component
摘要翻译：该装置的一个实施例可以具有：导热罩，其经由单个接口耦合到发热部件; 以及与导热盖直接接触的冷却液。该方法的一个实施例可以具有以下步骤：通过单个界面将导热盖耦合到部件; 以及将冷却液施加到所述导热盖以冷却所述部件

8. 发明申请

US20060171122A1 Socket adapted for compressive loading 失效
标题翻译：插座适用于压缩载荷
公开(公告)号：US20060171122A1
公开(公告)日：2006-08-03
申请号：US11046452
申请日：2005-01-28
申请人： Christopher Malone , Stephan Barsun
发明人： Christopher Malone , Stephan Barsun
IPC分类号： H05K7/20
CPC分类号： H05K7/1061 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01R43/0249 , H01R43/0263 , H01L2924/00
摘要： A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold the Socket BGA to the circuit substrate with a compressive load isolated from the heat sink.
摘要翻译：球栅阵列（BGA）插座适于接收和电连接到设置在电路基板和散热器之间的集成电路。连接元件适于将插座BGA保持到具有与散热器隔离的压缩负载的电路基板。

9. 发明申请

US20050241803A1 Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation 审中-公开
标题翻译：液体冷却回路使用油管和波纹管进行应力隔离和公差变化
公开(公告)号：US20050241803A1
公开(公告)日：2005-11-03
申请号：US10837466
申请日：2004-04-29
申请人： Christopher Malone , Glenn Simon , Stephan Barsun
发明人： Christopher Malone , Glenn Simon , Stephan Barsun
IPC分类号： F25D17/02 , F25D9/00 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： A liquid loop cooling apparatus includes rigid or semi-rigid tubing enclosing an interior bore or lumen within which a cooling fluid can circulate among at least one heat-generating component in a closed-loop system. The liquid loop cooling apparatus also includes at least one flexible bellows coupled to the tubing that isolates physical stresses along the tubing.
摘要翻译：液体回路冷却装置包括封闭内孔或内腔的刚性或半刚性管，冷却流体可以在其内在闭环系统中的至少一个发热部件之间循环。液体回路冷却装置还包括耦合到管道的至少一个柔性波纹管，其沿着管道隔离物理应力。

10. 发明申请

US20070213881A1 Liquid cooling of electronic device environments 审中-公开
标题翻译：电子设备环境的液体冷却
公开(公告)号：US20070213881A1
公开(公告)日：2007-09-13
申请号：US11370448
申请日：2006-03-08
申请人： Christian Belady , Christopher Malone
发明人： Christian Belady , Christopher Malone
IPC分类号： G05D23/00
CPC分类号： G05D23/19
摘要： In one embodiment, a system comprises one or more electronic components, one or more coolant sources, one or more coolant supply lines in fluid communication with the one or more coolant sources, a heat exchanger in thermal communication with the coolant supply lines and the one or more electronic components; one or more coolant distribution units to regulate the flow of coolant through the one or more coolant supply lines, and an environment management unit communicatively coupled to the one or more electronic components and the one or more coolant distribution units, wherein the environment management unit regulates coolant flow through the one or more coolant supply lines according to one or more environmental parameters proximate the one or more electronic components.
摘要翻译：在一个实施例中，系统包括一个或多个电子部件，一个或多个冷却剂源，与一个或多个冷却剂源流体连通的一个或多个冷却剂供应管线，与冷却剂供应管线热连通的热交换器或更多的电子元件; 一个或多个冷却剂分配单元，用于调节通过所述一个或多个冷却剂供应管线的冷却剂的流动;以及环境管理单元，其通信地联接到所述一个或多个电子部件和所述一个或多个冷却剂分配单元，其中所述环境管理单元调节冷却剂根据靠近所述一个或多个电子部件的一个或多个环境参数流过所述一个或多个冷却剂供应管线。

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